American Standard Circuits Enhances Via Fill Capabilities with Double Systems


Reading time ( words)

Anaya Vardya, CEO of American Standard Circuits, has announced that his company recently enhanced their Via Fill capabilities with the installation of a MASS VHF300 Horizontal Hole Filling system with full chamber vacuum capability, accompanied by a MASS ES10 double sided Scavenger unit.

This unit gives ASC the capability of doing both conductive and non-conductive via fill including the ability to plug high aspect ratio holes and blind vias.

“The demand for via fill in terms of technology and volume requirements has steadily been increasing. It was essential that we upgrade our existing processes in order to better fulfill the growing requirements of our customers for higher technology. We put a great deal of focus on  making sure all our customers’ needs, both present and future, are met so we have invested over two million dollars in the past 18 months on new and vital equipment acquisitions to do just that and we’re just getting started. Our plan is to be one of the leading high tech PCB fabricators in North America,” stated Mr. Vardya when making the announcement.

About American Standard Circuits

American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/Microwave, flex and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment.  Their qualifications include ISO 9001:2008, MIL-PRF 31032, and ITAR registration. American Standard also holds a number of key patents for metal bonding processes. For more information about American Standard Circuits services or to ask one of their technology experts a question, click here.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

Time, Space, Structure, and Model Analysis of CCL Price Increase

04/19/2021 | Hu Yang, Zhongtai Securities Research Center
According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.

PCB Sourcing Using PCQR2

03/30/2021 | Al Block, Naji Norder, and Chris Joran, National Instruments
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also achieving the lowest costs for your products. Considering each PCB supplier has their own niche in terms of equipment, process, and performance, uniform test data from the IPC-9151D Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements.



Copyright © 2021 I-Connect007. All rights reserved.