Institute of Circuit Technology Harrogate Seminar 2017
A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.
AltiumLive Summit—Munich, Germany, Part 2
Pete Starkey continues with his review of the AltiumLive PCB Design Summit held recently in Munich, Germany. The second day commenced with a new product launch. “Working together is hard” it read on the screen. Statistics indicated that 33% of new products were late getting to market, of which 28% were late due to insufficient collaboration, and up to 50% of potential revenue could be lost through being late to market. Then the screen read “NEXUS makes it easy!”
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Innovator Bob Tarzwell Retires From PCB Industry to Focus on New Career in Art
I have known Bob Tarzwell for more than 18 years, since he first called me looking for some help with his company. His first words to me were, “Hi, my name is Bob Tarzwell and I own a shop in Carleton Place, Ontario. I need your help."
EIPC 2017 Winter Conference Review of Day 1
Themed to address the question: “The Future Needs of the Global Electronics Industry: What Solutions will Europe Provide?" the conference was a truly international event, attracting delegates from thirteen countries, to hear a well-chosen programme of twenty presentations in five sessions, introduced by EIPC Chairman Alun Morgan.
Interview with Dean Kamen, Segway Inventor and Founder of FIRST
One of the keynote speakers at this year’s IPC APEX EXPO 2016 was Dean Kamen, inventor of the Segway and hundreds of other innovative devices. But perhaps most importantly, Kamen is the founder of FIRST (For Inspiration and Recognition of Science and Technology), which is recognized as the leading not-for-profit STEM engagement program for kids worldwide.
Flex Talk: Thoughts on the IPC Flexible Circuits–HDI Forum
As an attendee at the IPC Flexible Circuits–HDI Conference held October 28–30, I found myself in a room full of people, all eager for technical information, with the opportunity to reconnect with industry friends and to make new connections. The audience was diverse with young people, new to our industry, sitting alongside industry veterans willingly sharing their knowledge and passion for HDI design and flexible circuit technology.
The War on Process Failure
Who out there thought of it as a war? Is it? Well, we think it is—and a never-ending one at that. In fact, we thought it significant enough to devote all three of our August issues to the subject, because no matter how good you are or how great things are running, Murphy’s Law is right there, ready to take you down a peg or two—or worse.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.