Rogers Corporation Launches UL 94 V-0 Circuit Material


Reading time ( words)

Rogers Corporation introduces RO4730G3 UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.

These flame-retardant (per UL 94V-0), thermoset laminate materials are an extension of Rogers’ dependable RO4000® circuit materials, which are a popular choice for base station antennas. RO4730G3 laminates provide the low dielectric constant (Dk) of 3.0 favored by antenna designers, held to a tolerance of ±0.05 through the thickness (z axis) when measured at 10 GHz.

RO4730G3 laminates are comprised of ceramic hydrocarbon materials with low-loss LoPro copper foil. They offer excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) that makes them attractive for intermodulation (IM) sensitive, high-frequency antennas. They are 30% lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques. RO4730G3 circuit laminates exhibit low z-axis coefficient of thermal expansion (CTE) of 30.3 ppm/°C from -55 to +288°C for reliable plated through holes (PTHs) in multilayer circuit assemblies. They are lead-free-process compatible and offer improved flexural strength over RO4000JXR™ materials.

The new antenna-grade circuit laminates are engineered for consistent performance with temperature. They have a coefficient of thermal expansion (CTE) closely matched to that of copper and low thermal coefficient of dielectric constant in the z axis (+26 ppm/°C at 10 GHz) from -50 to +150°C. In addition, these laminates achieve low circuit losses at high frequencies, with a dissipation factor of 0.0023 at 2.5 GHz and 0.0029 at 10 GHz.

RO4730G3 laminates offer practical, cost effective circuit material solutions for active antenna arrays and PCB antennas for current wireless applications, including 4G and IoT, and those about to come, such as 5G. With the right combination of materials, these laminates provide an optimum blend of price, performance, and durability.

About Rogers Corporation

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety, and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.

Share

Print


Suggested Items

Making Materials Succeed: Past, Present, and Future Trends

05/20/2019 | Nolan Johnson, I-Connect007
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.

Alun Morgan on the Future of PCB Materials

05/16/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Averatek on the Future of Additive and Semi-additive Processing

05/10/2019 | Barry Matties, I-Connect007
Averatek’s President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the current challenges and limitations that continue to leave many manufacturers hesitant to implement the technology.



Copyright © 2019 I-Connect007. All rights reserved.