Calumet Electronics Takes Service to the Next Level with DFM Automation


Reading time ( words)

PCBs are more complex and high-tech than ever. For example, current component density propels circuit board compression and complex design attributes, which elevate the potential for failure and downtime. By implementing sophisticated design for manufacturability (DFM) checks early in the PCB design phase, Calumet Electronics saves customers from costly, time-consuming problems that would manifest during prototyping and production.

DFM validates design integrity and reveals constraints in order to optimize yields, minimize surprises and facilitate program deadlines. All of this is critical to promote first pass success of advanced PCB designs. The use of DFM can reveal design flaws early in the process to rectify limitations or constraints. DFM also preempts lackluster yields and predicts product failure. An endless variety of suspect design features that may threaten product integrity are also revealed by DFM. Potential defects may include copper to copper density, hole to pad, drill to plane layer, improper material or stack-up specification, plating aspect ratio, blind or buried via configuration, and many more.

“Potential defects and design constraints are very common in PCB design,” said Mike Kadlec, vice president of corporate development. “Component architecture, product compression and limited real estate contribute to design complexity and routing constraints, driving the potential for failure and the subsequent need for preemptive analysis and collaboration. The DFM tools and related automation at Calumet set the stage to minimize surprise and ensure the desired outcome.”

According to David Cusumano, vice president of operations for Saline Lectronics, Inc., “Calumet Electronics goes the extra mile with their DFM checks, supporting our engineering team to actualize DFM suggestions in real time. Their skilled engineering team, DFM automation, and communication style foster and contribute to timely resolution of outstanding issues. The Calumet team takes the time to fully understand our manufacturing processes, which has made them an invaluable partner to us."

Share




Suggested Items

Preventing De-wetting Defects In Immersion Tin Soldering

01/04/2023 | Britta Schafsteller, Atotech
Immersion tin is well accepted as a high-reliability final finish in the industry. Due to its excellent corrosion resistance, it exhibits major market shares, particularly in the automotive industry. During the soldering process, an intermetallic compound (IMC) is formed between copper and tin. One remaining concern in the industry is the potential impact of the IMC on the solderability of the final finish. In this article, typical failure modes in soldering immersion tin are described and correlated to potential root causes for the defects.

Candor: UHDI Under Development

12/21/2022 | Nolan Johnson, I-Connect007
Candor Industries is a PCB fabricator investing in UHDI fabrication capabilities in Canada. To support advanced packaging, as well as the current pace of IC process shrinks, PCB fabrication capabilities must shrink to keep up. Sunny Patel, Candor’s technical sales manager, brings us up to speed on what Candor has learned in their journey to add UHDI. What we gain from this interview is that, while certainly not insignificant, the stretch to add UHDI may be not as far as one might think.

MKS Discusses the Cutting Edge of Technology

12/20/2022 | Nolan Johnson, I-Connect007
During a recent tour of the MKS facility in Beaverton, Oregon, I met with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick. As a reminder, MKS acquired ESI in 2019 and has retained the ESI brand. In this interview, they explain their approach to HDI and ultra HDI, the current state of base materials, and what the future looks like on the cutting edge of technology.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.