IPC Technical Education — PCB Troubleshooting


Reading time ( words)

Join IPC on November 2, 2016 for PCB Troubleshooting: Advanced Problem-Solving. The course will address many costly defects you may encounter, including: interconnect separation, delamination, wedge voids, plating folds, micro-voids, and hole-wall pull-away. Root cause is not always readily apparent, and participants will learn to trace problems through the manufacturing process — and prevent them.

  • Explore a range of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating.
  • Learn about solderability and other assembly-related issues, such as outgassing, black pad, creep corrosion and blow holes
  • Gain strategies to address solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating

This full-day course will benefit team members involved in PCB fabrication and assembly.

Registration includes a copy of the instructor’s PowerPoint presentation and access to all activities at PCB Carolina. Class will be held in conjunction with this exhibition, which is presented by the local chapter of the IPC Designers Council. Students are encouraged to take advantage of the additional technical education offered by exhibits. For more information about the event, click here.

Share

Print


Suggested Items

Future Trends in Flying Probe Testing

11/29/2019 | I-Connect007 Editorial Team
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.

Decreasing Bend Radius and Improving Reliability- Part II

11/22/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility”.

Solder Mask Tack Dry

11/08/2019 | Nikolaus Schubkegel
As a general rule, the tack-dry temperature should be as low as possible; in other words, it should only be as high as necessary. If the temperature is too low, the evaporation rate for the solvent will be to slow, and the solder mask will not dry in a reasonable amount of time. If the temperature is too high, however, the dry time certainly will be excellent, but it could create a solder mask lock-in with repercussions by the developing time.



Copyright © 2019 I-Connect007. All rights reserved.