EIPC Speednews: News from the European PCB Industry


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News from EIPC

- Register now for the EIPC workshop at Amphenol Invotec Ltd on September 22

News from the UK

- ICT Evening Seminar, Newtown House Hotel, Hayling Island, September 20

- BPA Consulting releases latest High Speed Report

Electronics Industry News

- Intel will be the future, not ARM

News from WECC Members

- News from IPC 

Click here for the International Events Diary 2016

Click here to download the complete SpeedNews Issue 21

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Suggested Items

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Identifying Product Board Class and Pre-quote Software

07/09/2019 | Mark Thompson, CID, Prototron Circuits
Deciding on the class of the final product will determine what files are needed for fabrication and assembly. It is critical to note that for a product to be built to any class level, it must be designed to that class level from its inception.



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