Experts Discussion: Signal Integrity and Impedance Control
When the content gathering for an issue on signal integrity and controlled impedance was officially underway, our I-Connect007 editorial team’s first stop was an “experts discussion” with industry experts: Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries. This teleconference call was a whirlwind at times, but we captured valuable information that we have distilled here, for our readers.
Predictive Engineering: Happy Holden Discusses True DFM
Happy Holden has been involved in DFM for over 45 years, since he first started working at HP and optimized their PCB design and manufacturing processes. Naturally, for this issue, Barry Matties and Andy Shaughnessy made it a priority to get Happy’s thoughts on DFM, and what true DFM entails.
The State-of-the-Art in PCB Pre-production Engineering
If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.
Ventec Shares Their Insights on the Laminate Market, Part I
I-Connect007’s Barry Matties sat down with the COO of Ventec USA/Europe, Mark Goodwin, to discuss the laminate market as a whole, the market segments behind that growth, and how Ventec has positioned itself in the thermal management space.
NEPCON South China 2017 Opens Today
NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.
High-Frequency, High-Speed: an Opportunity for China CCLs to Lead
As a leading Chinese CCL manufacturer, Shengyi Technology has invested 250 million RMB in 2016, for the new Jiangsu Shengyi Special PCB Co. Ltd. facility, which will make high-frequency, high-speed CCL product. We invited Lin Xia, senior marketing director of Guangdong Shengyi Technology Co. Ltd., and assistant general manager of Suzhou Shengyi Sci-Tech Co. Ltd. He will be focusing on why high-frequency high-speed CCL is a good opportunity for China manufacturers to become a worldwide leader in this arena.
I-Connect Survey on Process Step Elimination: What is More Important for Productivity?
Is utilizing the best technology out there the most important factor in improving productivity? Or is it automating certain, if not all, processes in your production? What about employee morale, what is its impact on the overall productivity of your line?
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
Growth Ahead for Flexible Hybrid Electronics Industry
According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary
Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
RTW IPC APEX EXPO: Updates on Formulations for Direct Imaging and Inkjet Technologies
Chris Wall, technical director and Shaun Tibbals, sales and marketing director at Electra Polymers, review latest developments in digital imaging technologies for solder resist. Multi-wave direct imaging systems give more scope to the ink supplier to optimize formulation and offer improved flexibility of operation to the user.
RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.
RTW IPC APEX EXPO: Ventec Talks Benefits of High-Level OEM Tech Team
Managing Director of Ventec Europe, Thomas Michels comments upon the complementary non-copper-clad-laminate, one-stop-shopping opportunities that have resulted from the merger of the TMT business with the Ventec operation, and discusses the benefits of a strong integrated supply chain and a high-level team of OEM applications specialists in building long-term partnerships between Ventec and its customers.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider.
He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: Taiyo Discusses Option for PCB Heat Dissipation—Thermally Conductive Solder Resist
Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.
RTW IPC APEX EXPO: Ventec Discusses CCL Supply Chain Issue
Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.
Real Time with...IPC: MacDermid Enthone Positions Itself to Meet the Needs of the Electronics Supply Chain
Warren Kenzie, Technical Director at Macdermid Enthone, discusses with I-Connect007 Guest Editor Mike Carano the critical need to develop equipment sets that are properly designed to ensure optimal functioning of the production processes. He also noted the need to understand the relationship between materials, chemistry, equipment, and people.
Catching up with…Nessis Inc. President Kathleen Niles
When I checked in on one of my old PCB sales associates recently, he told me that he had a new gig selling the latest and greatest new productivity software tools. He spoke so highly about Nessis Inc. and what their tools could do for companies, especially PCB shops, that I decided to learn more. I arranged to talk with Kathleen Niles, the co-founder and president of Nessis Inc. Here is a portion of that conversation.
Patty’s Perspective: Everything Old is New Again
This month’s issue is all about plating and surface finishes; long ago, that was pretty much my start in the world of printed circuits—wet processing. So this is kind of my home turf—and not, since I haven’t worked in wet processing for some…well, for many years. I’ve always expected that I could hop right back onto the plating room floor and pick right up where I left off all those years ago. Or could I? Have things changed much? Time to read on and see.
Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri of Rogers Corp. speaks with I-Connect007's Stephen Las Marias about the 5G trend and thermal management issues in power electronics and how they will impact PCB materials requirements.
Ladle on Manufacturing: Making Suppliers Work for You
Every company has its own way of doing things. For some, the engineering team develops a detailed specification for the equipment they would like to purchase and this is put out to multiple suppliers for tender, along with full documentation for the commercial terms that will apply to the purchase. At the other end of the scale, a machine inquiry can be a simple phone call: “How much for a new machine?”
New Tools Mean More Designer Control for High-Speed PCBs
In the last hour of the electronica exhibition in Munich, Pete Starkey finally got the opportunity to sit down with Martyn Gaudion, Managing Director of Polar Instruments. They discussed the changing state of PCB design, and how the newest software tools allow PCB designers and engineers to have more control when designing high-speed PCBs.
Aismalibar on Markets, Materials, and the Increase in Copper Prices
As a European laminate provider specializing in insulated metal substrates and thermal management, Aismalibar is often put in the demanding position of catering to some of Europe’s toughest customers, including the automotive industry. Pete Starkey and Barry Matties caught up with Director General Eduardo Benmayor at the most recent Electronica trade show to learn more about the company and get his take on the current state of the IMS marketplace.
KCE Group: A Thailand-Based PCB Manufacturer with a Growing Global Footprint
Recently, while at electronica in Munich, Germany I-Connect007's Judy Warner met KCE America President Rick Rhodes, and Joe Yeo of KCE Group. They discuss the unique challenges and opportunities that come with the rigorous automotive market, and explain why they continue to enjoy explosive growth.
A Scientific Response to Mr. Laminate Tells All
We read with interest Doug Sober’s recent Mr. Laminate Tells All column, "The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware." The article raises interesting questions about the IPC 4101 classification system, primarily, how is a pure resin defined?
Rogers on the Booming Wireless Infrastructure Market
With the advent of 5G and next generation antennas, the already booming wireless infrastructure market is slated for continued growth through 2021, and as the primary material supplier for this sector, Rogers Corp. must continue to meet the technological demands of the Verizons and AT&Ts of world.
Mr. Laminate Tells All: The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware
At the most recent IPC meeting held in Rosemont, Illinois, one of the hot topics of discussion at the Laminate and Prepreg Subcommittee was the three polyimide specification sheets. The header portion for the three polyimide-based copper-clad laminates and prepregs are shown in Figure 1, for easy comparison of polyimide grades.
Rogers Highlights Thermally Enhanced 92ML Materials at electronica
I met with Rogers Corporation Business Development Manager John Ranieri at Electronica recently. Ranieri’s professional focus is on the 92ML series of laminate, prepregs, and IMS, which was highlighted at the Munich show. The 92ML products are geared for the power electronics marketplace where thermal management is a major concern.
electronica 2016 Impressions
Germany’s third-largest city, and capital of the southeastern state of Bavaria, Munich was once more host to electronica, which can justifiably claim to be the world’s leading trade fair for electronic components, systems and applications.
What’s New with IPC’s Validation Services
During this year’s IPC Fall Committee Meetings, held in conjunction with SMTAI in Chicago, I met with my friend Randy Cherry, director of IPC Validation Services. Since the inception of Validation Services three years ago, I’ve conducted video interviews with Randy at IPC APEX EXPO, and I've been tracking the growth and progress of this program. I decided that this would be a great opportunity to do a mid-year check-up on IPC’s Validation Service programs.