-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Cicor Group Unveils Strategic Priorities
November 24, 2015 | CicorEstimated reading time: 2 minutes
Cicor, a high-tech industrial group and international leader in the areas of printed-circuit boards, microelectronics and electronic solutions, with headquarters in Boudry (Switzerland), is taking targeted measures for the strategic orientation of the Group. The Group will differentiate itself even more from the competition through "leading edge" technologies and comprehensive manufacturing services (box building) in strongly growing niches and segments. In future, the Group aims to generate an EBITDA margin over 10%. The first measures for improving profitability have already been taken.
The Cicor Group has strengthened its technology sector and services portfolio, so that customers can use the existing and expanded services in the development of innovative products and applications in an even more targeted manner. Thanks to technological advances and comprehensive service packages right up to "box building," the Group is now taking on a clear pioneering role and has established itself as "the preferred innovation partner." Together with their customers, the Group will also focus more on the development and manufacture of their products and applications with generally more complex projects.
Measures have already been taken to improve profitability and achieve the envisaged EBITDA margin. Two Swiss printed-circuit board productions sites belonging to the AMS Division (Moudon and Boudry) have therefore been merged. The merger of the sites will improve the efficiency of production and so offers clear advantages for customers. Cicor Group has also decided to merge the ES Division’s customer care operation in Switzerland from its previous two locations into one joint location and to relocate the Ticino sales office in Quartino to the ES Division's head office in Bronschhofen. Future interfaces and weak points can be reduced due to the concentration of both sites and customers can be provided with more efficient and effective support.
The Group will also achieve additional growth by reinforcing the international sales organisation.
In Eastern Europe, production capacities in Arad, Romania will be doubled by a new construction at the end of 2016, which will increase the value-added share generated outside Switzerland. A new competence center is currently being built in Bronschhofen, Switzerland, which will allow for powerful development, modern production and administration. Accordingly, the Group management will be located at this site from August 2016.
As well as the planned organic growth, M&A projects which will lead to sales growth and improved profitability remain in focus.
Outlook
The Group will generate profitable growth from 2016 onwards.
About Cicor
Cicor is a globally active group of leading companies in the electronics industry. It is organized in two divisions: Advanced Microelectronics & Substrates (AMS) and Electronic Solutions (ES). The Group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids and electronic modules. With around 1,950 employees at eleven production sites worldwide, the Group supplies high-quality customized solutions to clients in Europe, the US and Asia. The shares of Cicor Technologies Ltd. are listed on the SIX Swiss Exchange (CICN).
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.