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During productronica, European Editor Pete Starkey interviewed Engineering/Quality Manager John Wright of Arlon. They discussed Arlon’s new 85HP ceramic-filled polyimide, as well as a non-woven aramid material, suitable for space applications, that is a drop-in replacement for a similar material discontinued by a competitor in 2006.
To watch this interview, click here.
I-Connect007 Editorial Team
We’re seeing all sorts of interesting tactics for dealing with 50-week lead times. One of the most basic concepts that we’ve heard about lately is material conservation—why not just design PCBs with fewer parts? As we point out in this issue, sometimes less is more. Our experts share a variety of strategies and technologies to help reduce your overall material consumption, allowing you to lower costs and add competitive advantage.
Didier Mauve and Robert Art, Ventec
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.
Pete Starkey, I-Connect007
Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.