Rogers to Exhibit & Educate on Latest-Generation Circuit Materials at EDI CON USA 2016

Reading time ( words)

Rogers Corporation will be a strong contributor to the upcoming 2016 Electronic Design Innovation Conference (EDI CON USA 2016) September 20-22. Located at Boston’s Hynes Convention Center, EDI CON USA 2016 is a technical conference and exhibition devoted to designers of high-frequency-analog and high-speed-digital circuits and systems for many different applications, including automotive electronics, commercial wireless and wired communications, military electronic warfare (EW) and radar, medical electronics and industrial electronics.

Rogers Corp. will bring its advanced materials technology expertise to Boston as part of the exhibition and the technical conference.

As an exhibitor, Rogers Corp. will show some of its latest circuit materials at EDI CON exhibition Booth # 405, including 92ML™ prepregs and laminates, 92ML™ StaCool™ laminates, and RO4730G3™ UL 94 V-0 antenna-grade laminates.

92ML laminates and prepregs are ideally suited for high-power circuits, such as power amplifiers and power supplies. They are halogen-free, lead-free-compatible, epoxy-based materials with excellent heat-transfer characteristics available with up to 4 oz. copper cladding.

92ML StaCool laminates are aimed at temperature-sensitive circuits: they integrate an aluminum insulated metal substrate (IMS) plate that can be machined as needed. The outstanding thermal stability of these circuit materials makes them candidates for many heat-generating electronic applications, such as in LED light modules and automotive electronic sensors.

Rogers RO4730G3 UL 94 V-0 antenna-grade laminates are engineered for high-performance next-generation wireless communications antennas. These affordable, low-loss materials have been developed to meet the performance requirements of antenna designs for current 4G and emerging 5G wireless systems. They are flame-retardant per UL 94 V-0 and are an extension of Rogers RO4000® circuit materials, a top circuit-material choice for wireless base station antennas.

RO4730G3 laminates feature a low dielectric constant (Dk) of 3.0 and excellent Dk tolerance of ±0.05 through the thickness (z axis) at 10 GHz for tight control of impedance when designing antennas and antenna arrays. These antenna laminates include low-loss LoPro® copper foil which is characterized by outstanding passive-intermodulation (PIM) performance (typically better than -160 dBc) for distortion-free antenna performance. RO4730G3 laminates are also 30% lighter than PTFE, providing high performance in low-weight assemblies.

Educational Offerings from Rogers Corp.

As part of the technical conference, Rogers Corp.’s Associate Research Fellow Allen Horn III will discuss how PCB conductor surfaces can impact the performance of transmission lines for low-loss circuit laminates. In the technical session “Conductor Profile Structure Effects on Propagation in Transmission Lines on Extremely Low Loss Circuit Laminates,” Tuesday, September 20, at 10:10 AM in Room 202, Horn will describe the type of conductor surface needed for optimum low-loss transmission-line performance for high-speed digital and high-frequency microwave circuits and how that conductor surface can be achieved in practical circuit-board materials.

Rogers Senior Product Manager, Scott Kennedy, will head a workshop on September 20, at 3:40 PM, in Room 207 designed to help designers solve thermal-management problems at the circuit-board level: “PCB Material Design Choices and their Impact on Thermal Management.” The workshop will review key PCB material parameters related to thermal management and the desirable characteristics of circuit dielectric materials and conductors metals that best dissipate heat in temperature-sensitive circuit designs. 

About Rogers Corporation 

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit



Suggested Items

Calumet Electronics and Averatek Team Up on A-SAP

12/02/2019 | Nolan Johnson, PCB007
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.

Decreasing Bend Radius and Improving Reliability- Part II

11/22/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility”.

Flex Standards Update With Nick Koop

11/21/2019 | Andy Shaughnessy, Design007 Magazine
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.

Copyright © 2019 I-Connect007. All rights reserved.