RBP Chemical Technology Joins HDP User Group


Reading time ( words)

The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that RBP Chemical Technology has become a member.

“We are pleased to join HDPUG and contribute to the advancement of electronics packaging technology. RBP brings over 35 years of technique and know-how in a wide range of technologies used in the manufacturing of high reliability printed circuit boards, IC substrates and silicon based substrates. RBP’s expertise is in high density circuit formation, low profile adhesion promoters and surface treatment and passivation of metal surfaces ” said Michael Carano, V.P. Technology and Business Development for RBP Chemical Technology.

“RBP Chemical Technology is an excellent addition to the HDP User Group Membership. The Staff and Members of our organization are looking forward to working with them on our projects and activities.”, said Marshall Andrews, Executive Director of HDP User Group.

As a Member, RBP Chemical Technology will join over 50 of the major companies involved in collaborative research addressing the major technical and environmental issues facing the electronics industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward.

About RBP Chemical Technology

RBP Chemical Technology was founded in 1954. RBP develops, manufactures and specialty chemicals and processes used in the fabrication of printed circuit boards, semiconductors and IC substrates. Company expertise resides in surface preparation, metallization, circuit formation, HDI, solderability enhancement and processes for TSV and RDL. Further emphasis on processes to enhance signal integrity and long-term reliability.

About HDP User Group

HDP User Group is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K.

Share

Print


Suggested Items

FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent

05/24/2019 | Nolan Johnson and Barry Matties, I-Connect007
Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Staying Current on Flex Manufacturing is Smart Business

04/04/2019 | Barry Matties, I-Connect007
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.



Copyright © 2019 I-Connect007. All rights reserved.