IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards


Reading time ( words)

Packaged Electronic Components

The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of 3-D Components. There has been significant interest in this standard from both the military and commercial markets, and the subcommittee is ensuring groups doing similar work are included in the efforts for IPC-7091.

Flexible Circuits

The D-11 Flexible Circuits Design Subcommittee met to advance the Working Draft to IPC-2223D, Sectional Design Standard for Flexible Printed Boards. The group reviewed and approved new drawings depicting flexible cross-sectional construction examples and unbonded flex cross-sectional constructions for rigid-flex designs.  The group also reviewed new content addressing the factors that affect impedance and capacitance control for flex and rigid-flex printed board applications so as to mitigate signal integrity issues.

The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group also reviewed a cross-sectional illustrations that address voiding or delamination in the transition zone between flexible material and rigid material. The group also reviewed examples of anomalies in flexible printed board assemblies (e.g. kinks in the ribbon cable following assembly operations) and agreed to submit recommendations to the IPC 7-31b task group for addressing these issues in a future revision to IPC-A-610, Acceptability of Electronic Assemblies.

The D-13 Flexible Circuits Base Materials Subcommittee began review and updating of IPC-4202A to ultimately revise it to B revision.

The D-15 Flexible Circuits Test Methods Subcommittee began to review all flexible circuits test methods for relevance to all materials, printed boards and design standards.   Most if not all test methods that apply to old flexible circuits (those that begin with “FC” are likely to be obsolete and will likely be archived.

Share




Suggested Items

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/22/2022 | Andy Shaughnessy, I-Connect007
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication, and assembly communities. The roller coaster ride continues, with whiplash-inducing news from IPC about March North American shipment—they’re up from February but down from the same period a year ago.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/15/2022 | Nolan Johnson, I-Connect007
Welcome to April 15, everyone! There are reasons we tend to cover topics in a continuous conversation. First, there are always developments and news in the industry. Second, you dear readers respond to that content by reading it. This week the news items that drew the most reader interest verify that our industry has ongoing interest in government involvement in industry infrastructure, supply chain issues, cybersecurity, and new technologies like additive in fabrication.



Copyright © 2022 I-Connect007. All rights reserved.