MACFEST—Manufacturing Advanced Coatings for Future Electronic Systems


Reading time ( words)

Now in its second year, MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology. Partly funded by Innovate UK (formerly the Technology Strategy Board), the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding. This will help PCB manufacturers meet the performance demands for high value electronic systems, ensuring long term reliability, even in harsh environmental conditions. In addition, the use of deep eutectic solvents (DESs), a patented technology of the University of Leicester, offers the ability to significantly reduce the environmental impact of a number of PCB plating technologies, reducing the requirements for use of cyanide and toxic/corrosive acids in plating baths.

DESs are a novel class of solvents similar to ionic liquids (ILs). Whereas ILs are composed exclusively of ions, DESs are liquids composed of a salt and complexing agent, commonly a tetraalkylammonium salt, such as choline chloride, and a hydrogen bond donor (HBD), such as 1,2-ethanediol or urea[1] When mixed together the HBD binds to the anion, resulting in a large depression of the melting point. At Leicester we have used DESs in the development of immersion silver[2, 3], electroless nickel-immersion gold (ENIG)[4] and hot air solder levelled electroless nickel (HASLEN) processes, each of which offer its own benefits over existing processes[5] from the reduced safety and environmental concerns mentioned above as well as, in some cases, the removal of existing failure mechanisms such as black pad.

The MACFEST project is building on this previous work in the development of a new, state-of-the-art PCB surface finish for use in both reflow and wire bonding applications.

Read the full article here.



Editor's Note: This article originally appeared in the May 2016 issue of The PCB Magazine.

Share




Suggested Items

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

Taiyo’s Brian Wojtkiewicz Discusses Flex, HDI and More

10/25/2022 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.

Catching Up With John Johnson, New Director of Business Development at ASC

09/28/2022 | Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.