-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators to Improve Data Center Energy Efficiency
June 14, 2016 | AT&SEstimated reading time: 3 minutes
Sarda Technologies (Sarda), a disruptive power management component supplier and UTAC Holdings Ltd (UTAC), one of the leading semiconductor assembly and test services providers in Asia, today announced that Sarda will implement its Heterogeneous Integrated Power Stage (HIPS) in UTAC’s three-dimensional system-in-package (“3D SiP”) based on ECP technology from AT&S to improve data center's energy efficiency.
Designed to address the rapidly escalating power consumption in data centers, Sarda’s HIPS replaces silicon switches with gallium arsenide (GaAs) in voltage regulators that increase switching frequency by 10 times, improve transient response by 5 times and reduce size by 80%. With these fast, small voltage regulators, it enables granular power delivery to reduce data center power consumption by 30%.
The collaboration was announced at the International Symposium on 3D Power Electronics, Integration and Manufacturing Symposium (www.3D-PEIM.org) in Raleigh, North Carolina, USA.
“UTAC’s 3D SiP enables Sarda to integrate GaAs switches, silicon driver and passive components in a compact, low-profile package that minimizes parasitics for efficient, high speed operation,” said Bob Conner, CEO and co-founder of Sarda. “UTAC’s collaboration with AT&S (please refer to press release) also provides a full turnkey supply chain assembly and test flow with much needed alignment of roadmaps as well as design rules for 3D SiP solutions with embedded chip in substrate technology.”
“System manufacturers are moving from use of discrete components to highly integrated power management solutions to improve power density and energy efficiency. UTAC is very excited in working closely with Sarda and AT&S to demonstrate the benefits of using 3D SiP to reduce footprint and improve electrical and thermal performance,” said Lee Smith, UTAC Vice President of Advanced Package Product Line.
“Our collaboration with UTAC maximizes the benefits of utilizing AT&S’ ECP technology for the Sarda HIPS Solution”, stated Michael Lang, CEO of Advanced Packaging at AT&S. “The major ECP advantages compared to standard IC packaging and PCB assembly include a significant form factor reduction, higher reliability, improved thermal management and a fast and easy system integration with high efficiency.”
Reducing Data Center Cost-Per-Workload
Servers, routers and communications systems require new power management technology to keep up with the growth in data consumption and mobile connectivity. But power delivery and heat removal issues constrain system performance. Moreover, each system board uses dozens of voltage regulators which consume precious board space.
Designers can no longer rely solely on Moore’s Law to deliver the needed gains in energy efficiency. Leading edge processors now operate at less than one volt, which prevents designers from reducing operating voltage enough to keep power consumption constant while increasing transistor density. Instead, developers are turning to “More-than-Moore Scaling,” which heterogeneously integrates different materials and components to improve system performance-per-watt.
Small, fast voltage regulators enable granular power which reduces system power consumption through dynamic power management of each load. Miniaturizing the voltage regulators also frees up board space for more processors and memory to increase system performance. Increasing system performance-per-watt decreases the system cost-per-workload.
About the International Symposium on 3D Power Electronics Integration and Manufacturing
The first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org), held June 13-15, 2016, in Raleigh, North Carolina, brings together designers and manufacturers to address the future of integrated power electronics and advance the 3D power electronics systems designs of the future.
The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by the International Microelectronics Assembly and Packaging Society (IMAPS); the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); North Carolina State University; the University of Maryland; and Virginia Tech.
About Sarda Technologies
Sarda Technologies provides disruptive power management components to reduce data center cost-per-workload by reducing power consumption through granular power delivery. The venture-backed company is located in Durham, NC.
About UTAC Holdings Ltd
UTAC Holdings Ltd (UTAC) is a leading independent provider of assembly and test services for a broad range of semiconductor chips and we offer a full range of semiconductor assembly and test services in the following key product categories: analog, mixed-signal and logic, and memory. Our customers are primarily fabless companies, integrated device manufacturers and wafer foundries. UTAC is headquartered in Singapore, with production facilities located in Singapore, Thailand, Taiwan, China, Indonesia and Malaysia, in addition to its global sales network focused on five regions: United States, Japan, China and Taiwan, rest of Asia and Europe, with sales offices located in each of these regions.
Suggested Items
Europlacer Announces Introductory Promotions for 2024 IPC APEX EXPO
03/27/2024 | EuroplacerEuroplacer, a leading provider of SMT assembly solutions, is excited to announce special introductory promotions for its latest products at the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
03/21/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.
Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
03/18/2024 | SEMIThe new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced.