Lost your password?
Not a member?
Resend confirmation instructions
Sort By Category
- New Technology
- Printed Electronics
- New Products
- Test & Inspection
- Fabrication Process
- IPC Standards
- From The Show
The CPCA and China’s Electronic Circuit Industry: Past and Future
12/11/2019 | Wang Longji, CPCA
Pluritec Takes Industry 4.0 to the Next Level
12/11/2019 | Pete Starkey, I-Connect007
Industry Set for Shift to True 3D Printing and Photonics
12/09/2019 | Nolan Johnson, PCB007
Nolan’s Notes: Clarity of Vision
12/05/2019 | Nolan Johnson, PCB007
Calumet Electronics and Averatek Team Up on A-SAP
12/02/2019 | Nolan Johnson, PCB007
PCB :: New Technology
Calumet Electronics and Averatek Team Up on A-SAP
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.
InduBond: Magnetic Induction Lamination
In this video interview, part of the productronica 2019 coverage, we spoke with Víctor Lázaro, R&D manager and technical director at Indubond. Víctor describes Indubond’s innovative methods for heating the boards to effect lamination through magnetic induction. Victor discusses the energy and operational efficiency that an induction method brings to the equipment: thermal profiles.
Vertical Conductive Structures, Part 4: Tuning Your Signal Performance
The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.
Multilayer Press Technology Using Magnetism to Produce Lamination Heat
A revolutionary concept in multilayer press technology has been developed that uses electromagnetic energy to heat the existing stainless-steel separator plates with a never-before dreamed-of accuracy and precision. The heating and cooling systems—embedded within a robust hydraulic press inside a vacuum chamber design—are controlled using a temperature feedback loop that guarantees perfect fidelity between the press recipe and the press result.
Communication, Part 6: The Importance of Technology Fit
In the final installment of this series on how PCB fabricators and designers can better communicate, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits discuss the importance of “technology fit” and how this concept impacts the synergy of the two parties involved.
Communication, Part 5: Internet Impedance Calculators for Modeling
Bob Chandler of CA Design and Mark Thompson of Prototron Circuits address how new engineers use internet impedance calculators for modeling (e.g., formulas versus recipes) in Part 5 of this series. Do you use impedance calculators that you found on the internet? Read on!
Meet George Milad, I-Connect007 Columnist
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
Additive Electronics Conference Set for October 2019 Debut
Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.
SMTA Additive Electronics Conference: Industry Trends
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.
Nano Dimension Details New DragonFly LDM
Dan Feinberg talks with Nano Dimension CEO Amit Dror about the new DragonFly LDM 3D printer technology announced by the Israeli company on July 24, 2019, aimed at increasing machine uptime and moving forward from prototyping to higher production volumes.
Nano Dimension CEO Gives Company Update
Dan Feinberg and Nolan Johnson speak with Amit Dror, CEO of Nano Dimension, about recent company events and the company’s focus on high-mix/low-volume and agile local manufacturing.
Virtual Verification Station From CIMS Enhances AOI Capabilities
At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.
AWE 2019: Go XR, Be Awesome
Dan Feinberg attended and covered the recent 2019 Augmented World Expo (AWE) and conference in Santa Clara, California. The event featured the latest developments and technologies in augmented (AR), mixed (MR), virtual (VR), and extended virtual reality (many just call it all XR to make it simple). Here's a wrap-up of the event.
Digital Twin Drives Design in the Smart Factory
New product realization and design for manufacturing and assembly has now started to become more visible as a program that can improve a company’s time to market and lower product costs. This is one of the main focuses of Industry 4.0 for the smart factory. Many programs are underway by numerous companies, and what is now needed is a framework to coordinate the application of these programs.
Photonics Systems Looks to Expand Its PCB Capabilities
Pulsed-laser equipment manufacturer Photonics Systems looks to expand its capabilities to the PCB industry. Barry Matties sat down with Antonio Schmidt and Kurt Weber to talk about the company’s transition and the challenges they’ve faced thus far as they continue to build and extend their brand into a new market segment.
Electrolytic Plating: Filling Vias and Through-holes
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.
Alun Morgan on the Future of PCB Materials
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.
Averatek on the Future of Additive and Semi-additive Processing
Averatek’s President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the current challenges and limitations that continue to leave many manufacturers hesitant to implement the technology.
Creating Smart Surfaces with Electronic Functionality
Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an innovative technology that encouraged a bit of lateral thinking and appealed to my creative side: the IMSE, or injection-moulded structural electronics.
Patty's Perspective: From Start to Finish
Our goal in this month's issue of Flex007 Magazine is to provide insights into how best to accomplish the seemingly daunting task of designing flexible and rigid-flex circuits—and with a new and different design each time. A lot of it boils down to one factor: working with your supplier and customer.
University Students Point to the Future in their Research
Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.
Automation on Full Display at Recent China Exhibitions
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.
Hardware and Software in Smart Factories
As smart factories become a part of the present rather than a thing of the future, we will all need to become familiar with related concepts and components. This article is dedicated to various automation protocols, including some new ones just coming on the market, and covers hardware, such as PLCs and machine interfaces, as well as software and network protocols, such as MAPS, SECS/GEM, OML, CFX, IPC-2541, and custom software.
Smart Factories: More Than Robots
The acceptance of smart factories is a global movement across multiple industries. Even materials and chemistries are aligning with a move toward further automation, which allows equipment manufacturers to capture and store more data, and software layers to perform more detailed analysis, prediction, and optimization.
EIPC Winter Conference, Day 1
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.
The Smart Factory IQ Test
Let's see how prepared you are to talk about Industry 4.0. The following 12-question test will measure how much you know about smart factory concepts and philosophies. Since the concept of a smart factory is larger than the electronics manufacturing industry and encompasses the entire supply chain, the terms and concepts here are also more global in nature.
CES 2019: More Show Floor Favorites
In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.
RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries
Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.
CES 2019 Showstoppers, the Show Floor, and Some Neat Stuff
CES 2019 is over, and those of us who spent four to five days trying to see and hear as much as possible are in recovery mode. There were over 182,000 attendees, and 6,600 of us were media all trying to get to as much of the 2.9-million-square-feet exhibit space as possible.
Dispatches from CES 2019: The Future in the Kickoff
Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.
Dan Feinberg: A CES 2019 Preview
Dan Feinberg gets a first look at the new devices and technologies being shown this year at the innovation world's biggest expo. Read on.
Upcoming 2019 Trade Show Season in the USA
A look back at Dan Feinberg's predictions made a year ago, and a preview of what we might see at CES 2019 along with some new projections. CES—the first, largest, and most influential and predictive of global electronics trends of this group of trade shows.
RTW SMTAI: LiloTree's Shah Discusses Hyper Corrosion, Black Pad in ENIG
Dr. Kunal Shah, chief scientist and president of LiloTree, talks about the major issues in ENIG, such as hyper corrosion—which can be very benign, or very extreme, resulting to black pad—and how LiloTree is helping to improve the performance and efficiency of the ENIG finish processes.
Powering the Flexible World
From 2019 we will come to a world with flexible electronics and batteries to power these devices have attracted tremendous attention. These devices may require batteries with special mechanical properties or form factors.
RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends
Lenora Clark, director for end-user applications at MacDermid, discusses some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.
Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
Three New Mars2020 Rover Technologies: What Powers the “Body Parts” on the Mars2020 Rover?
The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples and cache them on the surface for potential return to Earth by a future mission.
CES 2018: Disruptive Technologies and Fun PC Stuff
Two disruptive technologies that we have been covering for the last few years are 3D printing—especially as it pertains to PCB fab—and autonomous driving. 3D printing has been around for a few years, but it seems like 3D printers were introduced to CES very recently. This year there were almost 50 exhibitors showing their latest offerings. Most of them were in the LVCC in the north hall at the 3D Printing Marketplace.
CES 2018, Augmented Reality and Much More
The actual CES show is spread across many locations in Las Vegas. The main exhibit halls are at or near to the Las Vegas Convention Center with three buildings, two floors each, all filled with hundreds of booths. Then there is The Sands Convention Center with multiple halls filled to the brim and hotels with their own convention centers and floors of exhibitor suites. With almost 200,000 in attendance, all locations are very busy.
Planning a PCB: Signal Integrity and Controlled Impedance Considerations
Knowledge and experience are the two key elements when planning a PCB. Today’s PCB designers must have far more knowledge and understanding of the PCB production process than in the past. This is especially important when they plan and how they plan the stackup, via span, routing and power distribution.
HDI’s Beneficial Influence on High-Frequency Signal Integrity
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).
Whelen Engineering, Two Years Later
If you know anything about this unusual (and extremely private) company, you probably read it right here at I-Connect007. Whelan Engineering’s truly unique PCB manufacturing operation is the result of a company initiative to bring their PCB needs back into the States—and do so at a cost savings. It has been quite a success, largely due to the efforts of brainchild Alex Stepinski, now VP−PCB at Whelen. The company is still in the thick of manufacture, includingan expansion of the PCB facility.
Victory Giant Technology: The Qualified Forerunner of PCB Smart Factories
The topic of the July issue of PCB007’s China Online Magazine is “Automatic PCB Factories,” focusing on the pressures of cost, delivery time and process, and the irreversible trend toward automated PCB factories. Centering on this theme, we interviewed Andy Zhou, COO of Victory Giant Technology (HuiZhou) Co. Ltd., the first domestic PCB manufacturer who carries out large-scale implementation of intellectualization throughout the factory.
I-Connect Survey on Process Step Elimination: What is More Important for Productivity?
Is utilizing the best technology out there the most important factor in improving productivity? Or is it automating certain, if not all, processes in your production? What about employee morale, what is its impact on the overall productivity of your line?
Designing with Ultra-Thin Flexible Printed Circuit Boards
Designing with flexible PCBs is not much different from doing the same with rigid boards, except that the designer must account for the mechanical complexity associated with flex circuits. For instance, a flexible PCB can tear if flexed beyond its capability during installation. Therefore, it is very important to create a mechanical model of the PCB and test it for a proper fit, before taking up the electrical design.
Thin Film NiP Embedded Resistors in Heater Applications
There has been a growing adoption of NiP thin film resistors as heater elements from a diverse group of users including those in the aerospace, defense, high-end computing and the volume consumer electronics market. A novel application has now grown from the validation and reliability testing perspective. Using embedded resistors as heaters to do high-temperature or burn-in testing eliminates the need for thermal chambers.
Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization
Hofmann Leiterplatten GmbH has developed a wide range of products in the last 25 years. New manufacturing know-how has been developed in fabricating organic PCB with embedded devices. A special name, AML (active multilayer), was created to differentiate the surface mount devices (SMD) and the device embedded technology (DET) PCBs. Manufacturing processes that are not typical for standard PCB fabrication shops has been developed.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
Eagle Electronics: Success through 'Building Everything'
During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
CES 2017: Press Day, LaunchIt and Showstoppers
Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.
Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
Orbotech's Shavi Spinzi speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers. He explains why the PCB manufacturing industry needs to move to Industry 4.0, and discusses how Orbotech can help them in their Industry 4.0 journey.
From Afterschool Robotics Club to FIRST Competitions
Seven years ago, Joel Bruxvoort, a science teacher at Jefferson High School in Daly City, California, started a robotics club as an afterschool program. Now, his club has two teams competing in events for FIRST (For Inspiration and Recognition of Science and Technology), an international youth organization developed to advance STEM subjects around the world.
RTW IPC APEX EXPO: Microcraft Discusses Eliminating Process Steps and Minimizing Set-Up Times
Zachary Cliff, outside sales account manager at MicroCraft, speaks with I-Connect007 guest editor Steve Williams about how their inkjet printers are helping customers minimize setups, eliminate process steps, and thereby save a lot of time and labor fees.
RTW IPC APEX EXPO: ASC's Vardya Talks Strategies for Growth
American Standard Circuits CEO Anaya Vardya talks with I-Connect007 guest editor Steve Williams about the company’s strategies for continued growth, such as expanding their product mix, and investing in equipment, software and people.
CES: Day One
CES Unveiled is the official media event for CES. It is the first official happening of what promises to be a very busy and fascinating week. At this event, members of the press get to preview a number of innovative startups as well as some new products from a few established global brands.
What is the Internet of Things and Why Should it Matter to Us?
It is often surprising how closely our science fiction novels and movies model the future. The Internet of Things (IoT) and big data may prove to be an excellent example of this phenomenon. Coined in 1999 by Kevin Ashton (the RFID standards pioneer), the IoT is one of the least descriptive monikers of all time for something very important in the history of technology.
Conducting Very High Currents through PCB Substrates at High Ambient Temperatures
One of the major challenges of our time is climate change and the associated need to reduce greenhouse gas emissions. The requirement to reduce CO2 emissions has brought about significant changes in the area of power generation, and also in the area of mobility. Supported by a favorable subsidy policy, the solar boom originated in Germany and quickly spread widely across Europe.
HKPCA & IPC Show 2015 Kicks Off in Shenzhen China
Barry Matties talks with Daniel Chan, executive director of the HKPCA, about the organization’s expanded global outreach. They discuss what attendees can expect from this South China trade show that has become one of the biggest and most important shows in the PCB industry.
All About Flex: Plated Through-holes in Flexible Circuits
There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.
Cars, Cars, Cars!
The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.
Agricultural Drones and Flexible Circuits
Agricultural drones are expected to have a significant impact on farming over the next few years. In the article mentioned above, the drone’s ease of use and affordability make this a tool that virtually every farmer could employ. One major complementary technology to the drone is the advances in imaging technology and analysis. Specifically, the agricultural drone gives farmers data analysis capability that they have not had before.
Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect
In this article, Joan Vrtis highlights the current and forward-looking interconnect technologies enabling the stream of amazing new smart wearable electronic devices connecting the user to their personalized experience.
Flexible and Stretchable Circuit Technologies for Space Applications
This article describes two original technologies developed at imec-CMST--the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI)--and how they could be offering new form factors with increased functional density, as well as improved reliability in harsh environments .
Novel High-Performance Substrate for Stretchable Electronics
A cornerstone feature of any viable stretchable material is its ability to return to zero after stretching. This article talks about a new transparent, high-performance thermal setting stretchable material that could open doors to a range of new and innovative products.
HDPUG Demonstrates Benefits of Cooperative R&D
The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
The Flex-to-Fit Approach
The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.
An Optical Update with TTM
Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.
Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market
I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.
Are There Advantages to Changing Your Registration System?
I-Connect007 Publisher Barry Matties recently had a conversation with DIS's Tony Faraci at IPC APEX EXPO 2015, to learn more about their pinless registration system. What was most interesting to Barry are the potential advantages a pinless system offers and if so, why the process has not been widely adopted.
How 3D Printing Will Impact PCB Fabrication
In the near future, we will enter an era where electronic devices are printed, rather than assembled. They will be fabricated layer-by-layer as a single object, rather than assembled from separate mechanical, electrical, and optical parts. This article finds out the implications 3D printing will have on PCB manufacturing.
Mentor: PCB Technology Leadership Award Winners
Continuing its tradition of promoting and recognizing PCB design excellence, Mentor has announced the winners of its 25th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the EDA industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.
Thin PCBs for Smart Phones: Technology and Reliability Considerations
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.
Basic Principles of Polymer Thick Film Flexible Circuits
Polymer thick film circuits are similar to their rigid and flexible counterparts; however, because of the materials and processes, they have their own very specific design rules. Because most PTF processing is most commonly based on screen printing technology, the limits of design are intrinsically linked to the printed ink's processing considerations and limitations.
Press Release Tips
Copyright © 2019 I-Connect007. All rights reserved.