IPC Releases Schedule of Standards Development Meetings


Reading time ( words)

IPC—The Association Connecting Electronics Industries is inviting the industry to join its Standards Development Meetings, which will be held from September 24–30, 2016.

Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by

Attending IPC standards development committee meetings offer attendees opportunities to contribute to the industry standards and guidelines that companies, customers, suppliers and competitors rely on.

IPC Standard Development Committees cover a range of topics, including:

  • Assembly & Joining
  • Assembly Equipment
  • Base Materials
  • Cleaning & Coating
  • Electronic Documentation Technology
  • Electronic Product Data Description 
  • Embedded Devices 
  • Environment, Health and Safety
  • Fabrication Processes 
  • Flexible and Rigid-Flex Printed Boards 
  • High Speed/High Frequency Interconnections
  • Management 
  • Packaged Electronic Components
  • Printed Board Design Technology 
  • Printed Electronics
  • Process Control 
  • Product Assurance
  • Product Reliability 
  • Rigid Printed Boards
  • Terms and Definitions 
  • Testing

For more information or to register, click here.

Share

Print


Suggested Items

New Technical Director and Upcoming 2019 EIPC Summer Conference

05/15/2019 | Nolan Johnson and Pete Starkey, I-Connect007
Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.

SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent

04/16/2019 | Nolan Johnson, I-Connect007
Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.



Copyright © 2019 I-Connect007. All rights reserved.