Logistics Are Frank Lorentz’s Passion
Recently, Barry Matties had the chance to visit Ventec International Group’s German facility in Kirchheimbolanden (KIBO), where he met Frank Lorentz, Ventec’s general manager for the location. Logistics are clearly Frank’s passion. He lives and breathes it. If you spend any amount of time with him, that is abundantly clear. This interview with Frank was conducted after a tour of the KIBO site.
Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision
Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.
Pluritec Takes Industry 4.0 to the Next Level
Pete Starkey and Pluritec’s Nicola Doria, president and CEO, discuss how the structure of Pluritec has developed over the past few years, now including many respected brand names that are long familiar in the PCB fabrication segment. Doria also explains how the company is continuing its implementation of Industry 4.0 processes.
InduBond: Magnetic Induction Lamination
In this video interview, part of the productronica 2019 coverage, we spoke with Víctor Lázaro, R&D manager and technical director at Indubond. Víctor describes Indubond’s innovative methods for heating the boards to effect lamination through magnetic induction. Victor discusses the energy and operational efficiency that an induction method brings to the equipment: thermal profiles.
Future Trends in Flying Probe Testing
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.
Book Review: The Printed Circuit Designer’s Guide to…Executing Complex PCBs
If you are serious about designing complex PCBs (most designs today are far from elementary) and even more serious about doing it right the first time, then this is the book for you. Loaded with guidelines for designing cutting-edge PCBs, this book is filled with real-world examples and tips, tricks, and techniques by some of Freedom CAD’s most experienced designers.
Solder Mask Tack Dry
As a general rule, the tack-dry temperature should be as low as possible; in other words, it should only be as high as necessary. If the temperature is too low, the evaporation rate for the solvent will be to slow, and the solder mask will not dry in a reasonable amount of time. If the temperature is too high, however, the dry time certainly will be excellent, but it could create a solder mask lock-in with repercussions by the developing time.
Why Does the PCB Industry Still Use Gerber?
Every so often, I hear technologists ask why so many PCB designers still use Gerber. That is a fair question. Ucamco has over 35 years of experience in developing and supporting cutting-edge software and hardware solutions for the global PCB industry. Our customers—small, medium, and large PCB fabricators—include the electronics industry’s leading companies, and many of them have been with us for over 30 years. We are dedicated to our industry and excellence in everything we do, which includes our custodianship of the Gerber format.
Meet George Milad, I-Connect007 Columnist
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
Communication, Part 3: Why Do Board Shops Ask So Many Questions?
In Part 3, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits speak with Steve Williams about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages. If you’ve ever wondered why the CAM department asks you so many questions, read on.
Communication, Part 2: Design Data Packages
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.
New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.
The Institute of Circuit Technology Autumn Seminar
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
EIPC Summer Conference 2019, Day 2
In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
Chemcut: Wet Processing Equipment for the Long Haul
Chemcut CEO and General Manager Rick Lies speaks about the growth he has seen in the marketplace over his 18 years in the industry, and how Chemcut has been able to remain competitive in the PCB and photochemical milling spaces. Jerry Reitz, Chemcut’s HES manager, also addresses the current shift towards zero-discharge facilities.
The Advantages of Non-sludge Acid Copper Products
Mike Wood, technical director with Cerambus Asia Pacific, discusses the acid copper product from Cerambus Technology Inc. that doesn't generate sludge during the plating process and operates at higher production output by using higher current density. He talks about why this is important for the state of the vertical continuous plating (VCP) market in Asia, and the trends he’s seeing in that space.
Focusing on Surface Sensitivity for Reliability
At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.
Solder Mask Curing: UV Bump Overview
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.
IPC Reliability Forum Wrap-up With Brook Sandy-Smith
I attended the recent IPC High-Reliability Forum and Microvia Summit in Baltimore, Maryland. The speakers and panelists focused on a variety of topics, but one issue that kept popping up was the failure of some microvias on military and aerospace PCBs. Fortunately, some smart technologists are focusing on determining the cause of these via failures. I asked Brook Sandy-Smith, IPC’s technical education program manager, to give us a quick wrap-up of this event.
How to Feed Test Data Back to Engineering for Process Improvement
Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.
How Changing Cleaning Technologies Affect Reliability
At the recent IPC High-Reliability Forum and Microvia Summit, Andy Shaughnessy spoke with Michael Konrad, founder and president of Aqueous Technologies and a speaker and panelist at the event in Baltimore, Maryland. They discussed Konrad’s presentation and the recent proliferation of cleaning, from solely high-reliability products to Class 1 consumer products.
Virtual Verification Station From CIMS Enhances AOI Capabilities
At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.
Technically Appropriate Material Choices Are Key to Success
Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. Editor Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.
Microtek Labs: Providing Trusted Testing in the Chinese Market
On a recent visit to Microtek Laboratories' Changzhou facility, Barry Matties, publisher, and Edy Yu from the I-Connect007 China team spoke with chairman and CTO Bob Neves about the changes he has seen living and doing business in China over the past 15 years, and the increased importance of standards and testing as China moves into manufacturing more high-reliability products.
DuPont on Materials Challenges and New Opportunities
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.
Creating Stability in Materials Chaos
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.
IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal
Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.
DuPont on New Beginnings and Empowering the Industry
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.
Making Materials Succeed: Past, Present, and Future Trends
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.
Technically Appropriate Material Choices are Key to Design Success
Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.
Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination
Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.
Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas
In an interview with I-Connect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessica Zhang provides an overview of the company and shares new business trends they're seeing, including LEDs, wearable devices, and more.
Alun Morgan on Thermal Management and LEDs in Automotive
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.
SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent
Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.
RTW IPC APEX EXPO 2019: MivaTek Discusses Flatbed LED Direct Imaging Systems
Brendan F. Hogan, managing director for MivaTek Global, and Chris Hrusovsky, VP of business development, give Pete Starkey their outlook on the market for flatbed LED direct imaging systems, report spectacular sales success, and describe their new introductions for large-format, dual-tray and microelectronics systems.
Ventec Focuses on High-mix Manufacturing
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.
Automation on Full Display at Recent China Exhibitions
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.
Hardware and Software in Smart Factories
As smart factories become a part of the present rather than a thing of the future, we will all need to become familiar with related concepts and components. This article is dedicated to various automation protocols, including some new ones just coming on the market, and covers hardware, such as PLCs and machine interfaces, as well as software and network protocols, such as MAPS, SECS/GEM, OML, CFX, IPC-2541, and custom software.