I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Hard to believe that a year ago, I was getting ready to attend DesignCon and IPC APEX EXPO and wondering if this Novel Coronavirus was going to cut into attendance from the Pacific Rim. Now, we’re accustomed to virtual trade shows. They’re not ideal, but they’re the best we can do while meeting in person is not possible. We’ve learned to adapt.
TTM’s Approach to Stackup Design: Train the Customer
In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.
CES Dispatches: Opening Day at Pepcom
On Monday, January 11, I attended the launch of the CES 2021. Well, more precisely, I attended the Pepcom program, one of the multitude of ways to connect with CES in the virtual environment. Pepcom is a regular at CES, functioning a bit like a show-within-a-show.
CES 2021: Just How Different Will It Be?
CES 2021 starts today and this year there is no need for an overpriced hotel room in Vegas, no long lines to get a taxi or board a bus, and no crowded exhibit halls (one good thing this year). On the other hand, you must decide ahead of time what you want to see and make a reservation or appointment if you wish to have time and access assured.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.
I-Connect007 Wishes You a Happy New Year
Could there be a more welcome year in recent memory than 2021? If there’s one thing most of us can agree on, it’s that we want 2020 squarely in our rearview mirror as we speed ahead with a fresh, new start. This past year has brought with it much reflection, change and even some consternation. Thank you for taking this journey with us!
Pete Starkey Discusses a Favorite Career Moment
Andy Shaughnessy recently asked Pete Starkey to discuss one of his favorite moments from his long career. Pete’s reporting, as readers know very well, is masterful; Pete’s pen can capture all the feel and vibrancyy of a technical conference—and his readership numbers often top our charts. No wonder then, that Pete’s favorite moment includes something he wrote going “viral” with the help of the UK government.
Batteries and Data Centers
The I-Connect007 team met with electrical engineer Mike Mosman, who has spent the majority of his career designing some of the country’s largest data centers. Mike recently sold his engineering company CCG Facilities Integration; he is now the vice president of electrical engineering in mission-critical facilities for Morrison Hershfield, and is still designing leading-edge data centers for large Internet companies. In this discussion, Mike explains how evolving battery technology and a strong demand are playing a key role in this area and others.
IPC Addresses Critical Industry Skills Gaps With Electronics Workforce Training
Over the past three decades, IPC standards and certification programs have played a critical role in protecting public safety and promoting excellence by ensuring the quality, reliability, and consistency of electronic products. In 2019, IPC worked with its global network of certification centers to certify over 108,000 individuals across 200 countries and 21 languages to seven IPC standards. The ubiquitous adoption of these programs speaks to the strong partnership forged between IPC and the electronics industry.
Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.
Prices of Copper-Clad Laminates Continue to Rise
Forces within and outside the PCB industry have led to concerns over rising prices for raw materials of copper-clad laminates (CCL). Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers. Prices have risen steadily in 2020, with leading CCL manufacturers announcing price increases of 20-30% recently. As the cost of raw materials such as electronic copper foil, resin and glass fiber have risen, the cost for manufacturing CCL has taken off as well.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Some years, the middle of December is marked by a distinct lack of news in PCB design, fabrication and assembly. Much of the industry often takes off around this time to get a head start on the holidays, or to squeeze in a much-needed vacation. But 2020 is not one of those years. Most of us aren’t traveling anywhere farther than the refrigerator this year, and everyone seems to still be working, albeit from their home offices. And companies in the PCB community continue to make news.
Dr. John Mitchell on IPC APEX EXPO Going Virtual
On Monday, December 14, 2020, Barry Matties and Dr. John Mitchell, IPC president and CEO, discussed last week’s decision to move IPC APEX EXPO to an all-virtual platform. In this interview, Dr. Mitchell confirms that IPC is committed to delivering a cutting-edge experience, including a strong technical program, exhibitor and visitor support, multiple keynotes and a wide variety of online networking events. Matties and Mitchell also analyze the challenges for IPC in hosting the show, as well as some of the unique opportunities that a virtual show presents for IPC and attendee alike.
This Month in PCB007 Magazine: Hiring Is an Investment in Your Business
Hiring is one of the most difficult processes in business. If you don’t get it right, you pay a heavy price. To get it right requires a well-defined process beyond just understanding the job description. It’s also important to understand the most important soft skill set you are looking for. For example, some of the most important skills may be the ability to solve problems, communicate well, organize tasks, and work with others.
Happy Holden: ECWC15 Virtual Event a Success
This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.
Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 4
The following is an excerpt from Chapter 4 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.
Happy’s DIY Solution to Chemical Control
I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.
Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
Heat cannot be efficiently exchanged with stagnant air surrounding a hot device; however, it can be transferred away from the electronic component to the PCB using thermal vias. A thermal via is a good conductor of heat that runs between the top layer and bottom layer of the PCB, dissipating heat through simple conduction. In simple terms, thermal vias are plated holes located under, or electrically connected to, a surface-mounted heat source on a PCB that allows heat transfer through the hole.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Around the holidays, we often see a slowdown in PCB design and manufacturing news. But this holiday season, there’s been no rest for the newsmakers in our industry! In the last week, our daily and weekly newsletters have been chock-full of breaking news and up-to-the-minute technical information that readers like you rely upon every day.
Just Ask Tara Dunn: The Exclusive Compilation
We asked for you to send in your questions for Averatek’s Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. And if you’d like to hear more from Tara, be sure to view her Flex007 column series “Flex Talk.”
GreenSource Fabrication Creates Plating Flexibility
The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.
Just Ask Tara Dunn: Will IC Substrates Be Produced in Volume in the U.S.?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Well, it’s the last Friday in November. On any normal year in the U.S., this would be “Black Friday” because, for many retailers, the kickoff to the holiday season’s shopping spree is the source for most of the operating income for the year. While it remains to be seen how exactly how much traditional in-store and online retailing will rake in, with the varied pandemic lockdowns, it’s clear that readers wanted to get the latest electronics industry sales numbers!
Our Thanksgiving Wish
As we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.
IPS Expanding to Accommodate Growing Market
I recently had the opportunity to visit IPS in their Cedar City, Utah, facility, where Mike Brask, founder and president of IPS, shared his business strategy and gave me a tour of the expanding manufacturing facility. IPS produces a wide range of PCB manufacturing equipment, including plating, DES, VCM, VRPs, ventilation, and spare parts for older equipment.
PC Technological Advances in 2020
With CES quickly approaching, which is perhaps the largest technology event globally that is also going virtual this year, key component and sub-assembly companies are not waiting to announce their next generation of components. Dan Feinberg details new components and performance advances, as well as why you should consider building your own PC.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.
Just Ask Joe Fjelstad: The Exclusive Compilation
We asked for you to send in your questions for Joe Fjelstad, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from Joe, view his column series “Flexible Thinking.”
HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention
Nolan Johnson speaks with Audrey Sim, executive director and vice president of operations for the Hong Kong Printed Circuit Association, about the upcoming Electronic Circuits World Convention, to be held November 30 through December 2, 2020. Ms. Sim gives Nolan an overview of the conference’s history, its scope as a printed circuit industry conference, and its shift to a hybrid virtual/physical format for 2020.
This Month in PCB007 Magazine: The Copper Foil Market Is Anything But Flat
Nolan Johnson interviewed Mike Coll, COO of Denkai America, about the copper foil and substrate market, the recent acquisition of the company by Nippon, and what they’re doing to respond to very small feature sizes.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
My last turn to select the top five editor’s picks was just before the triple-threat Halloween holiday (full moon, blue moon, and on a Saturday). Now that it’s my turn again, it falls the mega-superstitious Friday the 13th. You’re not triskaidekaphobic, are you?
Manufacturers Weigh in on Made-in-America Debate
As the U.S. grapples with who will take the helm of the U.S. presidency, electronics manufacturers around the country are grappling with which policies and ideas would promote growth and innovation in the sector. Many agree that a push for “made in America” policies and incentives might be useful. Often, they point to similar initiatives used by other countries, including China and India.
Just Ask Tara Dunn: Why Don’t Fabricators Provide More Feedback to Designers?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. She is also co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”
Roundtable Discussion: App Notes and Fab Notes
Andy Shaughnessy recently invited four recent contributors—Dana Korf, Jen Kolar, Mark Thompson, and Kelly Dack—to review the June and August 2020 issues of Design007 Magazine, which covered app notes and fab notes, respectively. In this wide-ranging roundtable, the group discusses some of the ongoing challenges related to incomplete and inaccurate design data and why communication can preclude many of these problems. What follows is the transcript from this conversation.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
This past week, we published a variety of articles, interviews, and columns—and readers definitely made their favorites known. There was good news about hiring and staffing. (In case you were wondering, there are quite a few open positions in this industry right now.) We touched base with a pair of young engineers to get their thoughts on what it’s like for recent grads working in the PCB manufacturing community. We learned about a company’s new program that can help take some of the stress out of NPI. We also launched a new chapter in our “Just Ask” series, this time starring columnist Tara Dunn. And there was sad news that a contract manufacturer’s chairman had just passed away.
Just Ask Tara Dunn: What’s Next for LCP Materials?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Welcome to the Halloween issue of the I-Connect007 Top Five Editor’s Picks! This year’s Halloween lands on a doozy of a day. Astronomers among us will, undoubtedly, already have noticed that not only does the spooky holiday fall on a Saturday night, but it also falls exactly on a full moon—and a Blue Moon, at that! The last time a Halloween Blue Moon occurred in all time zones was in 1941. As if there weren’t enough “ghoulishness” already, 2020 delivers yet another rare occurrence.
Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.
Northrop Grumman: 3D Nanomaterials May Counter Gaps in Additive Supply Chain
The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange. In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.
Real Time with… AltiumLive 2020: Early Communication Key to Success of OSV Project
Rob Cooke, director of engineering at Calumet Electronics, discusses his role in the Open Source Ventilator (OSV) project that yielded ventilator PCBs in record time. He and project partners, Dugan Karnazes of Velocity Research and Chris Denney of Worthington Assembly, recounted this story during a panel at the virtual AltiumLive.
SMTA Additive TechXchange Keynote: An Outlook on Advanced PCB Fab
Organised as a virtual event by Lenora Clark of ESI Automotive and Tara Dunn of Omni PCB, SMTA’s Additive TechXchange addressed additive technology specifically in the context of the electronics industry. Pete Starkey details the keynote presentation, an outlook on advanced printed circuit board fabrication, from Jeff Doubrava, managing partner at Prismark Partners.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Trade shows and technical conferences haven’t died; they’ve just moved online. The trade show season continues in virtual full force this week, and event coverage dominates the top five this week. Surprisingly, I don’t see events as this week’s theme. No, this week’s theme is “pundits.” We have Walt Custer’s industry outlook, seven experts on additive electronics, a designers conference keynote, and the IPC’s government relations expert. Don’t get me wrong: These folks are asked to speak to the industry for a good reason. They know their subject matter, and they present it skillfully. This week’s top five picks are worth reading.
This Month in PCB007 Magazine: The Acceleration or Deceleration of Change
Things have changed a lot in the last year, especially in the realm of technology. Just a year ago, 5G networks were on a smooth path to unquestioned rapid growth dominance. Today, while there has been much progress, and while there are some 5G capable devices available, it is far from universal. In some areas, such as near schools and residential areas, people were putting up roadblocks to 5G towers. Overall, there has been much progress, but the pace seems slower than was expected just a year ago. Some limitations are being identified, and there is already talk of 6G becoming available well before the end of the decade.
An Update on Walt Custer’s EIPC Business Outlook Webinar
“We’re not out of trouble yet, but it’s a whole lot better than a couple of months ago.” Walt Custer’s business outlook update, with emphasis on the European electronics industry, attracted a capacity audience to EIPC’s webinar on October 2. Pete Starkey details how it wasn’t all bad news.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks. In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.
Just Ask John Mitchell: Plans For Knowledge Transfer?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Just Ask John Mitchell: Global Book-to-Bill Number
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Real Time with…SMTAI 2020: ASC Makes Lemonade Out of Lemons
Steve Williams and Anaya Vardya, president and CEO of American Standard Circuits (ASC), discuss the upcoming virtual SMTAI show and how the company is “making lemonade out of lemons.” As they point out, there may be no face-to-face interaction, but virtual shows are open to attendees from around the world with no travel or hotel costs. Anaya explains how the COVID-19 lockdown has caused ASC to become more creative in its marketing efforts, including holding webinars and publishing two eBooks with I-Connect007. They also discuss ASC’s holistic approach to the marketplace, with a diversified product mix across various segments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In this week’s picks, we bring you news about the upcoming SMTA International 2020, IPC’s plans for the fall, a move for Burkle North America’s headquarters, and advice on how to select the correct CAD tool. And we have the first installment of our newest series: “Just Ask John Mitchell.”
Just Ask John Mitchell: Advice on Selling Tech in Asia
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Just Ask John Mitchell: Greenfield Capacity in North America?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Just Ask John Mitchell: Emerging Engineers and Managers
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! Today, John answers this question: Does IPC have an interest in emerging managers, as well as emerging engineers?
Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Two weeks ago, when it was my turn to pick the top 5, I made a comment about themes. I’m making a stretch here, but this week’s theme is technical education. Three out of the five most popular news items this last week reported on upcoming technical events or publications.
This Month in PCB007 Magazine: The Pillar Roadmap
As I spoke with Happy Holden about the four pillars of manufacturing, it became clear that they don’t stand on their own; they are intertwined. Happy pulls from his experience at Hewlett-Packard as he discusses benchmarking your capabilities, the competition, and market forces. He then turns that into a technology roadmap, which further drives the other pillars. Happy is adamant that to make all four pillars function properly in your business, you first need to benchmark your business and then create a roadmap. He says the roadmap identifies the specific functions required from the four pillars, and how each pillar supports the others.
I-007eBook Review: Thermal Management From a Fabricator’s Perspective
The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective, written by Anaya Vardya, founder and CEO of American Standard Circuits, is an important book for a number of reasons. The most important reason is right there in the title; it is from the fabricator’s perspective. Besides explaining all aspects of thermal management—from thermal vias and metal-core boards to mixed technology—this book also describes the various applications of thermal dielectrics, their properties, and their incorporation into the actual fabrication of PCBs.
