Cirexx Develops ECLIPS Demonstration Module


Reading time ( words)

Cirexx International announced today that they have developed a module to demonstrate their ECLIPS technology. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics and a very low-CTE.

The Cirexx ECLIPS technology serves as an alternative to co-fired ceramics and hybrid integrated circuits. The item is essentially a common Printed Circuit Board, made from otherwise typical RF/microwave Printed Circuit Board materials and processes. But with a high thermal conductivity and very low CTE the user can mount very fine pitch devices and in fact direct attach/wire-bond bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This combination results in an electronic board system that is smaller, lighter weight, easier to make revisions to and certainly much less costly than the ceramic hybrid, all-die alternative.

The demonstration module allows Cirexx Application Engineers to demonstrate the technology at customer facilities and/or during ECLIPS presentations. With the use of common lab equipment the module demonstrates the efficient evacuation of heat generated by 2 bare die amplifiers and its effect on the power output. Cirexx President and CEO Philipp Menges said, “This Demo Module is another tool available to help our customers understand and evaluate the ECLIPS technology.”

About Cirexx International

Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Design, PCB Fabrication and PCB Assembly of high-reliability Printed Circuit Boards, RF/Microwave Circuit Boards, Flexible Printed Circuits and Rigid-Flex Circuit Boards. Recognized as a time-technology leader, the company offers a genuine Quick Turn service and provides a one stop shop and all in-house solution known as Seamless Integration. Cirexx has expertise fabricating high layer count Printed Circuit Boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation.

Share




Suggested Items

Setting Expectations for IPC APEX EXPO's Women in Electronics Reception

01/18/2023 | Alicia Balonek, IPC
Emily Calandrelli, IPC APEX EXPO’s opening keynote speaker and featured speaker of our Women in Electronics Reception, is an MIT-engineer turned Emmy-nominated science TV host. She’s the host and co-executive producer of “Emily’s Wonder Lab” on Netflix, she's featured as a correspondent on Netflix’s “Bill Nye Saves the World” and an executive producer and host of FOX's “Xploration Outer Space.”

Reconnecting the Social Network

12/29/2022 | Alicia Balonek, IPC
If the past two years have emphasized anything, it would be the importance and value of face-to-face networking at events. Face-to-face interactions help create lasting relationships with new connections and help strengthen existing relationships with industry friends and colleagues. Thousands of industry leaders, manufacturing innovators, and subject matter experts from across the globe will convene in San Diego for IPC APEX EXPO 2023, making it the place to be to help you connect with representatives from the entire electronics manufacturing supply chain. We have a full line-up of networking events planned for IPC APEX EXPO 2023 that you don’t want to miss.

Let’s Get Technical

12/27/2022 | Julia Gumminger, IPC
IPC members are constantly working to move the electronics industry forward by developing new technologies, innovative processes, and testing methods—and working to find solutions to known technical challenges. The IPC APEX EXPO Technical Conference is the premier forum in North America where these challenges, solutions, and innovations are shared among colleagues and competitors alike.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.