i3 Electronics to Exhibit at SC15


Reading time ( words)

i3 Electronics, Inc. (i3) will be exhibiting at SC15, which will be held at the Austin Convention Center in Austin, Texas November 16-19.

“i3 Electronics is a world-class supplier of high performance computing design and manufacturing services. Exhibiting at this show is essential for us as a means of showcasing our technology and expertise”, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

i3 will be presenting “High Performance Compute Cluster Constructed With High Density Rigid-Flex Based Modules” from 4:00-4:30 PM on 11/17 in 12AB

i3 will be in booth #2802

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit, www.i3electronics.com.

Share

Print


Suggested Items

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Staying Current on Flex Manufacturing is Smart Business

04/04/2019 | Barry Matties, I-Connect007
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.

TTM on Flex and Rigid-flex PCB Challenges

03/20/2019 | Barry Matties, I-Connect007
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.



Copyright © 2019 I-Connect007. All rights reserved.