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The second annual CES Asia in Shanghai, China concluded on May 13, surpassing last year’s event by all measures and reinforcing the show as the premier platform for launching technology in the Asian marketplace. More than 375 companies from 23 countries exhibited across a show floor that spanned 32,000 square meters—expanded from two exhibit halls last year to four this year.
I spent one day at the show and saw a lot of interesting stuff there: robots, automotive electronics, drones, 3D printers, wearable electronic devices, VR, 4K, etc.
Huawei was the only big name from the cellphone market who exhibited; their booth was packed. According to the latest news, Huwaei is becoming the biggest cellphone supplier in the world. This year will be a very important and tough one for most of these smartphone suppliers.
As you can see from my short video tour, there are some new electronics out there that will draw your attention. However, it's hard to predict which one will be the next booming market.
Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.
Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.