2015’s Most Read PCB News Items


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Infineon Acquires 9.4% Stake in Schweizer Electronic

By investing into Schweizer, Infineon emphasizes its intention to jointly develop technologies for the integration of power semiconductors into PCBs and to tap the chip embedding market for high-power automotive and industrial applications.

Lenthor Achieves ISO 9001:2008 Re-certification

Lenthor Engineering, Inc. has successfully completed its corporate ISO 9001:2008 re-certification.  The re-certification audit was performed at lenthor’s new 55k sq/ft corporate facilities in Milpitas, CA.

Isola Unveils New Technical Education Series

Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit Boards (PCBs), today announced the launch of a new technical education Series (TES) to address the increasingly important role of laminate materials in the overall process of system-level design.

N.A. PCB Book-to-Bill Ratio Strengthens

“Although North American PCB sales continued slightly below last year’s levels in February, bookings strengthened,” said Sharon Starr, IPC’s director of market research, “This increased the bookto-bill ratio,” she added. “The ratio has been in positive territory for the past five months, which is a positive indicator for sales growth in the first half of 2015.”

Invotec Acquisition Strengthens Amphenol’s Global Capabilities

The acquisition of Invotec, one of the global leaders in flex and flex-rigid PCB manufacturing, strengthens Amphenol’s global capabilities and product offering in the defense, industrial and aerospace industries.

Sparton Acquires Hunter Technology Corporation

Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.

Key PCB Makers Strategize to Meet Industry Demands

The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Top industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.

Isola’s New Laminate Mitigates Skew in High Speed Designs

Isola Group today announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs.

IPC Honors Volunteers for Contributions to the Industry

IPC presented committee leadership, distinguished committee Service, and Special recognition awards at IPC APEX EXPO at Mandalay Bay convention center in Las Vegas, Nevada. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

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Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.



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