ESI Expands Market-Leading Family of Laser Processing Platforms For PCB Fabricators

Reading time ( words)

Electro Scientific Industries, Inc., an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced general availability of two new PCB laser processing systems to address the evolving needs of fabricators in the flexible printed circuit (FPC) manufacturing segment.

The RedStone™ system not only provides FPC processors new to laser processing with a low cost-of-ownership entry point, but also enables established FPC processors to optimize production around specific through-hole drilling and routing applications.

The LodeStone™ system addresses the high-reliability routing requirements of processors focused on industries such as medical device manufacturing, where requirements demand laser processing with minimal residual carbonization and smaller heat-affected zones. It utilizes an ESI-developed femtosecond-class green laser—the first to be offered in the FPC manufacturing segment—and incorporates ESI's proprietary rod fiber technology.

These new products extend the breadth of ESI's market-leading portfolio of laser-based PCB manufacturing solutions. A portfolio which already included the industry's most popular line of flex processing systems, a CO2-laser-based processing system for affordable HDI PCB manufacturing, and a high-volume low cost-of-ownership solution for IC packaging.

Early market adoption of the RedStone and LodeStone systems has been promising, with initial-system orders placed with Asia-based customers—one of which is a top-five PCB manufacturer.

"ESI's leadership in this segment draws on our decades of accumulated expertise in laser/material interaction and our ongoing partnership with customers to help them optimize their production capabilities," stated Michael Darwin, General Manager of ESI's Component Processing Division. "The RedStone and LodeStone systems are just the latest additions to our portfolio of solutions designed to help PCB manufacturers address new challenges in production, keep pace with next-generation flexible circuit materials and designs, and offer their customers a wider range of value-added processing services."

RedStone and LodeStone systems are available through ESI directly and through ESI channel partners.

About ESI, Inc.

ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations and subsidiaries in Asia, Europe and North America. More information is available here.



Suggested Items

Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision

12/29/2019 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.

A Walking Tour of Viking Test With Jake Kelly

12/16/2019 | I-Connect007 Editorial Team
In this video walking tour of the Viking Test booth at productronica 2019, Managing Director Jake Kelly walks us down the line of Viking's universal film stripper.

Future Trends in Flying Probe Testing

11/29/2019 | I-Connect007 Editorial Team
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.

Copyright © 2020 I-Connect007. All rights reserved.