EIPC Speednews: News from the European PCB Industry

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News from EIPC

- Still possible to register due to larger venue reservation! Register now for the EIPC workshop at Snowdome on September 22

- New Half Day Working Group Meeting for EMS Manufacturers

News from Germany

- Camtek reorganises its digital printing activities

News from the UK

- Ventec International doubles IMS material manufacturing capacity with $2 million equipment investment

- Future Horizons' IFS2016 Mid-Term Semiconductor Market Outlook & Forecast

- Knowles UK move to new premises

- ICT Evening Seminar at the Newtown House Hotel, Hayling Island 20th September

News from the USA

- Only 4 days left!!

Electronics Industry News

- Leak: iPhone 7 will solve two of the three biggest problems with iPhones

News from WECC Members

- News from IPC

Click here for the International Events Diary 2016

Click here to download the complete SpeedNews Issue 24



Suggested Items

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07/10/2020 | Nolan Johnson, PCB007
The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/03/2020 | Andy Shaughnessy, Design007 Magazine
The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

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