EIPC Speednews: News from the European PCB Industry

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News from EIPC

- EIPC Workshop on 'Reliability' @ Würth Elektronik GmbH & Co. KG on December 9

News from the UK

- ICT Evening Seminar at the St Georges Hotel, Darlington, November 24

- Wirebonding Workshop, December 3

News for Productronica

- Ventec International Presents Advanced Laminate Technology at productronica 2015

- The SCHMID Group Introduces its Innovative Module Line Generation Infinity Line and the New Etching Options (NEO) at productronica 2015

- JTAG Technologies Inside - The Future of Your ATE Application with Boundary-scan

- Viking Delighted to Once Again be Exhibiting at productronica

News from WECC members

- CCCMC and the OECD Draft Guidelines for Responsible Mineral Supply Chains in China

- Webinar: REACH Articles Update

- IPC APEX EXPO Keynote Presentations Cover Innovations, Inventions and the Rise of Warbots

Click here for the International Events Diary 2015 

Click here to download the complete SpeedNews Issue 30



Suggested Items

Alun Morgan on the Future of PCB Materials

05/16/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

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