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RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses Recent Company Rebranding
03/21/2019 | Real Time with...IPC
Smart Factories: More Than Robots
03/21/2019 | Nolan Johnson, I-Connect007
TTM to Exhibit at SAE WCX 2019
03/21/2019 | Globe Newswire
TTM on Flex and Rigid-flex PCB Challenges
03/20/2019 | Barry Matties, I-Connect007
EIPC Winter Conference, Day 1
03/19/2019 | Alun Morgan, EIPC
PCB :: From The Show
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses Recent Company Rebranding
Senior VP Joseph D’Ambrisi of MacDermid Alpha Electronics Solutions speaks with Steve Williams about the recent rebranding of the business, and the benefits to their customers.
RTW IPC APEX EXPO 2019: Arlon Discusses Investments and Important Role of a Niche Supplier
Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.
RTW IPC APEX EXPO 2019: Ucamco Discusses Latest Evolution of PCB Software
Ucamco Managing Director Karel Tavernier speaks with Dan Feinberg about their aim of automating the CAM process as much as possible. He also discusses the recent evolution of their PCB software.
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI
Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.
Accelerating and Disrupting Innovation: The Tesla Story
The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.
RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO
Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.
RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling
Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.
RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services
Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.
RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG
John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.
RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment
Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.
RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market
Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
RTW IPC APEX EXPO 2019: The Circle Is Complete
Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.
RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries
Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
14th Electronic Circuits World Convention
The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and Their Road Show
I was happy to see Rockwell Collins’ Doug Pauls receive IPC’s Raymond E. Pritchard Hall of Fame award at IPC APEX EXPO, well-deserved for him, and I wanted to chat with him about it. As with so many conversations at the conference this year, the talk quickly turned to inspiring interested young people in our “graying” industry. We also discussed the nature of volunteering and what we get out of it.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
RTW IPC APEX EXPO: New Dimensions in Fine-Pitch Probe Testing from Microcraft
MicroCraft introduces two new product lines. Regional Sales Manager Jesse Ziomek describes a flying-probe tester capable of hitting 0.4 mil pads at 2 mil pitch without sacrifice of testing speed, and a digital ink-jet printer able to print both solder resist and legend in the same cycle.
RTW IPC APEX EXPO: John Davignon Offers HDPUG Update
The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.
Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started
I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.
RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.
RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity
Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.
Now, isn’t that the mantra we all hear today? For me, it’s Tai Chi to maintain physical flexibility. But of course, that is not what we’re here for. We’re talking flexible circuits including all the variations of same, which is why we called this issue “The Wide World of Flex.” Because the world of flex is broad—and it’s rapidly getting wider.
RTW IPC APEX EXPO: Schmoll and Taiyo America Partner to Speed Up Solder Mask Development
How to accelerate the development of specialist direct-imaging solder resists to suit the requirements of the Asian and North American markets? Jesse Session, technical manager at Taiyo America, describes how close collaboration between ink formulator and equipment supplier enables the optimization to be achieved most effectively.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider. He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: IPC Validation Services Update
Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
Orbotech’s Latest Technology at IPC APEX EXPO
Orbotech presented their latest new technologies at IPC APEX EXPO 2016. The Nuvogo 1000 is a higher power version of their multi wavelength direct imaging machine, as well as their new automated optical shaping technology which can add copper deposition to an otherwise defective PCB. I met with Orbotech’s Micha Perlman in their booth on the show floor, to learn more.
Ventec International Group Expands North American Focus
Ventec International Group is looking to expand their U.S. operations, and they’ve begun this process by bringing Chris Alessio on board as VP of sales and operations of Ventec USA. I met with Chris and Ventec USA President Jack Pattie at IPC APEX EXPO 2016 to discuss their approach and possible opportunities for the North American laminate market.
Interview with Dean Kamen, Segway Inventor and Founder of FIRST
One of the keynote speakers at this year’s IPC APEX EXPO 2016 was Dean Kamen, inventor of the Segway and hundreds of other innovative devices. But perhaps most importantly, Kamen is the founder of FIRST (For Inspiration and Recognition of Science and Technology), which is recognized as the leading not-for-profit STEM engagement program for kids worldwide.
Nano System, Two Years On
Established in July 2014, Nano System Inc. focuses on the design and manufacture of laser drill systems for the PCB industry. I-Connect007's Stephen Las Marias caught up with Nano System President Sam Sekine last month at IPC APEX EXPO to discuss the latest product and business developments at his company.
Rogers: 'To PIM-test Our Material, You Have to Build a Circuit'
Passive intermodulation (PIM) is a circuit anomaly that has been occurring in cellular base station antennas, causing tremendous frustration and cost to antenna OEMs. As the supplier of the materials being used by these OEMs, Rogers Corp., and more specifically, Product Manager Tony Mattingly, must come up with a solution.
IPC’s Phil Carmichael on Asia, New Standards, and the Future
At the very busy IPC APEX EXPO in Las Vegas recently, IPC’s head of operations for Asia, Phil Carmichael, spent a few minutes in the I-Connect007 booth with me and Stephen Las Marias, managing editor of SMT Magazine, discussing all things Chinese. Among the topics we covered were the association’s current role in Asia, and the new corporate social responsibility standard currently being developed, something IPC is very excited about.
Striving for One-Stop Solutions, Manz Eyes U.S. Market
I recently spoke with Frank Baron of Manz AG about their transition from Asia into the European and North America marketplace, and how their recent acquisition of KLEO Halbleitertechnik and their LDI technology has helped turn Manz into a real one-stop solution.
The Pinless Registration System, Explained by DIS’ Bernd Gennat
I sat down at productronica recently with Bernd Gennat, VP sales Asia and Europe for Duetto Integrated Systems (DIS Inc), for an overview of the industry, including his company’s technology. Our discussion touched on trends in multilayer registration, market requirements in Europe compared with those in China, and the benefits of pinless over hard-tooled registration systems for current and future rigid, flex and flex-rigid constructions.
First EIE and CCI Eurolam on Direct Imaging, Printers and Partnership
In this interview, Gregory Stoeckli, CEO of First EIE, shares the realities of direct imaging requirements, while Lawson Lightfoot of CCI Eurolam discusses the success of the new distribution partnership the two companies have formed. Something we all agreed upon: A somewhat slower machine that is both highly flexible and affordable is a great fit for high-mix, low-volume producers.
An Examination of the China Market with Laminate Supplier Shengyi
Chief Executive Director Jack Dong explains to Pete Starkey how Shengyi Technology, the world’s second largest laminate manufacturer, plans to continue to develop its European market and to comprehensively meet the diverse requirements of the automotive, industrial controls and medical sectors. He also comments on how the Chinese government recognises the Industry 4.0 revolution in automation, data exchange and manufacturing technologies, and is steering its industrial development strategy in a similar direction.
Catching up with Gardien’s Rick Meraw
There are companies out there who are truly changing the world—companies who are making a dent in the universe, to quote the late Steve Jobs. Gardien is one of those companies. So much so that I like to catch up with them on a regular basis because they’re always adding something to their repertoire and it’s typically something that helps improve the way we handle quality assurance in our industry.
Specialist Coatings for Specialist Applications
Taiyo America’s Josh Goldberg agreed to spend a few minutes with I-Connect007's Pete Starkey at productronica recently, where he indeed climbed out of the box and explored the broader market for high-performance polymer coatings in the electronics industry.
For Pioneer MuTracx, the Future Looks Bright
In this interview conducted at productronica recently, I-Connect007 Tech Editor Pete Starkey and Publisher Barry Matties speak with Arnoud de Geus, Executive Board member at technology company Sioux, about the success of MuTracx’ (owned by Sioux) first installation of the Lunaris machine in the Whelen factory in New Hampshire, and what this has meant towards proving it can operate in a full-time production process. Arnoud forecasts what’s next for MuTracx and what they must do in order to capitalize on the positive exposure.
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