Reading time ( words)
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design.
Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronic products would fail in a matter of minutes. Leakage current, and thus leakage power, goes up with smaller die-level feature sizes.
Because leakage is temperature-dependent, thermal design is more important. How should engineers who develop products with complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, this PADS paper will take a look at 10 things you should know about thermal design of electronic products. To download this paper, click here.
Expanding its avenues of content delivery, I-Connect007 is excited to announce the launch of our latest educational product, On the Line with.., available on Spotify, Apple and all the major podcast platforms. In this podcast, we speak with industry experts to get the latest insights and perspectives on the most relevant topics in the electronics industry today.
Andy Shaughnessy, Design007
It’s been a busy week in our industry. We have a duke’s mixture of news and columns in this week’s Editor’s Choice, starting off with some good news for the American electronics manufacturing industry. In his State of the Union speech, President Biden signaled his support for the CHIPS Act and the U.S. electronics industry, and he promised that Washington would put its money where its mouth is this time. Is it going to happen? Don’t bet the rent money.
Ashutosh Mauskar, Cadence Design Systems
Technology has always invoked radical changes, but unlike today, there used to be one major revolutionizing technology trend at a time. The world is becoming increasingly connected, more automated and more intelligent, driven by generational drivers—hyperscale computing, 5G, artificial intelligence and machine learning (AI/ML), industrial IoT (IIoT), and autonomous vehicles—which are invoking disruptive technological forces on vertical markets, unfolding varied levels of microelectronics and digital transformation across the globe. The increasing demand for miniaturization and higher speed is changing the dynamics of the semiconductor components needed to store and process data.