Most-Read PCB Design Articles of 2015


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EchoStar’s Les Beller Shares the PCB Design-to-Fab Process

Recently, Barry Matties had the opportunity to meet and interview Les Beller of EchoStar Technologies. In this interview, Beller focuses on the many challenges circuit board designers face, strategies for bridging the gap between circuit design and fabrication, and the future of circuit designers.

Beyond Design: The Plain Truth About Plane Jumpers

Moats, islands, cut-outs in the ground plane, isolated power planes, floating ground regions, and a host of other intricate layout techniques are often used by PCB designers to reduce crosstalk, EMI, and to otherwise improve overall system performance. But a high-speed signal crossing a split in the plane causes problems along at least three dimensions, including signal quality, crosstalk, and EMI.  Barry Olney explains. 

Cadence’s Brad Griffin Digs Deep Into DDR

Guest Editor Kelly Dack stopped by the Cadence Design Systems booth at DesignCon 2015, where he sat down with Product Marketing Manager Brad Griffin to discuss Cadence’s advanced PCB design and signal integrity tools, and the company’s focus on DDR.

Trending at Freedom CAD: New Crop of Next‐Gen Designers

Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.

Material Witness: Low-Flow Prepregs–Defining the Process

Let’s try to define “low flow” in terms that will make sense to both suppliers and users of the products.  A low-flow prepreg is a prepreg that flows sufficiently to wet out and adhere to bonding surfaces and to fill inner layer copper details, but does not flow so much as to fill in cut-out areas in a heat sink or run unevenly out of the interface between rigid and flexible elements of a rigid-flex PWB.

Make the Right Decisions at the Right Time in the PCB Design Process

Martin Cotton of Ventec explains why the right decisions are not always the easiest decisions, but making them well and as early as possible often avoids errors and addition costs. This is certainly the case in PCB design and a key decision influencing the design process and the eventual outcome is the selection of material and of the materials vendor.   

Nick Barbin: From Designer to EMS Company Owner

Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. I caught up with Nick recently and asked him how he wound up leading an EMS company on the Inc. 5000 list.

Broadcom PCB Design: Miniaturization on the Cutting Edge

Andy Shaughnessy recently attended the Orange County Designer's Council “Lunch and Learn” meeting, held at the Broadcom offices on the campus of the University of California, Irvine. Afterward, he sat down with Scott Davis, CID, the senior manager of PC board design at Broadcom, to discuss the company’s savvy PCB design department and their approach to PCB design.

Max Maxfield Looks at the Future of Electronics

Clive "Max" Maxfield has worked for decades in this industry, and in a variety of capacities: Engineer, author, editor, columnist, blogger, and keynote speaker. Editor Andy Shaughnessy caught up with his former columnist recently and asked him what he'd been doing to stay out of trouble, and what sort of technology and futuristic electronic gadgets were piquing his interest now. 

Ten Considerations for Outsourcing PCB Designs

Outsourcing your design work is a big deal. How do you know that the end-result will be as you envisaged? Will you have full control of your design? Will it be done to the quality you expect and within the time frame required? Outsourcing can pose some fairly scary questions, so what are the key things to consider and what are the pitfalls to avoid?

 

 

 

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Designing in a Vacuum Q&A: Carl Schattke

05/11/2022 | Andy Shaughnessy, Design007 Magazine
Not long ago, I caught up with Carl Schattke, CEO of PCB Product Development LLC and a longtime PCB designer, for his thoughts on “designing in a vacuum.” As Carl points out, if you follow PCB design best practices, knowing the identity of your fabricator is not a “must-have.” He also offers some communication tips for discovering the information you do need, including one old-fashioned technique—just asking for it.

Additive Manufacturing Requires Additive Design Techniques

05/09/2022 | Luca Gautero, SUSS MicroTec
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

Designing PCBs With Additive Traces

04/28/2022 | Tomas Chester, Chester Electronic Design
Advances in technology have been clear to see within the component packaging industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. However, while these improvements have occurred with component packages, it has become increasingly more difficult to break out and route the dense circuitry associated with these parts. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the innerlayers of your PCB.



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