High-Throw Electroless Copper– New Opportunities for IC Substrates and HDI Manufacturing


Reading time ( words)

Originally presented at IPC APEX EXPO 2016 and published in the proceedings.

Introduction

The one constant in electronics manufacturing is change. Moore’s Law, which successfully predicted a rate of change at which transistor counts doubled on integrated circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC substrate manufacturers, when dealing with the demands of the packaging market.

As a consequence, miniaturization of lines and spaces (L/S) down to 5/5 µm and even below to 2/2 µm in conjunction with smaller blind micro vias (BMV) is required to meet the very challenging wiring densities for new technologies. However, implications of the ‘faster, smaller, and cheaper’ mindset also affect high-end HDI printed circuit board manufacturers. The existing production infrastructure based on panel plating is not capable of 20/20 µm L/S—as required by OEMs for high-end mobile devices. As a consequence of this, production technology needs to change to pattern plating.

Miniaturization leads to increased requirements for all process steps involved in the value-added-chain. This paper discusses the corresponding challenges for metallization based on electroless copper processes. In order to minimize the effect of the differential etch process, which is one of the major factors determining surface feature resolution, the thickness of the deposited electroless copper layer on the surface of the substrate must be reduced. Moreover, the thickness at the sidewalls and bottom of the BMV must be improved to ensure excellent via filling performance.

To read this entire article, which appeared in the June 2016 issue of The PCB Magazine, click here.

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Summer Conference 2022: Day 1 Review

06/28/2022 | Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.

PCB Plating Still Comes Down to Physics

06/21/2022 | I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.



Copyright © 2022 I-Connect007. All rights reserved.