PCB :: Suppliers

Latest Articles

RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG

John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.

RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment

Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.

RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market

Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.

RTW IPC APEX EXPO 2019: Meyer Burger Highlights Inkjet Solder Mask Printing Equipment

Annegret Lewak, head of sales at Meyer Burger, speaks with Steve Williams about their latest inkjet solder mask printing equipment, which offers advanced accuracy and resolution imaging.

RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities

Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.

RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables

Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.

RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer

Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.

RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries

Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.


RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask

Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

AltiumLive Munich: Day 1 Keynotes

The weather forecast was wrong! Despite my apprehension and winter clothes, there was very little snow at the Hilton Munich Airport. It could have been any season of the year inside the splendid convention facility, which was also the venue for the second European AltiumLive design summit. AltiumLive brought together a family of over 220 electronics engineers and designers eager to learn from top industry experts and applications specialists who were equally eager to share their knowledge and experience freely.

Atotech at HKPCA on Announcements and Advancements

Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

Catching Up with Artnet Pro

I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).

Altium Prepares for Munich Show as Growth Continues

It’s been just two months since the AltiumLive event drew several hundred designers to San Diego, California, and Altium is already gearing up for the next show in Munich, Germany (January 15–17, 2019). I recently spoke with Chris Donato, VP of global sales for Altium, about the upcoming AltiumLive show as well as the company’s growth over the past few years.

Alun Morgan Discusses AltiumLive Munich Keynote

EIPC Chairman Alun Morgan will deliver a keynote speech at this week’s AltiumLive event in Munich, Germany. He gave us a quick preview of his keynote, and explained what his new job entails as technology ambassador with Ventec International Group.

Rainer Beerhalter Discusses His AltiumLive Munich Presentation

Rainer Beerhalter is a physicist, and according to his design bureau’s website, “founder, owner, and mastermind” of B GMBH. Rainer attended the first AltiumLive in Munich in 2017, and he’s returning to this year’s event in Munich January 15–17. I asked him to tell us about the class he’ll be teaching in Munich, and why he decided to come back for the sophomore AltiumLive show.


Agfa on Revolutionary Inkjet Solder Mask Applications

Does inkjet solder mask have the potential for volume production? Mariana Van Dam, global sales manager for PCB imaging solutions, and Dr. Frank Louwet, business unit manager for advanced coatings and chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.

MacDermid Enthone Discusses Consolidation Benefits

At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

Robert Art on the Importance of Thermal Management

Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.

Top 10 Most-Viewed FLEX007 Articles in 2018

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.

Institute of Circuit Technology Harrogate Christmas Seminar 2018

The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.

Top 10 Most-Read PCB007 Articles of 2018

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Automation Attracts: The New Guard to PCB Fabrication

It only took a few seconds inside the GreenSource Fabrication plant for the I-Connect007 staff to realize just how different the facility is. The look and feel of the place, however, is just one difference; staffing the facility is unique as well.

Martin Cotton’s Parting Shot

Martin Cotton is a unique personality in the PCB industry. As Cotton says, “I’m a designer—look at my haircut!” Cotton gave the keynote at the Institute of Circuit Technology’s 2018 Harrogate Seminar, challenging his audience to consider laminate dielectric properties in the context of power and cost in a presentation entitled 'The Effect of the Dk of a PCB Laminate on the Cost-effectiveness of Office Rental Space. Intrigued?' Read on!

Schmoll and Burkle: Lasers and Drills for GreenSource

While at GreenSource Fabrication, Burkle Automation Technology’s Dave Howard introduced me to the Schmoll equipment as well as other items that Burkle installed at the facility. One unit of great interest was the Impex inspection machine which can do sophisticated non-destructive cross-sections using a very fine fiber probe.


Rick Almeida Discusses DownStream's Latest News

At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.

John Hendricks on 5G Materials

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Technology Ambassador Alun Morgan

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

GreenSource: The Future

This issue is a special one. We devote the entire magazine to a detailed look at Green-Source Fabrication (a division of Whelen Engineering) and its brand new, fully automated HDI facility in New Hampshire. GreenSource is arguably the most advanced and automated fabrication facility in North America today.

RTW SMTAI: LiloTree's Shah Discusses Hyper Corrosion, Black Pad in ENIG

Dr. Kunal Shah, chief scientist and president of LiloTree, talks about the major issues in ENIG, such as hyper corrosion—which can be very benign, or very extreme, resulting to black pad—and how LiloTree is helping to improve the performance and efficiency of the ENIG finish processes.

Jeff Waters: Isola Updates

During PCB West 2018, Nolan Johnson and Barry Matties sat down with Jeff Waters, Isola CEO, to catch up on company activities, including the recent sale of the factory in Chandler, Arizona, the plan to build a new facility, product developments, current market dynamics, a new CFO, and much more.

Cadence Presents New Software System and Technical Papers at PCB West 2018

During PCB West 2018, I spoke with Dan Fernsebner, product marketing group director, and Hemant Shah, product management group director for enterprise PCB products, both with Cadence Design Systems, about their new software launch—DesignTrue DFM Ecosystem. Fernsebner and Shah also address recent technical papers from Cadence on Industry 4.0, IPC-2581, system-level design, and return-path analysis and management.

Copper Pillar Plating Systems: High Speed, Low Heat

The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.

RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends

Lenora Clark, director for end-user applications at MacDermid, discusses some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.


RTW SMTAI: NCAB Discusses Its Sustainability Programs

Doug Drayer, General Manager, Central Region, at NCAB Group, details the company's three-pronged sustainability programs and ISO 26000. He also talks about the company’s recent successful listing in the Stockholm Stock Exchange, and the importance of working with the customers especially during the design process.

Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets

The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.

Institute of Circuit Technology Hayling Island Seminar

After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

Sunshine Global Circuits Discusses its Rapid, Targeted Growth

In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.

SLP: The Next Level of Technology

As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?

Building a Better Board: It Always Comes Back to Communication

For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.

From Trend to Game Changer: Which Technology Will Make the Cut?

At the recent EIPC Summer Conference, Hans Friedrichkeit of the PCB Network gave an engaging presentation on artificial intelligence and future technologies, which was well received by attendees. Who better than Hans to offer insight on which future megatrends might truly become game changers? Publisher Barry Matties sat down with Hans to get his take on trends such as 5G, autonomous cars and 3D printing.

Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.

PCBs Are Moisture-Sensitive Devices

Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.

Reliability Takes on a New Urgency

Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.


Atotech on Challenges and Opportunities in PCB Manufacturing

Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.

Thermal Capabilities of Solder Masks: How High Can We Go?

This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.

Circuit Automation on the Ever-Evolving World of Solder Mask

In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.

Countering Solder Mask Residue Production Concerns

The solder mask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process; this is when the panels are at their most valuable and are unfortunately not re-workable.

Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme

With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.

Advanced Stackup Planning with Impedance, Delay and Loss Validation

A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?

Susy Webb: Training the New Generation of Designers

For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.

Agfa: Staying Ahead of the Technology Curve

In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.

Characteristics of New Electroless Au/Pd/Au Process for Fine-Line Applications

The characteristics of electroless gold/palladium/gold (IGEPIG) deposit, which has been newly developed for fine-line application as electroless nickel-phosphorus (EN) free, has been compared with that of conventional electroless Ni-P/Pd/Au (ENEPIG) deposit and electroless Pd/Au (EPIG) deposit.

Patty’s Perspective: Staying Current on Wet Processes

This month, Mike Carano’s “Trouble in Your Tank” column on troubleshooting PTH failure mechanisms fit well with our wet processing topic. We hope you benefit from his practical knowledge and are storing his columns for future reference! Our final column this month comes from Elmatica’s Didrick Beck. The subject is Lean manufacturing and the differences between standard and non-standard product lines. Good information to know.


EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1

Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2

Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.

Flying Probe Testing: It’s about Speed and Stability Says MicroCraft

The I-Connect007 team had the pleasure of meeting with Takayuki Hidehira at the MicroCraft booth at productronica, where they had on display their new eight-probe flying tester, fully equipped with autoloader and new ease-of-use software. Takayuki discusses where flying probe testers currently stand in the market and MicroCraft’s observation of the rise of captive PCB shops in Japan.

Catching up with… Artnet Pro

I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.

PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G

The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.

5G—Generation after Generation

If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).

Catching up with Fineline-Global N. American CEO Eran Navick

After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.

The Institute of Circuit Technology Annual Symposium 2018

ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.

Experts Discussion: What Does 5G Mean to Materials and EDA Tools?

Whether we’re ready for it or not, 5G technology is coming. We decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.


RTW CPCA Show: AWP Discusses Whelen Engineering Project Success

At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.

Experts Discussion with John Talbot, Tramonto Circuits

For this first issue of Flex007 Magazine, we interviewed John Talbot, president and owner of Tramonto Circuits. Headquartered in metro Minneapolis, Minnesota, Tramonto manufactures flexible and rigid PCBs for a variety of industry segments. Editors Andy Shaughnessy, Patty Goldman and Stephen Las Marias asked John to discuss the challenges and opportunities in the world of flexible circuits, and some of the trends he’s seeing in this market.

Drilling and Routing Machines: Taking Control

Once driven by hardware, the controller industry for PCB drilling is now one being driven primarily by software, so says Holger Dornau, of SIEB & MEYER. Barry Matties sat down with Holger at the CPCA show in Shanghai to discuss CNC drilling and routing machine controllers and why It's becoming more and more important for fabricators to consider.

The Survey Said: Industry Optimistic After Strong 2017

During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.

Triangle Labs: Covering the Niche Market of Large Boards

I recently had the opportunity to speak with John-Michael Gray, president of Triangle Labs. We had quite a discussion on their rather unique capability of building large-format PCBs and multilayers—perhaps the largest PCBs in the world.
NEXT
Copyright © 2019 I-Connect007. All rights reserved.