Article Highlights
Crowded Congressional Calendar Affects Industry Priorities
07/24/2019 | Chris Mitchell, IPC VP, Global Government Relations
A Conversation with Karen McConnell—An Emerging Engineer Program Mentor
07/22/2019 | Linda Stepanich, IPC
EPA, Industry Come Together in Visit to TTM Facility
07/18/2019 | Kelly Scanlon, director, EHS policy and research
Kelvin Characterization to Accurately Predict Copper Thickness
07/01/2019 | Article by Brandon Sherrieb, Integrated Test Corporation
Emma Hudson: From Tomboy to Tech Lead
06/21/2019 | Gen3
PCB :: Suppliers

Latest Articles

Solder Mask Curing: UV Bump Overview

Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.

There’s An Art to Plating

There's definitely an art to plating. Start with a generally planar substrate, then alternately put stuff on and take things off. Continue this in subtle variations until what you have is the stuff you want, where you want.

Development of Flexible Hybrid Electronics

This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.

Interconnect Reliability Correlation With System Design and Transportation Stress

Interconnect reliability is very critical to ensure product performance at predefined shipping conditions and user environments. Plating thickness of the compliant pin and the damping mechanism of electronic system design are key success factors for this purpose. This paper discusses design variables—such as pin hard gold plating thickness, motherboard locking mechanism, and damping structure design—to ensure interconnect reliability.

IPC Reliability Forum Wrap-up With Brook Sandy-Smith

I attended the recent IPC High-Reliability Forum and Microvia Summit in Baltimore, Maryland. The speakers and panelists focused on a variety of topics, but one issue that kept popping up was the failure of some microvias on military and aerospace PCBs. Fortunately, some smart technologists are focusing on determining the cause of these via failures. I asked Brook Sandy-Smith, IPC’s technical education program manager, to give us a quick wrap-up of this event.

The Impact of Inductance on Impedance of Decoupling Capacitors

This article discusses the impact of interconnection inductance on the impedance of the decoupling capacitor, which influences the power integrity of the PCB. The investigation is performed with 3DEM simulation by varying the trace length and height of stitching vias that connect the decoupling capacitor across the power rail and ground.

How to Feed Test Data Back to Engineering for Process Improvement

Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.

Avoiding CAF Failures at the IPC High-reliability Forum

Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Focusing on Surface Sensitivity for Reliability

At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.

How Changing Cleaning Technologies Affect Reliability

At the recent IPC High-Reliability Forum and Microvia Summit, Andy Shaughnessy spoke with Michael Konrad, founder and president of Aqueous Technologies and a speaker and panelist at the event in Baltimore, Maryland. They discussed Konrad’s presentation and the recent proliferation of cleaning, from solely high-reliability products to Class 1 consumer products.


An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Virtual Verification Station From CIMS Enhances AOI Capabilities

At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.

Technically Appropriate Material Choices Are Key to Success

Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. Editor Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.

Insulectro’s OEM Program: Time to ACT!

Ken Parent, Insulectro VP of sales and product management, discusses the current dynamics in the materials marketplace and how Insulectro is developing educational resources to help design teams and fabricators better understand the capabilities and features for the emerging laminate materials.

Microtek Labs: Providing Trusted Testing in the Chinese Market

On a recent visit to Microtek Laboratories' Changzhou facility, Barry Matties, publisher, and Edy Yu from the I-Connect007 China team spoke with chairman and CTO Bob Neves about the changes he has seen living and doing business in China over the past 15 years, and the increased importance of standards and testing as China moves into manufacturing more high-reliability products.

ICT 45th Annual Symposium Review

The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.

DuPont on Materials Challenges and New Opportunities

John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.

Creating Stability in Materials Chaos

Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.

Laminate Suppliers Face Increasing Demands From Customers

As a global laminate supplier with a large product offering, TUC is at the forefront of the growing customer demands that stem from a number of market segments pushing next-generation products. In an interview with Nolan Johnson, TUC North American President Alan Cochrane talks about the company’s shift toward trending areas and how strategies like the adoption of thinner glass styles have helped make it all possible.

Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

At the recent CPCA Show in Shanghai, Orbotech celebrated having over 100 of their Orbotech Diamond™ direct imaging machines in the marketplace. Barry Matties caught up with Meny Gantz—VP of marketing for Orbotech’s PCB division—to talk about the drivers behind the success of Orbotech Diamond systems before turning the conversation toward the future and Industry 4.0.


IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal

Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.

Isola on Adapting Processes to Meet Customer Needs

In an interview with I-Connect007, Sean Mirshafiei, chief sales and marketing officer for Isola, discusses the company’s perspective on material market trends and how they are adapting product development processes to respond to new customer needs.

Collaboratively Creating Wearable Medical Products

Patty Goldman, Barry Matties, and Happy Holden recently spoke with David Moody and Rich Clemente of Lenthor Engineering along with Anthony Flattery and Amit Rushi—their customers at GraftWorx. They discussed a recent project and how they worked together to solve a difficult problem by designing a rigidized flex circuit for their product.

Electrolytic Plating: Filling Vias and Through-holes

The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.

Barbara Bracken Discusses ICAPE's New Facility

During the recent SMTA Atlanta show, Andy Shaughnessy sat down for an interview with Barbara Bracken, sales manager for Texas for the ICAPE Group. Barbara explained why ICAPE is much more than a PCB broker; the company now owns its own assembly facility in the U.S. and can assembly boards in the U.S. or China.

DuPont on New Beginnings and Empowering the Industry

Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.

Making Materials Succeed: Past, Present, and Future Trends

Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.

Technically Appropriate Material Choices are Key to Design Success

Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.

Alun Morgan on the Future of PCB Materials

The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination

Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.


Averatek on the Future of Additive and Semi-additive Processing

Averatek’s President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the current challenges and limitations that continue to leave many manufacturers hesitant to implement the technology.

Creating Smart Surfaces with Electronic Functionality

Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an innovative technology that encouraged a bit of lateral thinking and appealed to my creative side: the IMSE, or injection-moulded structural electronics.

Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas

In an interview with I-Connect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessica Zhang provides an overview of the company and shares new business trends they're seeing, including LEDs, wearable devices, and more.

Alun Morgan on Thermal Management and LEDs in Automotive

Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.

American Standard Circuits' Ken Moffat on Flex and Rigid-flex Business

Ken Moffat is the director of business development at American Standard Circuits, where covers a fairly broad territory from his base in Toronto throughout Canada and parts of the U.S. from east to west. In an interview with I-Connect007 at the recent West Penn SMTA Expo, Ken talks about the state of the flex and rigid-flex industry.

RTW IPC APEX EXPO: Orbotech West on Supporting Customer Needs

Orbotech West President Sharon Cohen speaks with Kelly Dack about Orbotech West’s restructuring to better support customer needs, their customer monitoring center, and hints at the capabilities of new products coming soon.

SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent

Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.

RTW IPC APEX EXPO 2019: MivaTek Discusses Flatbed LED Direct Imaging Systems

Brendan F. Hogan, managing director for MivaTek Global, and Chris Hrusovsky, VP of business development, give Pete Starkey their outlook on the market for flatbed LED direct imaging systems, report spectacular sales success, and describe their new introductions for large-format, dual-tray and microelectronics systems.

Ventec Focuses on High-mix Manufacturing

The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

ITEQ’s Tarun Amla Discusses 5G Inflection Points

ITEQ Corporation Executive VP and CTO Tarun Amla discusses effects of 5G on materials and shares general observations on the 5G rollout at DesignCon. He also talks about the challenges for their customers, and how they help them address their issues.


EIPC Winter Conference, Day 2

After the papers from the first day of the EIPC Winter Conference in Milan on February 14–15, the delegates were hosted at a reception and plant tour of Elga Europe at their nearby production facility. Here's a recap of the events and highlights of the Day 2 of the conference.

Automation on Full Display at Recent China Exhibitions

With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.

Hardware and Software in Smart Factories

As smart factories become a part of the present rather than a thing of the future, we will all need to become familiar with related concepts and components. This article is dedicated to various automation protocols, including some new ones just coming on the market, and covers hardware, such as PLCs and machine interfaces, as well as software and network protocols, such as MAPS, SECS/GEM, OML, CFX, IPC-2541, and custom software.

CPCA Show and productronica China 2019 Review

It was a busy week in China for the electronics industry. With multiple trade shows and conferences going on simultaneously in Shanghai, including the CPCA Show 2019, productronica China, SEMICON China, electronica China, and FPD China, it appears from the crowds that the market is strong in the region.

Meyer Burger on Inkjet Technology and Digital Printing Benefits

Don Veri, sales and business development manager for Meyer Berger, discusses some of the challenges fabricators face in adopting inkjet technology, the benefits they can expect once it’s deployed in their facility, and the advantages of digital printing in solving problems on the shop floor.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses Recent Company Rebranding

Senior VP Joseph D’Ambrisi of MacDermid Alpha Electronics Solutions speaks with Steve Williams about the recent rebranding of the business, and the benefits to their customers.

Current Megatrends You Pay the Most Attention To

In our recent survey, we asked the following question: "What current megatrends do you pay the most attention to?" Below are some of the replies, edited slightly for clarity.

EIPC Winter Conference, Day 1

EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

RTW IPC APEX EXPO 2019: Arlon Discusses Investments and Important Role of a Niche Supplier

Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.

NCAB Group on Supply Chain Issues

In an interview with I-Connect007, Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics.


The Smart Factory IQ Test

Let's see how prepared you are to talk about Industry 4.0. The following 12-question test will measure how much you know about smart factory concepts and philosophies. Since the concept of a smart factory is larger than the electronics manufacturing industry and encompasses the entire supply chain, the terms and concepts here are also more global in nature.

RTW IPC APEX EXPO 2019: Ucamco Discusses Latest Evolution of PCB Software

Ucamco Managing Director Karel Tavernier speaks with Dan Feinberg about their aim of automating the CAM process as much as possible. He also discusses the recent evolution of their PCB software.

RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI

Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.

Flex/MSTC Joint Conference: A Collaborative Week in Monterey

Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.

Institute of Circuit Technology Evening Seminar

The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.

RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO

Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.

Words of Advice: Component Shortages in 2019

In a recent survey, we asked the following question: What components do you expect to be in short supply in 2019? Here are just a few of the answers, edited slightly for clarity.

Reflections on Supply Chain Issues

There are parallels in the PCB fabrication industry right now. PCB fabrication is a lot like that VW microbus. Everything is running just fine while the supply is there. However, the materials supply pipeline is becoming increasingly unpredictable.

Isola Executive Vice Chairman and Acting CEO Travis Kelly on the Upcoming Year

Isola Executive Vice Chairman and Acting CEO Travis Kelly discusses the recent milestones for the company, including the leadership transition. Travis also outlines his agenda for the upcoming year and gives an update on Isola’s new facility in Chandler, Arizona.

Selective Solder Mask Deposition by Inkjet

At IPC APEX EXPO 2019, Pete Starkey spoke with Joost Valeton, product manager for PiXDRO inkjet printing equipment with Meyer Burger, about their newly configured inkjet printer for PCB applications, and bringing awareness to opportunities using selective solder mask deposition.


RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling

Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.

RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG

John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.

RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment

Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.

RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market

Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.

RTW IPC APEX EXPO 2019: Meyer Burger Highlights Inkjet Solder Mask Printing Equipment

Annegret Lewak, head of sales at Meyer Burger, speaks with Steve Williams about their latest inkjet solder mask printing equipment, which offers advanced accuracy and resolution imaging.

RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities

Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.

RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables

Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.

RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer

Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.

RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.


RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries

Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.

RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask

Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.
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