Ventec International to Introduce Latest Flex Material Solutions at PCB West 2016


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Ventec International will be introducing its newest ranges of PCB base-materials including consumables and flex- & rigid-flex circuit board materials at PCB West, scheduled to take place September 13-15, 2016 at the Santa Clara Convention Center in California. The latest advances in polyimide technology including Ventec’s advanced high speed/low loss product line ‘tec-speed’ will also be a highlight on the Ventec booth number 411.

The introduction of Ventec’s wider product offering that includes complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils, clean room products and coatings, follows the recent acquisition of TMT Trading, which was completed on July 1, 2016. Chris Alessio, Vice President Sales & Operations for the company’s North American operation will be joined by Ken Stem (Technical Account Representative) at Booth #411 to introduce these latest offerings to the North American market.

Chris Alessio commented: “The integration of TMT Trading into Ventec offers our customers a one-stop-shop for their laminates and PCB base material needs. PCB West provides us with the ideal opportunity to introduce our extended PCB materials product offering to the North American market.”

For more information about Ventec’s solutions and the company’s wide variety of products, please click here and/or download the Ventec APP.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.

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