Navigating the Global Materials Supply Chain: A Roundtable Discussion


Reading time ( words)

At SMTAI recently, I sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group, responsible for all non-agent activity and the supply, distribution and service centers in the U.S. and Europe; and Jack Pattie, president of Ventec USA and as such, manager of North American operations for the distribution of laminate and pre-preg. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen, head of the Germany-based company that has been producing PCBs for more than 50 years and specializes in rigid-flex and flex activities, and Bob Willis, from the National Physics Laboratory (NPL), known worldwide for measuring standards. In a wide-ranging chat, we discussed the demands and challenges of the materials supply chain and where they see their industry going in the future.

ventec2.JPG

Share

Print


Suggested Items

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.



Copyright © 2019 I-Connect007. All rights reserved.