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Deep Into Technology at Compunetics
05/24/2017 | Compunetics
Book Recommendation: You’ve Got 8 Seconds—Communication Secrets for a Distracted World
05/23/2017 | Dan Beaulieu, D.B. Management Group
Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and Their Road Show
05/22/2017 | Patty Goldman, I-Connect007
Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future
05/12/2017 | Tulip Gu, I-Connect007
Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation
05/08/2017 | Steve Vetter, Richard Snogren and John Timler, Ph.D.
PCB :: Test & Inspection
Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future
The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
The Near and Far Future for Orbotech and Inspection
Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.
RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density
Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
Orbotech's Shavi Spinzi speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers. He explains why the PCB manufacturing industry needs to move to Industry 4.0, and discusses how Orbotech can help them in their Industry 4.0 journey.
Transline Technology is Bullish on Design Engineers
At the International Microwave Symposium, I met with Chris Savalia, vice president and co-owner of Transline Technology. We discussed the California-based fabricator’s philosophy, the challenges of the RF and microwave markets, and the need to engage with young design engineers now.
Catching up with Artnet Pro’s Meir Polack
Interested in all aspects of our industry, I have lately been especially focused on our suppliers, because more and more of my board shop clients are concerned about their vendor support chain as more of them are either reducing their presence in North America or leaving altogether. I am also keenly interested in companies whose mission it is to help the PCB industry survive, especially a company that does not abandon the “little guys,” but rather is focused on helping those smaller companies to compete with the giants whose goal is to run them over.
A Day with Pete (Starkey)
Usually the one conducting the interviews, I-Connect007’s own Pete Starkey recently found himself on the other side of the microphone when I spent time with him in his hometown of Market Bosworth, England. There, between hiking and gardening, we found time to discuss Pete’s rich history in the PCB industry and the many changes and surprises he’s seen in the manufacturing process over the years.
Let's Talk Testing: Seeing is Believing in Fractographic Analysis
One of the more common types of failure analysis is the investigation of something that has broken. For this column, we will be discussing a broken material, or, more commonly, a fractured or cracked material.
Patty's Perspective: Delving into Test and Inspection
I’ve always been a wet processing person, if not always in a PCB shop, at least at heart. My undergraduate degree is in chemistry and I cut my teeth working on electroless copper processes (just a metaphor, mind you!). Testing, testing and more testing in R&D can be sooo boring and repetitive.
The Newest Flex Shop in the U.S.
I-Connect007 sales team member Angela Alexander and I recently got a tour of Lenthor’s new Silicon Valley flex board shop and then sat down with President and CEO Mark Lencioni to discuss the new flex facility, the markets, management, and the future.
EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry
Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.
RTW IPC APEX EXPO: Bob Neves Talks Trends Driving Test Services in China
Bob Neves, chairman and CTO of Microtek Laboratories China, talks with I-Connect007 guest editor Dick Crowe about a variety of issues, including the growing automotive electronics and military/aerospace industries, and how companies in the US that are buying boards and assemblers buying their materials in China can benefit from his company's test services locally.
Orbotech’s Latest Technology at IPC APEX EXPO
Orbotech presented their latest new technologies at IPC APEX EXPO 2016. The Nuvogo 1000 is a higher power version of their multi wavelength direct imaging machine, as well as their new automated optical shaping technology which can add copper deposition to an otherwise defective PCB. I met with Orbotech’s Micha Perlman in their booth on the show floor, to learn more.
Orbotech’s Gaby Waisman: 'The Future is Digital'
I sat down with Orbotech President Gaby Waisman at CPCA in Shanghai recently, and he offered a comprehensive explanation of why digitalization is truly the future, especially with regard to increasing throughputs. We also discussed Orbotech’s company vision and products, as well as its role in “helping to drive the industry into fully digitalized imaging technology.”
Rex Rozario, Part 2: The Beat Goes on: New Developments at Exeter, the Music Scene, and China
In Part 2 of I-Connect007’s multi-part interview with PCB industry icon Rex Rozario, we continue to discover more about what has made Graphic PLC the company it is today. Rex explains the work they’re doing with Exeter University, Graphic’s success in China, and his own personal experience in the UK music scene.
Orbotech’s New Products and Equipment Offerings Highlighted at HKPCA
At the recent HKPCA show, members of the media and some of the leading figures at Orbotech joined together for a Q&A session to learn more about some of the company’s new product rollouts, how their vast equipment offering has set them up to take on Industry 4.0, and their best estimate on when we’ll see 3D printed circuit boards reach mass production levels.
How North American Fabricators Benefit from Attending HKPCA
Two New Englanders in Shenzhen. It sounds like the title of a play, doesn’t it? Headlining the bill is Peter Bigelow of IMI, who explains to me why even small American manufacturers benefit from attending large Chinese shows like the HKPCA. He’s joined by fellow New Englander Alex Stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge.
An Interview with Gene Weiner at HKPCA
Barry Matties and Stephen Las Marias recently met with industry veteran Gene Weiner, president of Weiner International Associates to get his take on the HKPCA show, industry trends and his outlook for 2016.
In this article, industry veteran Gene Weiner looks back at some of the industry highlights in 2015, and ponders on the challenges and opportunities to expect this year. He also highlights recent industry events, including the 2015 International Printed Circuit & APEX South China Fair and SEMICON Japan.
Catching up with Winonics’ Mark Eazell
I have always thought of Winonics as one of the hidden gems of the North American PCB industry. Their well-equipped and well-laid-out facility in Brea, California is one of the more impressive looking PCB facilities in North America today. Winonics is one of three PCB companies owned by JR Controls, the other two being Cosmotronic and Bench2Bench. I had the opportunity to talk with Mark Eazell, the general manager at Winonics, who also oversees the operation of all three JR Controls’ PCB companies.
productronica 2015: Orbotech's Nuvogo 1000 Brings High Speed to Solder Mask LDI
28 watts of laser power enables the Nuvogo 1000 dual wavelength direct imaging system to achieve production throughput for solder mask up to 40 double-sided panels per hour, while retaining the versatility to image inner layer and outer layer features as fine as 24 microns.
productronica 2015: atg Shows Off the Latest in Automated Inspection Equipment
Peter Brandt, sales manager with atg Luther & Maelzer, tells I-Connect007’s Pete Starkey all about their automated inspection equipment that is well-suited for both small and large batch operaions. Watch this video from the floor of productronica to see the equipment in action while Brandt discusses the embedded technology market that is taking off.
American Standard Circuits Taking Business to New Heights
PCB007 Managing Editor Patty Goldman sat down with American Standard Circuits President Anaya Vardya at the recent SMTAI show and conference in Rosemont, IL. Anaya wanted to share all the great new things going on at his company. Among the topics they discussed: new equipment, new processes, new people, and what it all means for ASC’s growth.
Breaking the Bottleneck: Electrical Test Cycle Time Reduction
From the conception of the design and issuance of the procurement document, dozens of processes must take place before the PCB is shipped for assembly. This article looks at reducing the cycle time in electrical test of PCBs, and highlight strategies to do so.
Cars, Cars, Cars!
The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.
HDPUG Demonstrates Benefits of Cooperative R&D
The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
An Interview with Gardien Group’s Jason Fraser
Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.
Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures
The HDI and substrate fixture technology is truly an art form. Long gone are the luxuries of just using a plated drill file on an old drill machine and automatically dropping pins. Even the multi-plate fixtures that are used today have no comparison to the critical manufacturing requirements of the HDI and substrate fixtures.
ATG’s Swen Fleischer on China: the Market, the Future and CPCA
ATG Luther & Maelzer’s Swen Fleischer, vice president and GM of sales, Greater Taiwan/China, sat down with I-Connect007 Publisher Barry Matties at CPCA 2015. Among the several topics discussed are automation in China, the Chinese market in general and areas of future growth, and the effect of three major shows a year on the turnout at CPCA.
Automation in Probe Testing Provides Throughput Benefits
The general migration from grid to prober for bare board testing continues, and even high-volume users now see the benefits of automation. Klaus Koziol explains how package testing is driving prober development.
2015 EIPC Winter Conference, Munich: Day 1 Review
Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.
Mentor: PCB Technology Leadership Award Winners
Continuing its tradition of promoting and recognizing PCB design excellence, Mentor has announced the winners of its 25th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the EDA industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.
A Conversation with Gaby Waisman, Orbotech, Ltd.
During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.
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