LPKF Exhibits New Laser Solutions for Innovative Interconnects at ECTC in Las Vegas

Reading time ( words)

LPKF Laser & Electronics has announced it will exhibit at the 2016 Electronic Components and Technology Congerence (ECTC) which will be held June 1-2, 2016 at The Cosmopolitan in Las Vegas, NV.

LPKF, a leading manufacturer of laser systems for electronics manufacturing, will showcase its new solutions across the semiconductor packaging spectrum in booth 320.
One of the technologies highlighted by LPKF is the efficient via forming in large glass substrates (TGV); a process of creating through holes and blind vias, with defined diameters as small as 15 microns, using single-pulse glass modification through laser beam in combination with subsequent a standard wet etching process. Glass substrates with a thickness of 50 to 500 micron can be processed with this method. Clean-room compatibility and stress-free processing make this innovative laser-based process ideal for thin glass interposers and also for solid glass cores for FCBGA substrates – eliminating chips, burr, micro-cracks or voids.

LPKF has developed the new Vitrion laser system specifically developed for these applications. The system is designed for high volume mass production, capable of forming more than 5,000 homogeneous vias per second.

Another technology represented at the ECTC Conference will be Laser Direct Structuring (LDS-technology) for MEMS applications, a method of creating ultra-fine circuits directly on 3D parts used for chip packaging. The highly flexible and stress-free laser direct structuring process is designed for advanced electronic packaging where space is a premium and high layout-flexibility is much appreciated.

About LPKF

Established in 1976, LPKF Laser & Electronics manufactures milling machines and laser systems used in circuit board and microelectronics fabrication, medical technology, the automotive sector, and the production of solar cells. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Ore.



Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/16/2021 | Nolan Johnson, I-Connect007
I’m sure it’s just me being hyperaware, but I can’t shake it: Mars is where it’s at right now. Is it just me, or do you get the same feeling from the news? There are the Mars rovers—three generations of them still rolling, now—and a drone helicopter winding up for a maiden flight any day now. But that’s not all. There’s SpaceX’s StarShip, rapid-prototyping its way into a manned flight to Mars. And NASA’s whole “return to the Moon” project is simply a shakedown for the U.S. government contractors’ Mars flight hardware, too.

Top Five Takeaways from IPC APEX EXPO 2021

04/15/2021 | Chris Mitchell, IPC VP, Global Government Relations
IPC APEX EXPO 2021, which went all virtual this year, exemplified how the electronics industry has responded to the COVID-19 global pandemic: with resiliency, agility, and an unwavering commitment to build electronics better. APEX EXPO featured great content and robust discussions on topics of critical importance to the global electronics industry. From my vantage point leading IPC’s government relations programs, here are my top five takeaways from this year’s event.

IPC Supporting Newcomers in the Industry: Notes from IPC APEX EXPO 2021

04/01/2021 | Marc Carter, Aeromarc
With the wrap-up of IPC APEX EXPO 2021, it was extremely gratifying to note the emphasis placed on getting young people involved to combat the “graying out” knowledge losses facing our industry. A part of that emphasis was reflected in the award ceremony on Tuesday, March 9, which featured some people you may have seen mentioned in my “Better to Light a Candle” columns.

Copyright © 2021 I-Connect007. All rights reserved.