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More Than a Word: Solder Mask
08/15/2018 | Patty Goldman, I-Connect007
Calumet Electronics on IMPACT 2018
08/14/2018 | Patty Goldman, I-Connect007
Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme
08/10/2018 | Jin Erbing, Joint Stars Technology Co., Ltd
Advanced Copper Plating Process for Any Layer Via Fill Applications with Thin Surface Copper
08/07/2018 | Saminda Dharmarathna, Christian Rietmann, et al.
Book Recommendation: The Introvert’s Edge
08/03/2018 | Dan Beaulieu
PCB :: Suppliers
Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
Advanced Stackup Planning with Impedance, Delay and Loss Validation
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?
Susy Webb: Training the New Generation of Designers
For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.
Agfa: Staying Ahead of the Technology Curve
In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.
Characteristics of New Electroless Au/Pd/Au Process for Fine-Line Applications
The characteristics of electroless gold/palladium/gold (IGEPIG) deposit, which has been newly developed for fine-line application as electroless nickel-phosphorus (EN) free, has been compared with that of conventional electroless Ni-P/Pd/Au (ENEPIG) deposit and electroless Pd/Au (EPIG) deposit.
Patty’s Perspective: Staying Current on Wet Processes
This month, Mike Carano’s “Trouble in Your Tank” column on troubleshooting PTH failure mechanisms fit well with our wet processing topic. We hope you benefit from his practical knowledge and are storing his columns for future reference! Our final column this month comes from Elmatica’s Didrick Beck. The subject is Lean manufacturing and the differences between standard and non-standard product lines. Good information to know.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.
Flying Probe Testing: It’s about Speed and Stability Says MicroCraft
The I-Connect007 team had the pleasure of meeting with Takayuki Hidehira at the MicroCraft booth at productronica, where they had on display their new eight-probe flying tester, fully equipped with autoloader and new ease-of-use software. Takayuki discusses where flying probe testers currently stand in the market and MicroCraft’s observation of the rise of captive PCB shops in Japan.
Catching up with… Artnet Pro
I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.
PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.
5G—Generation after Generation
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
Catching up with Fineline-Global N. American CEO Eran Navick
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.
The Institute of Circuit Technology Annual Symposium 2018
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.
Experts Discussion: What Does 5G Mean to Materials and EDA Tools?
Whether we’re ready for it or not, 5G technology is coming. We decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.
RTW CPCA Show: AWP Discusses Whelen Engineering Project Success
At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.
Experts Discussion with John Talbot, Tramonto Circuits
For this first issue of Flex007 Magazine, we interviewed John Talbot, president and owner of Tramonto Circuits. Headquartered in metro Minneapolis, Minnesota, Tramonto manufactures flexible and rigid PCBs for a variety of industry segments. Editors Andy Shaughnessy, Patty Goldman and Stephen Las Marias asked John to discuss the challenges and opportunities in the world of flexible circuits, and some of the trends he’s seeing in this market.
Drilling and Routing Machines: Taking Control
Once driven by hardware, the controller industry for PCB drilling is now one being driven primarily by software, so says Holger Dornau, of SIEB & MEYER. Barry Matties sat down with Holger at the CPCA show in Shanghai to discuss CNC drilling and routing machine controllers and why It's becoming more and more important for fabricators to consider.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
Triangle Labs: Covering the Niche Market of Large Boards
I recently had the opportunity to speak with John-Michael Gray, president of Triangle Labs. We had quite a discussion on their rather unique capability of building large-format PCBs and multilayers—perhaps the largest PCBs in the world.
RTW CPCA: Fischer Discusses Automation, Industry 4.0
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, speaks with Editor Stephen Las Marias about the latest improvements in their coating thickness test systems to help customers in their automation and Industry 4.0 journey.
Schmid Looks to the Future for Industry 4.0 and More
I met with Rüdiger Lange, CSO at Schmid Group, in their spacious, comfortable booth at productronica. We discussed the current capital equipment market and Schmid’s business direction for the future while watching some of their new technology in action.
Setting the Record Straight: CEO Asher Levy on the Future of Orbotech
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
GreenSource: Good for the Industry, Good for the World
Whelen Engineering has recently spun off their new printed circuit manufacturing facility to service the merchant market as a new business entity, GreenSource Fabrication LLC.
Everyone is a Customer; Everyone is a Supplier
We’ve all heard the cliché: What goes around, comes around. I’ve always felt that was especially true in our industry, with the frequent job changes people make—much accelerated in recent years but always a factor, since I can remember.
Understanding Your Customers
Understanding your customers may seem like a no-brainer, but conversations with company leaders across various industries the past five years have demonstrated to me just how difficult this can be in practice.
IPC 6012-DA Revisions: The Approach to Cleanliness, Thickness, Inspection, and Wicking
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.
CML’s Mission: Providing Solutions for Customers—Including the Right Supplier
During IPC APEX EXPO, I met with CML USA General Manager Ivan Wong, who was a first-time attendee at the San Diego event. CML is a worldwide PCB sourcing solutions provider with offices around the globe, but the company just recently entered the U.S. market. I spoke with Ivan about CML’s mission and the U.S. office’s plans.
Conversations on the Floor: IPC APEX EXPO 2018
This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.
The Vast Offerings in Laminate Technologies from TUC
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
From Math to Marketing: Orbotech CMO’s Worldview of the Industry
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
Weiner’s World—March 2018
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
RTW IPC APEX EXPO: Arlon Achieves IPC Validation Services Accreditation
John Wright, quality manager at Arlon Electronic Materials, discusses how the company recently achieved IPC validation services accreditation.
RTW IPC APEX EXPO: Matrix Discusses Advanced Automation Equipment
Matrix's Fred Long discusses advanced automation equipment for the PCB industry, including new cleaning technology for panels and dry film laminating equipment.
RTW IPC APEX EXPO: Ucamco's New Tools for Designers, Fabricators
European Editor Pete Starkey and Ucamco partner Luc Maesen discuss Ucamco's newest solutions for PCB designers and fabricators, YELO (Yield Enhancing Layout Optimizer) and Communic8tor. Both of these products were recently launched for users in the North American market.
RTW IPC APEX EXPO: Bowman—XRF Equipment, New IPC 4552A Spec, and How They Go to Market
Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates
Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
RTW IPC APEX EXPO: Perfect Point’s Recently Developed Coating Technology for Small Drills
VP Shane Stewart describes some recently developed coating technology for small drills that helps improve debris removal and aspect ratio drilling capability.
RTW IPC APEX EXPO: Insulectro Discusses Importance of Helping PCB Shops
Chris Hunrath, VP of technology at Insulectro, discusses their recent expansion of inventory, especially substrate materials, the need for quick access, and the importance of working closely with their customers and OEMs.
Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
RTW IPC APEX EXPO: Uyemura's Chemistry for ENIG, ENEPIG, and EPIG Apps
A unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.
RTW IPC APEX EXPO: Benefits of Outsourcing CAM Operations to a Specialist Provider of Engineering Services
CEO Mehul Dave of Entelechy Global discusses the benefits of outsourcing CAM operations to a specialist provider of engineering services.
RTW IPC APEX EXPO: Benefits of Outsourcing Quality Assurance Options
Niraj Patel describes the benefits of outsourcing quality assurance operations, with specific reference to the alternative business models offered by Gardien for electrical testing.
The Selection of Chemical Etching Equipment for PCB Fabrication
Congratulations! Your process development team has completed its DOEs and is convinced they are ready to scale up. The facilities crew has found space for your new operation or, even better, your manufacturing team will have a newly-built building in which to locate the project.
RTW IPC APEX EXPO: Prototron Moves Offshore
Prototron's Dave Ryder and Russ Adams discuss the company's recent decision to begin manufacturing high-volume jobs overseas. They also discuss some of the partner shops' capabilities, including flex and rigid-flex, which were driven by customer demand.
RTW IPC APEX EXPO: Candor Industries' History and Advanced Circuit Constructions
Founder and president Yogen Patel shares Candor Industries' history and describes some of the non-standard approaches to PCB production the company uses to make advanced circuit constructions.
RTW IPC APEX EXPO: Insulectro Showcases New Low-Loss Materials
Norm Berry, director of laminates and OEM marketing for Insulectro, discusses the company's new low-loss products and resin systems that benefit high-speed, high-frequency PCB designs.
The Time is Right in India
In an interview with Akshinthala Vijayendra of IPC India, he discusses India’s infrastructure under the direction of the new prime minister, where India currently stands versus China, and the pros and cons for any speculative companies deciding whether to expand into this country.
New Year, New Equipment—Right?
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
EIPC’s Winter Conference in Lyon, France: Day 2 Review
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!
Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!
Whelen Engineering and AWP Explain their Unique Collaboration
If there was a buzz word in the PCB hall at productronica this year, it was probably Whelen, as in Whelen Engineering and Alex Stepinski, VP of Whelen’s circuit board division.
Aismalibar on Laminates, Following the Market, and More
At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.
Rogers Continues Expansion into High-Speed Digital Materials
Mahyar Vahabzadeh discusses a paper presented by his colleague Dr. Allen Horn at DesignCon. He also explains some of the different characteristics Rogers has discovered as they move from RF into high-speed digital materials.
CFX: Updates and Developments
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.
Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design
This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.
Solder Limits: Updates for the Age of Surface Mount
Solder limits are one of the fundamental parameters used when evaluating the PCB, solder resists, and metal-clad base materials for safety under the UL Recognition programme.
A Sneak-Peek at IPC APEX EXPO 2018
IPC President and CEO John Mitchell gave I-Connect007 a sneak-peek at the upcoming IPC APEX EXPO, happening in February in San Diego. Mitchell provides a description of this year’s keynote, as well as a few new additions and areas of emphasis. It looks like it will be another packed house, with plenty to see, do, and learn about.
Cicor’s Approach to Miniaturization: Cost of Function, and More
Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.
productronica 2017 Means Connecting to Global Customer Base for Circuit Automation
Circuit Automation’s Tom Meeker joined me for a conversation at productronica 2017 in Munich, to update me about what the company has been doing in solder mask coating equipment.
In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
The Benefits of Coming Together to Form a Global Reach
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.
It’s a Long, Winding and Exciting Road for Automotive Electronics
It was truly a delight to talk with Alun Morgan at productronica this year. He may be the most enthusiastic person in the field of electronics that I have ever met, as you will certainly understand as you read this interview.
Getting the Heat Out
Increasing consumer demands for high performance and the need for high reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing.
CES 2018 Showstoppers: LaunchIt and Press Event
“ShowStoppers LaunchIt is about giving innovative entrepreneurs a shot at getting the attention of angel investors on the lookout for innovation and new ventures. It’s also about gaining additional visibility with other industry influencers and dealmakers, as well as with the press who are always looking for the ‘what’s new’ story at CES.”
Preview: CES 2018 Unveiled
The official CES events started only about 15 hours ago. I have already been to CES Unveiled, an amazing (but somewhat long) NVIDIA press event, and now the Panasonic press conference is soon to begin, launching the Press Day activities. So far, it’s been amazing!
Schmid: Bringing Integrated Solutions to the Market
With China’s recent shift towards quality, the next generation of PCB fabrication equipment must target yields and include the ability to track those yields, says Schmid’s Laurent Nicolet and Demitry Kostouros. Barry Matties recently sat down with these two gentlemen to talk more about the market shift and Schmid’s introduction of their new vertical line aimed at carving a niche in the market.
That’s Hot: Ventec’s Goodwin on Thermal Management
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.
Lamination to Drilling in Minutes: It's New and it's Not
Barry Matties met with Lino Sousa at productronica to check out Pluritec’s new Pluricut HPL machine, which offers an all-in-one solution for flash routing, beveling, measuring, and corner routing. See this machine in action by viewing the attached video content.
Weiner’s World—December 2017
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
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