Nano Dimension Files Patent for Printing Multimaterial 3D Objects


Reading time ( words)

Nano Dimension, a leading printing electronics company in the area of 3D printing, announced today that Nano Dimension Technologies, a fully owned subsidiary of Nano Dimension, has filed a patent application with the U.S. Patent and Trademark Office for the printing of 3D models, which includes electronic conductors.

The company has developed an innovative approach to print objects in 3D that contain conductive traces – a process the new patent would cover. Nano Dimension was able to make this new technological development as a result of its work developing materials and 3D printers for multilayer PCB prototyping.

The sintering of a printed metal conductor within a 3D printed polymer allows for complex connectors to be 3D printed and also makes it possible to 3D print molded connectors directly onto electronic circuits. The newly developed process may also be applied to 3D printing of non-flat electronic circuits as well as structural objects with embedded electronic circuits.

The materials and processes required for 3D printing objects containing semiconductors may result in a significant breakthrough for the industry, enabling the creation of freeform electronic products that cannot be created using current circuit manufacturing technologies.

About Nano Dimension

Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.

Share

Print


Suggested Items

RTW IPC APEX EXPO: Orbotech West on Supporting Customer Needs

04/19/2019 | Real Time with...IPC
Orbotech West President Sharon Cohen speaks with Kelly Dack about Orbotech West’s restructuring to better support customer needs, their customer monitoring center, and hints at the capabilities of new products coming soon.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Trump Administration can Ease EPA Reporting Burden for Electronics Industry

02/27/2019 | Chris Mitchell, IPC VP, Global Government Relations
The finish line may be in sight in a decade-long effort to persuade the U.S. Environmental Protection Agency (EPA) to curb unnecessary and duplicative Toxic Substances Control Act (TSCA) reporting requirements that discourage recycling of manufacturing byproducts.



Copyright © 2019 I-Connect007. All rights reserved.