MACFEST—Manufacturing Advanced Coatings for Future Electronic Systems


Reading time ( words)

Now in its second year, MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology. Partly funded by Innovate UK (formerly the Technology Strategy Board), the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding. This will help PCB manufacturers meet the performance demands for high value electronic systems, ensuring long term reliability, even in harsh environmental conditions. In addition, the use of deep eutectic solvents (DESs), a patented technology of the University of Leicester, offers the ability to significantly reduce the environmental impact of a number of PCB plating technologies, reducing the requirements for use of cyanide and toxic/corrosive acids in plating baths.

DESs are a novel class of solvents similar to ionic liquids (ILs). Whereas ILs are composed exclusively of ions, DESs are liquids composed of a salt and complexing agent, commonly a tetraalkylammonium salt, such as choline chloride, and a hydrogen bond donor (HBD), such as 1,2-ethanediol or urea[1] When mixed together the HBD binds to the anion, resulting in a large depression of the melting point. At Leicester we have used DESs in the development of immersion silver[2, 3], electroless nickel-immersion gold (ENIG)[4] and hot air solder levelled electroless nickel (HASLEN) processes, each of which offer its own benefits over existing processes[5] from the reduced safety and environmental concerns mentioned above as well as, in some cases, the removal of existing failure mechanisms such as black pad.

The MACFEST project is building on this previous work in the development of a new, state-of-the-art PCB surface finish for use in both reflow and wire bonding applications.

Read the full article here.



Editor's Note: This article originally appeared in the May 2016 issue of The PCB Magazine.

Share

Print


Suggested Items

Real Time with… AltiumLive Europe: If You Don’t Know How It’s Made, How Can You Possibly Design It?

10/26/2020 | Pete Starkey, I-Connect007
Designers attending the AltiumLive Europe 2020 Virtual Summit had the opportunity to see at first-hand how circuit boards were made to help them make informed design-for-manufacturing decisions. Pete Starkey details how Würth Electronik welcomed AltiumLive to its Niedernhall factory to take a virtual tour.

EIPC Technical Snapshot: Automotive Technology

10/19/2020 | Pete Starkey, I-Connect007
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

Real Time with… AltiumLive 2020: Würth Virtual Factory Tour

10/13/2020 | Dan Feinberg, Technology Editor, I-Connect007
Since AltiumLive this year is a virtual event, coverage is limited to watching some of the presentations virtually. Dan Feinberg describes how he was pleasantly surprised with the quality and excellence of the Würth virtual factory tour.



Copyright © 2020 I-Connect007. All rights reserved.