New Material and Process Solutions for the Electronic Interconnection Industry

Reading time ( words)


The manufacture of electronics has, for the last several decades, followed a production script that has changed little over time. The vast majority of printed circuits are still being manufactured and assembled using materials and processes that the pioneers of the early printed circuit industry would easily recognize. The primary reason is that most circuit design practices are deeply rooted and tied to traditional manufacturing methods. However, these methods are not the only ones that can be used to manufacture and assemble printed circuits today. In fact, it is arguable that traditional methods are not as well-suited to the manufacture of today’s more challenging product designs. This is a fact that has not been lost on Japanese product engineers. Over the last nearly two decades, they have conceived of and reduced to practice a number of unique methods for making high-density interconnection product. One of the important keys to making this possible has been the development of materials uniquely designed and structured to filling special needs of these advanced circuit designs.

Though perhaps not a household name, 70-year-old Tatsuta Electric Wire & Cable Co., Ltd. has been at the forefront of the development of such materials for many years. As the name implies, the company was originally focused on providing wire and cabling solutions for the electrical and electronics industries. However, realizing that the scope of their business extended beyond wire harnesses and cables, the company began to develop materials suited to the needs of printed wiring manufacturers and assemblers. This article has been prepared to familiarize the readers of this esteemed electronics publication of some of the new material and process solutions the company has developed and is making available to the industry.

Read the full article here.

Editor's Note: This article originally appeared in the February 2016 issue of The PCB Magazine


Suggested Items

Review: Institute of Circuit Technology 2022 Annual Symposium

06/15/2022 | Pete Starkey, I-Connect007
The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/27/2022 | Nolan Johnson, I-Connect007
I know I’m not alone in this behavior: Car advertisements during television commercial breaks are as good as invisible to me, until I’m thinking about getting a new car. Only then do I notice them. Rather, I see each one with all my attention and being. If that extends into our industry, then everybody must be itching to pick up some new equipment. This week’s must-reads includes a smattering of new product announcements, along with the news of the IPC European subsidiary.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.

Copyright © 2022 I-Connect007. All rights reserved.