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RTW SMTAI: John Mitchell Updates on IPC's Education Efforts
10/22/2018 | Real Time with...SMTAI
RTW SMTAI: NCAB Discusses Its Sustainability Programs
10/19/2018 | Real Time with...SMTAI
Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets
10/17/2018 | Emilie Jolivet, YOLE DÉVELOPPEMENT
The Changing Shape of the HDI Market
10/15/2018 | Roger Massey, ATOTECH
GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions
10/10/2018 | Dan Beaulieu, D.B. Management Group
PCB :: Suppliers
RTW SMTAI: NCAB Discusses Its Sustainability Programs
Doug Drayer, General Manager, Central Region, at NCAB Group, details the company's three-pronged sustainability programs and ISO 26000. He also talks about the company’s recent successful listing in the Stockholm Stock Exchange, and the importance of working with the customers especially during the design process.
Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.
Institute of Circuit Technology Hayling Island Seminar
After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.
Sunshine Global Circuits Discusses its Rapid, Targeted Growth
In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.
SLP: The Next Level of Technology
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?
Building a Better Board: It Always Comes Back to Communication
For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.
From Trend to Game Changer: Which Technology Will Make the Cut?
At the recent EIPC Summer Conference, Hans Friedrichkeit of the PCB Network gave an engaging presentation on artificial intelligence and future technologies, which was well received by attendees. Who better than Hans to offer insight on which future megatrends might truly become game changers? Publisher Barry Matties sat down with Hans to get his take on trends such as 5G, autonomous cars and 3D printing.
Ventec Keeps 'Shaking Things Up' with tec-speed 20.0
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
PCBs Are Moisture-Sensitive Devices
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Reliability Takes on a New Urgency
Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.
Atotech on Challenges and Opportunities in PCB Manufacturing
Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.
Thermal Capabilities of Solder Masks: How High Can We Go?
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.
Circuit Automation on the Ever-Evolving World of Solder Mask
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.
Countering Solder Mask Residue Production Concerns
The solder mask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process; this is when the panels are at their most valuable and are unfortunately not re-workable.
Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
Advanced Stackup Planning with Impedance, Delay and Loss Validation
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?
Susy Webb: Training the New Generation of Designers
For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.
Agfa: Staying Ahead of the Technology Curve
In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.
Characteristics of New Electroless Au/Pd/Au Process for Fine-Line Applications
The characteristics of electroless gold/palladium/gold (IGEPIG) deposit, which has been newly developed for fine-line application as electroless nickel-phosphorus (EN) free, has been compared with that of conventional electroless Ni-P/Pd/Au (ENEPIG) deposit and electroless Pd/Au (EPIG) deposit.
Patty’s Perspective: Staying Current on Wet Processes
This month, Mike Carano’s “Trouble in Your Tank” column on troubleshooting PTH failure mechanisms fit well with our wet processing topic. We hope you benefit from his practical knowledge and are storing his columns for future reference! Our final column this month comes from Elmatica’s Didrick Beck. The subject is Lean manufacturing and the differences between standard and non-standard product lines. Good information to know.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.
Flying Probe Testing: It’s about Speed and Stability Says MicroCraft
The I-Connect007 team had the pleasure of meeting with Takayuki Hidehira at the MicroCraft booth at productronica, where they had on display their new eight-probe flying tester, fully equipped with autoloader and new ease-of-use software. Takayuki discusses where flying probe testers currently stand in the market and MicroCraft’s observation of the rise of captive PCB shops in Japan.
Catching up with… Artnet Pro
I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.
PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.
5G—Generation after Generation
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
Catching up with Fineline-Global N. American CEO Eran Navick
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.
The Institute of Circuit Technology Annual Symposium 2018
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.
Experts Discussion: What Does 5G Mean to Materials and EDA Tools?
Whether we’re ready for it or not, 5G technology is coming. We decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.
RTW CPCA Show: AWP Discusses Whelen Engineering Project Success
At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.
Experts Discussion with John Talbot, Tramonto Circuits
For this first issue of Flex007 Magazine, we interviewed John Talbot, president and owner of Tramonto Circuits. Headquartered in metro Minneapolis, Minnesota, Tramonto manufactures flexible and rigid PCBs for a variety of industry segments. Editors Andy Shaughnessy, Patty Goldman and Stephen Las Marias asked John to discuss the challenges and opportunities in the world of flexible circuits, and some of the trends he’s seeing in this market.
Drilling and Routing Machines: Taking Control
Once driven by hardware, the controller industry for PCB drilling is now one being driven primarily by software, so says Holger Dornau, of SIEB & MEYER. Barry Matties sat down with Holger at the CPCA show in Shanghai to discuss CNC drilling and routing machine controllers and why It's becoming more and more important for fabricators to consider.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
Triangle Labs: Covering the Niche Market of Large Boards
I recently had the opportunity to speak with John-Michael Gray, president of Triangle Labs. We had quite a discussion on their rather unique capability of building large-format PCBs and multilayers—perhaps the largest PCBs in the world.
RTW CPCA: Fischer Discusses Automation, Industry 4.0
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, speaks with Editor Stephen Las Marias about the latest improvements in their coating thickness test systems to help customers in their automation and Industry 4.0 journey.
Schmid Looks to the Future for Industry 4.0 and More
I met with Rüdiger Lange, CSO at Schmid Group, in their spacious, comfortable booth at productronica. We discussed the current capital equipment market and Schmid’s business direction for the future while watching some of their new technology in action.
Setting the Record Straight: CEO Asher Levy on the Future of Orbotech
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
GreenSource: Good for the Industry, Good for the World
Whelen Engineering has recently spun off their new printed circuit manufacturing facility to service the merchant market as a new business entity, GreenSource Fabrication LLC.
Everyone is a Customer; Everyone is a Supplier
We’ve all heard the cliché: What goes around, comes around. I’ve always felt that was especially true in our industry, with the frequent job changes people make—much accelerated in recent years but always a factor, since I can remember.
Understanding Your Customers
Understanding your customers may seem like a no-brainer, but conversations with company leaders across various industries the past five years have demonstrated to me just how difficult this can be in practice.
IPC 6012-DA Revisions: The Approach to Cleanliness, Thickness, Inspection, and Wicking
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.
CML’s Mission: Providing Solutions for Customers—Including the Right Supplier
During IPC APEX EXPO, I met with CML USA General Manager Ivan Wong, who was a first-time attendee at the San Diego event. CML is a worldwide PCB sourcing solutions provider with offices around the globe, but the company just recently entered the U.S. market. I spoke with Ivan about CML’s mission and the U.S. office’s plans.
Conversations on the Floor: IPC APEX EXPO 2018
This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.
The Vast Offerings in Laminate Technologies from TUC
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
From Math to Marketing: Orbotech CMO’s Worldview of the Industry
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
Weiner’s World—March 2018
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
RTW IPC APEX EXPO: Arlon Achieves IPC Validation Services Accreditation
John Wright, quality manager at Arlon Electronic Materials, discusses how the company recently achieved IPC validation services accreditation.
RTW IPC APEX EXPO: Matrix Discusses Advanced Automation Equipment
Matrix's Fred Long discusses advanced automation equipment for the PCB industry, including new cleaning technology for panels and dry film laminating equipment.
RTW IPC APEX EXPO: Ucamco's New Tools for Designers, Fabricators
European Editor Pete Starkey and Ucamco partner Luc Maesen discuss Ucamco's newest solutions for PCB designers and fabricators, YELO (Yield Enhancing Layout Optimizer) and Communic8tor. Both of these products were recently launched for users in the North American market.
RTW IPC APEX EXPO: Bowman—XRF Equipment, New IPC 4552A Spec, and How They Go to Market
Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates
Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
RTW IPC APEX EXPO: Perfect Point’s Recently Developed Coating Technology for Small Drills
VP Shane Stewart describes some recently developed coating technology for small drills that helps improve debris removal and aspect ratio drilling capability.
RTW IPC APEX EXPO: Insulectro Discusses Importance of Helping PCB Shops
Chris Hunrath, VP of technology at Insulectro, discusses their recent expansion of inventory, especially substrate materials, the need for quick access, and the importance of working closely with their customers and OEMs.
Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
RTW IPC APEX EXPO: Uyemura's Chemistry for ENIG, ENEPIG, and EPIG Apps
A unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.
RTW IPC APEX EXPO: Benefits of Outsourcing CAM Operations to a Specialist Provider of Engineering Services
CEO Mehul Dave of Entelechy Global discusses the benefits of outsourcing CAM operations to a specialist provider of engineering services.
RTW IPC APEX EXPO: Benefits of Outsourcing Quality Assurance Options
Niraj Patel describes the benefits of outsourcing quality assurance operations, with specific reference to the alternative business models offered by Gardien for electrical testing.
The Selection of Chemical Etching Equipment for PCB Fabrication
Congratulations! Your process development team has completed its DOEs and is convinced they are ready to scale up. The facilities crew has found space for your new operation or, even better, your manufacturing team will have a newly-built building in which to locate the project.
RTW IPC APEX EXPO: Prototron Moves Offshore
Prototron's Dave Ryder and Russ Adams discuss the company's recent decision to begin manufacturing high-volume jobs overseas. They also discuss some of the partner shops' capabilities, including flex and rigid-flex, which were driven by customer demand.
RTW IPC APEX EXPO: Candor Industries' History and Advanced Circuit Constructions
Founder and president Yogen Patel shares Candor Industries' history and describes some of the non-standard approaches to PCB production the company uses to make advanced circuit constructions.
RTW IPC APEX EXPO: Insulectro Showcases New Low-Loss Materials
Norm Berry, director of laminates and OEM marketing for Insulectro, discusses the company's new low-loss products and resin systems that benefit high-speed, high-frequency PCB designs.
The Time is Right in India
In an interview with Akshinthala Vijayendra of IPC India, he discusses India’s infrastructure under the direction of the new prime minister, where India currently stands versus China, and the pros and cons for any speculative companies deciding whether to expand into this country.
New Year, New Equipment—Right?
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
EIPC’s Winter Conference in Lyon, France: Day 2 Review
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!
Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!
Whelen Engineering and AWP Explain their Unique Collaboration
If there was a buzz word in the PCB hall at productronica this year, it was probably Whelen, as in Whelen Engineering and Alex Stepinski, VP of Whelen’s circuit board division.
Aismalibar on Laminates, Following the Market, and More
At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.
Rogers Continues Expansion into High-Speed Digital Materials
Mahyar Vahabzadeh discusses a paper presented by his colleague Dr. Allen Horn at DesignCon. He also explains some of the different characteristics Rogers has discovered as they move from RF into high-speed digital materials.
CFX: Updates and Developments
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.
Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design
This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.
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