2020 EIPC Winter Conference, Day 1

Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

Meet Sharon Cohen, I-Connect007 Columnist

Meet Sharon Cohen, one of our newest I-Connect007 columnists! Sharon’s columns will share Orbotech’s expert knowledge on how to maximize the value of manufacturing systems. Mr. Sharon Cohen is the president of Orbotech West, where he is responsible for the PCB division’s organization in North America and EMEA (Europe, Middle East, and Africa).

IPC APEX EXPO 2020: Day 1 Review

2020 was a special anniversary year for IPC APEX EXPO: “Celebrating 20 years of excellence in electronics” was the tagline. Pete Starkey provides a review of the Day 1 activities on the show floor and beyond.

Four Reasons to Choose Polycapillary Optics for XRF Coatings Analysis

As electronic components continue to shrink and increase in complexity, metal finishes on these components need to be plated onto smaller features. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition because it’s non-destructive, fast and straightforward to use.

CES: Sands Show Floor and ShowStoppers

Every year at CES, ShowStoppers and a similar event, Pepcom, demonstrate many new devices and technologies. Again, some will become devices we can’t live without, and some you will never hear about again. Seeing all of these new ideas is one of the highlights of attending CES. Enjoy this look at a potpourri of new, innovative high-tech products.

Future Trends in Flying Probe Testing

Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.

New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications

Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.

EIPC Summer Conference 2019, Day 2

In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.

The State of Plating

Increasingly, PCB design technology utilises buried and blind via holes and plated via fill is also becoming more and more common. The buried and blind holes mean that the loading on the plating equipment is multiplied by the number of different inner layer connections. The same technology means that equipment needs to deal with thinner and thinner materials.

How to Feed Test Data Back to Engineering for Process Improvement

Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.

Virtual Verification Station From CIMS Enhances AOI Capabilities

At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.

Microtek Labs: Providing Trusted Testing in the Chinese Market

On a recent visit to Microtek Laboratories' Changzhou facility, Barry Matties, publisher, and Edy Yu from the I-Connect007 China team spoke with chairman and CTO Bob Neves about the changes he has seen living and doing business in China over the past 15 years, and the increased importance of standards and testing as China moves into manufacturing more high-reliability products.

Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

At the recent CPCA Show in Shanghai, Orbotech celebrated having over 100 of their Orbotech Diamond™ direct imaging machines in the marketplace. Barry Matties caught up with Meny Gantz—VP of marketing for Orbotech’s PCB division—to talk about the drivers behind the success of Orbotech Diamond systems before turning the conversation toward the future and Industry 4.0.

EIPC Winter Conference, Day 1

EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

Catching Up with Artnet Pro

I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.

Agfa: Staying Ahead of the Technology Curve

In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.

It’s Time to Retire ROSE Testing

Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.

The Institute of Circuit Technology Annual Symposium 2018

ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.

Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.

Weiner’s World—March 2018

SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."

EIPC’s Winter Conference in Lyon, France: Day 2 Review

The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

Blue Sky for Eagle Electronics

I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

In Terms of Experience, a 10,000-foot View of China

In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.

Weiner’s World—December 2017

Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.

Automation and Traceability Critical for High-Throughput Probe Testing

Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.

A Unique Norwegian Approach to Serving Customers

I met a lot of interesting people at productronica, with an assortment of different products on display. Such was my visit with Oyvind Tafjord, CEO of Visitech. His purpose at the show was to meet with his customers, so nothing unusual about that. But his customers also had booths (or stands, as they call them), which is an advantage for him, as he explains here.

AGFA: From Film to Inkjet Solder Mask

The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.

I-Connect Survey on Process Step Elimination: Cycle Time Spent on Final Inspection

In our recent survey on process step elimination for the upcoming issue of The PCB Magazine, one of the questions asked was the percentage of total cycle time spent on final inspection. Around half of the respondents answered they only spend generally between 1% and 5% of their total cycle time doing final inspection of their products.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future

The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.

A Conversation with Gene Weiner

In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.

The Near and Far Future for Orbotech and Inspection

Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.

RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density

Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.

Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0

Orbotech's Shavi Spinzi speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers. He explains why the PCB manufacturing industry needs to move to Industry 4.0, and discusses how Orbotech can help them in their Industry 4.0 journey.

Transline Technology is Bullish on Design Engineers

At the International Microwave Symposium, I met with Chris Savalia, vice president and co-owner of Transline Technology. We discussed the California-based fabricator’s philosophy, the challenges of the RF and microwave markets, and the need to engage with young design engineers now.

Catching up with Artnet Pro’s Meir Polack

Interested in all aspects of our industry, I have lately been especially focused on our suppliers, because more and more of my board shop clients are concerned about their vendor support chain as more of them are either reducing their presence in North America or leaving altogether. I am also keenly interested in companies whose mission it is to help the PCB industry survive, especially a company that does not abandon the “little guys,” but rather is focused on helping those smaller companies to compete with the giants whose goal is to run them over.

A Day with Pete (Starkey)

Usually the one conducting the interviews, I-Connect007’s own Pete Starkey recently found himself on the other side of the microphone when I spent time with him in his hometown of Market Bosworth, England. There, between hiking and gardening, we found time to discuss Pete’s rich history in the PCB industry and the many changes and surprises he’s seen in the manufacturing process over the years.

Let's Talk Testing: Seeing is Believing in Fractographic Analysis

One of the more common types of failure analysis is the investigation of something that has broken. For this column, we will be discussing a broken material, or, more commonly, a fractured or cracked material.

Patty's Perspective: Delving into Test and Inspection

I’ve always been a wet processing person, if not always in a PCB shop, at least at heart. My undergraduate degree is in chemistry and I cut my teeth working on electroless copper processes (just a metaphor, mind you!). Testing, testing and more testing in R&D can be sooo boring and repetitive.

The Newest Flex Shop in the U.S.

I-Connect007 sales team member Angela Alexander and I recently got a tour of Lenthor’s new Silicon Valley flex board shop and then sat down with President and CEO Mark Lencioni to discuss the new flex facility, the markets, management, and the future.

EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry

Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.

RTW IPC APEX EXPO: Bob Neves Talks Trends Driving Test Services in China

Bob Neves, chairman and CTO of Microtek Laboratories China, talks with I-Connect007 guest editor Dick Crowe about a variety of issues, including the growing automotive electronics and military/aerospace industries, and how companies in the US that are buying boards and assemblers buying their materials in China can benefit from his company's test services locally.

Orbotech’s Latest Technology at IPC APEX EXPO

Orbotech presented their latest new technologies at IPC APEX EXPO 2016. The Nuvogo 1000 is a higher power version of their multi wavelength direct imaging machine, as well as their new automated optical shaping technology which can add copper deposition to an otherwise defective PCB. I met with Orbotech’s Micha Perlman in their booth on the show floor, to learn more.

Orbotech’s Gaby Waisman: 'The Future is Digital'

I sat down with Orbotech President Gaby Waisman at CPCA in Shanghai recently, and he offered a comprehensive explanation of why digitalization is truly the future, especially with regard to increasing throughputs. We also discussed Orbotech’s company vision and products, as well as its role in “helping to drive the industry into fully digitalized imaging technology.”

Rex Rozario, Part 2: The Beat Goes on: New Developments at Exeter, the Music Scene, and China

In Part 2 of I-Connect007’s multi-part interview with PCB industry icon Rex Rozario, we continue to discover more about what has made Graphic PLC the company it is today. Rex explains the work they’re doing with Exeter University, Graphic’s success in China, and his own personal experience in the UK music scene.

Orbotech’s New Products and Equipment Offerings Highlighted at HKPCA

At the recent HKPCA show, members of the media and some of the leading figures at Orbotech joined together for a Q&A session to learn more about some of the company’s new product rollouts, how their vast equipment offering has set them up to take on Industry 4.0, and their best estimate on when we’ll see 3D printed circuit boards reach mass production levels.

How North American Fabricators Benefit from Attending HKPCA

Two New Englanders in Shenzhen. It sounds like the title of a play, doesn’t it? Headlining the bill is Peter Bigelow of IMI, who explains to me why even small American manufacturers benefit from attending large Chinese shows like the HKPCA. He’s joined by fellow New Englander Alex Stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge.

An Interview with Gene Weiner at HKPCA

Barry Matties and Stephen Las Marias recently met with industry veteran Gene Weiner, president of Weiner International Associates to get his take on the HKPCA show, industry trends and his outlook for 2016.

Weiner's World

In this article, industry veteran Gene Weiner looks back at some of the industry highlights in 2015, and ponders on the challenges and opportunities to expect this year. He also highlights recent industry events, including the 2015 International Printed Circuit & APEX South China Fair and SEMICON Japan.

Catching up with Winonics’ Mark Eazell

I have always thought of Winonics as one of the hidden gems of the North American PCB industry. Their well-equipped and well-laid-out facility in Brea, California is one of the more impressive looking PCB facilities in North America today. Winonics is one of three PCB companies owned by JR Controls, the other two being Cosmotronic and Bench2Bench. I had the opportunity to talk with Mark Eazell, the general manager at Winonics, who also oversees the operation of all three JR Controls’ PCB companies.

productronica 2015: Orbotech's Nuvogo 1000 Brings High Speed to Solder Mask LDI

28 watts of laser power enables the Nuvogo 1000 dual wavelength direct imaging system to achieve production throughput for solder mask up to 40 double-sided panels per hour, while retaining the versatility to image inner layer and outer layer features as fine as 24 microns.

productronica 2015: atg Shows Off the Latest in Automated Inspection Equipment

Peter Brandt, sales manager with atg Luther & Maelzer, tells I-Connect007’s Pete Starkey all about their automated inspection equipment that is well-suited for both small and large batch operaions. Watch this video from the floor of productronica to see the equipment in action while Brandt discusses the embedded technology market that is taking off.

American Standard Circuits Taking Business to New Heights

PCB007 Managing Editor Patty Goldman sat down with American Standard Circuits President Anaya Vardya at the recent SMTAI show and conference in Rosemont, IL. Anaya wanted to share all the great new things going on at his company. Among the topics they discussed: new equipment, new processes, new people, and what it all means for ASC’s growth.

Breaking the Bottleneck: Electrical Test Cycle Time Reduction

From the conception of the design and issuance of the procurement document, dozens of processes must take place before the PCB is shipped for assembly. This article looks at reducing the cycle time in electrical test of PCBs, and highlight strategies to do so.

Cars, Cars, Cars!

The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.

HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

An Interview with Gardien Group’s Jason Fraser

Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.

Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures

The HDI and substrate fixture technology is truly an art form. Long gone are the luxuries of just using a plated drill file on an old drill machine and automatically dropping pins. Even the multi-plate fixtures that are used today have no comparison to the critical manufacturing requirements of the HDI and substrate fixtures.

ATG’s Swen Fleischer on China: the Market, the Future and CPCA

ATG Luther & Maelzer’s Swen Fleischer, vice president and GM of sales, Greater Taiwan/China, sat down with I-Connect007 Publisher Barry Matties at CPCA 2015. Among the several topics discussed are automation in China, the Chinese market in general and areas of future growth, and the effect of three major shows a year on the turnout at CPCA.

Automation in Probe Testing Provides Throughput Benefits

The general migration from grid to prober for bare board testing continues, and even high-volume users now see the benefits of automation. Klaus Koziol explains how package testing is driving prober development.

2015 EIPC Winter Conference, Munich: Day 1 Review

Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.

Mentor: PCB Technology Leadership Award Winners

Continuing its tradition of promoting and recognizing PCB design excellence, Mentor has announced the winners of its 25th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the EDA industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.

A Conversation with Gaby Waisman, Orbotech, Ltd.

During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.