Article Highlights
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/20/2022 | Andy Shaughnessy, I-Connect007
Technica Heats Up ROI Discussion
05/17/2022 | I-Connect007 Editorial Team
PCB Technologies’ InPack to Focus on Miniaturization, Packaging
05/16/2022 | Andy Shaughnessy, Design007 Magazine
EIPC Technical Snapshot: Supporting Autonomous Driving
05/12/2022 | Pete Starkey, I-Connect007
FIRST: Endorsed by Teachers and Students Alike
05/11/2022 | Barry Matties, I-Connect007
PCB :: Fabrication Process

Latest Articles

A Textbook Look: Signal Integrity and Impedance

Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.

EIPC Technical Snapshot: Supporting Autonomous Driving

EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It certainly seems that our times continue to be interesting, don’t they? Just how many different flavors of supply chain disruption can we come up with? Investment on the supply side needs to increase, but the size of the labor force needs to increase even more, if we want to accomplish the task of the buildout itself, let alone running the facilities properly.

DFM 101: Solder Mask and Legend

One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers from the PCB manufacturer’s perspective, and the design decisions that will impact product reliability.

Designing PCBs With Additive Traces

Advances in technology have been clear to see within the component packaging industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. However, while these improvements have occurred with component packages, it has become increasingly more difficult to break out and route the dense circuitry associated with these parts. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the innerlayers of your PCB.

Catching up with EISO Enterprises’ President Gary Chien

While there are many Chinese companies now selling in the United States, I wanted to find one in Taiwan that is penetrating the U.S. market. I was delighted to come across EISO Enterprise Co. Ltd., a printed circuit board fabricator located in Taiwan. I know that the American companies are usually looking for PCB global partners in countries other than China, which made my conversation with Gary (Jung Kun) Chien all the more interesting, especially when he shared his thoughts on the U.S-China trade wars.

The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper

As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints. From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM).

Measuring Multiple Lamination Reliability for Low-loss Materials

Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customers’ objectives and shows the deterioration of the resin’s physical properties as a result of multiple lamination cycles (up to 10X). This article describes how TUC evaluates the possible change in resin structure due to multi-thermal laminations.

Developments in Low-Loss Substrates for High-Frequency Applications

The electronics industry as we know it today can trace its birth to the creation of the first integrated circuit in 1958, although conception occurred 10 years earlier with the invention of the transistor. That first IC contained a single transistor and four passive components. To say things have come a long way since then is a huge understatement.

An Inside Look at an Indian PCB Manufacturer

As a student of the printed circuit board industry, I am always interested in learning more about companies all over the world. When I connected with Abhay Doshi, managing director of Fine-Line Circuits Ltd. in India, I welcomed the opportunity to learn more about him, his company, and the Indian PCB business as a whole—it was all that, and so much more. Here’s what I learned.


DFM 101: Edge Plating

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Institute of Circuit Technology: A Novel Approach to Recycling PCBs

A two-year project funded by an Innovate UK SMART Grant aims to reduce the impact of e-waste using naturally derived, biodegradable and nontoxic products. Those attending the webinar for the Institute of Circuit Technology’s annual meeting on March 2 learned more about the project, as well as statutory paperwork obligations of the UK REACH regulations. Following the formal business, ICT Chair Emma Hudson introduced and moderated this technical webinar.

Where Have All the Board Shops Gone?

When I look at the landscape of U.S.-based PCB fabricators, the title of this article reminds me of a 1960s protest song. If you don’t remember the song or that era, you have some interesting research to do. As well, a Hank Williams Jr. song comes to mind, “All my rowdy friends have settled…” Seriously, I am pleased to see many of my old friends taking advantage of the present opportunities.

The IPC STEM Event Inspires

Once again, IPC APEX EXPO featured its successful STEM event, organized by the IPC Education Foundation, and sponsored by several companies, including I-Connect007. The event had nearly 80 students in person for a hands-on introduction to our industry. After the welcoming comments, the students broke into groups for different activities. While some enjoyed a guided tour of the show floor, upstairs the other students learned how to solder. Then they rotated so that they all had the same opportunities.

PCB Adoption of Innovations

For North America, there is a growing need for more ultra-high density HDI capability. Some of the reasons for the slower adoption of SAP/HDI fabrication may rest with two obstacles: Subtractive processes have difficulty as they approach 50-micron traces and spaces (0.002”), and it is not clear what the total system acquisition costs will be for ultra-HDI.

Automotive Initiatives Make Headway at IPC APEX EXPO

A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision.

Real Time with... IPC APEX EXPO 2022: Supplying the U.S. Market for 30 Years

Ashley Steers of Electra Polymers shares his perspective with Pete Starkey about the company's history, including supplying the U.S. market for 30 years. They also discuss the latest trends in inkjet solder mask. If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

Real Time with… IPC APEX EXPO 2022: A New Direct Imaging System

Sylvain Dromaint of Altix gives Pete Starkey an update on the recent launch of their ADIX DUO direct imaging system and how it fits into the company’s roadmap. If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San D+iego, from ribbon cutting to teardown.

Real Time with... IPC APEX EXPO 2022: Industry Icons Reflect

In this special interview, industry icons Technical Editor Happy Holden and Dick Crowe of Burkle North America reflect on and share a historical perspective from their many years in the industry. Dick also announced his retirement after nearly 60 years in the industry, and he discusses his plans for the future. If you didn't make it to IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

Real Time with... IPC APEX EXPO: Fire Up the Inkjets

Technical Editor Pete Starkey sits down with Don Monn of Taiyo America to discuss the benefits of inkjet solder mask and how it helps streamline the manufacturing process. They also discuss the recent acquisition of Circuit Automation, a manufacturer of solder mask coating and vertical drying equipment. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We just wrapped up IPC APEX EXPO 2022, and I think it went better than anyone could have expected. I wasn’t sure the live show would actually take place. With the COVID protocols in California changing daily, no one knew for sure that a live show would even be allowed to open. But here's my picks for the week, both from the show and from the industry.

Real Time with... IPC APEX EXPO: PCB Manufacturing Today

Dick Crowe speaks with Kurt Palmer, president of Burkle North America, about the trends he sees in PCB manufacturing today. From LDI to laser drills, they discuss a wide range of concerns and opportunities. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events, from ribbon cutting to teardown.

EIPC Technical Snapshot: Considering Supply Chain and Defense

Continuing the highly successful series of EIPC’s Technical Snapshots, and featuring a programme that attracted a record attendance, the 14th online event was held on January 19. The opening presentation came from the ever-cheerful Didrik Bech, of Elmatica, who promised to provide thoughts and ideas about how to secure the supply chain to ensure compliance, not only to reduce the risks but also to increase the opportunities. Stan Heltzel from ESA Materials and Processes Section in the Netherlands gave a fascinating detailed insight into ESA’s approach to microvia reliability. And Liisa Hakola, senior scientist and project manager at the VTT Technical Research Centre of Finland gave the final presentation on how sustainability creates new opportunities for electronics industry.

Technology and Development Prospects for the European Marketplace

Nolan Johnson speaks with Tarja Rapala-Virtanen technical director of the EIPC who breaks down the current state of the European market and which technologies and market segments are seeing growth.

New Book From Isola Highlights Importance of Material Selection

In "The Printed Circuit Designer’s Guide to... High Performance Materials," the latest release from I-007eBooks, readers will learn how to overcome challenges associated with choosing the right material for their specific application. Author Michael Gay of Isola provides a clearer picture of what to know when determining which material is the most desirable for which products. PCB materials and DFM expert Mark Thompson says, “I love this book, particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and effective Dk."

Real Time with... IPC APEX EXPO: Taiyo Focuses on Collaboration

Don Monn, Midwest regional sales director at Taiyo America, reviews the progressive adoption of inkjet solder mask technology while acknowledging that liquid photoimageable mask continues as the mainstream process, with new developments in double-sided coating and vertical drying equipment. He comments on how Taiyo’s collaborative relationships with suppliers and customers have enabled logistics to be successfully managed through difficult times.

Real Time with... IPC APEX EXPO: Burkle Has a Sharper Image

Kurt Palmer, president of Burkle North America, speaks with Editor Nolan Johnson about the latest advancements in imaging and the equipment that Burkle will be demonstrating at IPC APEX EXPO in San Diego. If you can’t make it to IPC APEX EXPO, don’t worry. We’ll be bringing you interviews with the engineers, managers and technologists who are making a difference in our industry.

Rogers: Mergers, Automotive, and a Bright Future

Pete Starkey visits with Ingmar van der Linden, market segment manager at Rogers Corporation in the Netherlands, about the products his company was demonstrating during productronica. Pete asks Ingmar about the automotive industry, particularly Rogers’ involvement in producing materials for sensors that create a safer driving experience. They also discuss the merger with DuPont, the trend toward material technologies and how to enable them.

Agfa Taking Leap to Digital Platform

I-Connect007 Technical Editor Pete Starkey spoke with Agfa Business Unit Manager Frank Louwet ahead of last month’s productronica show in Europe. They discuss the company’s desire to reduce its carbon footprint and the benefits of this change, particularly with a move to digital inkjet printing, and describes some of the company’s newest products. As Louwet explains, "Our claim is 'Grow your business, not your footprint.' By going digital you can grow your business without having to increase your waste materials, your processing chemicals, your water, and even your floor space."

ICT Autumn Seminar Review: Live in 2021!

Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.


Ron Lasky: A Perspective on Writing About Solder Defects

Nolan Johnson speaks with Dr. Ron Lasky About "The Printed Circuit Assembler’s Guide to... Solder Defects." Ron is a full professor at Dartmouth College, but works part-time at Indium Corporation, helping their customers solve defects. This I-Connect007 eBook, he says, is a compilation of all he’s learned over the years as well as the deep technical knowledge of the team at Indium.

Alex Stepinski: A Philosophical View

"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."

Aismalibar on Thermally-Conductive Solutions

Pete Starkey chats with Eduardo Benmayor about the products Aismalibar will be bringing to productronica 2021, and how the pandemic gave the company time to really work on internal processes.

Meet Luca Gautero, New PCB007 Columnist

We are pleased to announce the latest addition to our team of expert columnists, Dr. Luca Gautero. In his column each month, Dr. Gautero will cover inkjet application for solder mask from a variety of angles. His technical perspective will address maintenance, material challenges, and patterning capabilities. Social responsibility and cost effectiveness will also be illustrated.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

EIPC Technical Snapshot: 5G and Loss Minimisation

Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

With Pluritec, it’s All About Automation

Lino Sousa, vice president of sales with Pluritec, reviews the company’s specialist equipment ranges and discusses the benefits of automation of drilling, solder mask application and wet processing in small-batch, quick-turnaround PCB production.

PCB Requirements for E-Mobility

Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.

What's Hot in the PCB Equipment Market?

Mike Brask, president and CEO of IPS, shares the technology customers in the PCB sector are most interested in and discusses increasing market demands.

The Real Benefits of Inkjet Solder Mask

Shaun Tibbals, sales and marketing director at Electra Polymers, describes the technical, environmental and economic benefits of fully additive solder mask application by inkjet printing, now becoming accepted as the industry-standard technology for the future.


Taiyo Does It Right

In this video interview, Editor Dan Feinberg and Taiyo America's Zach Maekawa discuss the ways that Taiyo adds value to the supply chain while driving innovation in solder mask technology. As Zach explains, Taiyo works with customers and OEMs, measuring all of the “nitty gritty stuff.”

Heraeus Introduces New High-Reliability Solder Paste

Manu Vaidya discusses the SMT650 high-reliability solder paste Heraeus Electronics is showcasing at APEX 2021 in order to satisfy rising automotive demands.

Distributor Just One of Many Roles for all4-PCB

Torsten Reckert, president of all4-PCB, discusses his company's role as a distributor, and the technologies available under their representation. Reckert points to via fill as a key technology, as well as lamination, flash-cutting automation, plasma processing, cross-section equipment, wet processing, among others. The company also manufactures solder resist capital equipment and special machine parts, and is a leader in process optimization.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.

Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’

As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.

ICT Webinar: Novel Materials and Methods for Printed Circuit Fabrication

For the first time since its foundation in 1974, the Institute of Circuit Technology had no alternative than to conduct its Annual General Meeting online. The event, which took place on February 25, 2021, was remarkably well-attended, and was followed, as is traditional, by a technical seminar. The seminar became a webinar focused on novel materials and methods for printed circuit fabrication and moderated by ICT Chair Emma Hudson.

Focus on Smart Processes, Not Just Smart Factories

Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.

EIPC Technical Snapshot: Cleanliness

John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”

Functional Inkjet Printing in PCB Manufacture

Pete Starkey speaks with Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands B.V., about advances in inkjet printing, even outside the lab.

The Benefits of Statistical Process Control

The concepts of statistical process control were initially developed by Dr. Walter Shewhart of Bell Laboratories in the 1920s, and were expanded upon by Dr. W. Edwards Deming, who introduced SPC to Japanese industry after WWII. After early successful adoption by Japanese firms, SPC has now been incorporated by organizations around the world as a primary tool to improve product quality by reducing process variation.


Benchmarking With Your Suppliers: What to Know About Solder Mask

Everyone wants a smooth-running solder mask process with high productivity and minimal rejects, but to achieve this you really need a firm understanding of what your current process is capable of, what its limitations are, and what you want to improve. Process capability benchmarking is a great way to identify and implement improvements within your process.

Kemmer Praezision Partners with Insulectro

In this interview, Nolan Johnson and Gregor Dutkiewicz discuss Kemmer Praezision, their new working partnership with Insulectro, and some of the recent market challenges in mechanical drill bit technology.

The Future of Imaging and Inkjet Printing

We recently spoke to Ed Carignan of Technica, who outlines the current landscape for both direct imaging and inkjet printing and describes how the technologies have evolved over the years. He also details what’s next on the horizon.

EIPC Technical Snapshot: Business Outlook

A headline in a Sunday newspaper had caught John Ling’s eye as he composed the invitation to this fourth EIPC seminar: “Now, more than ever, we need to talk.” Thus, it is that EIPC decided to run another technical webinar, which was just like one of their in-person conferences, except no one had to travel—or got to enjoy a beer or excellent food with convivial company.

Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit

Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.

MivaTek’s New Technology and Market Drivers

I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new product’s market drivers to the X=Xc – 1 idea that is at the core of the market drivers.

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

Millennials and Seasoned Veterans: Your Future Lies in Both

There is no doubt that we are having a crisis when it comes to the workforce in our industry today. In the PCB and PCBA industries, as well as most manufacturing industries, there is a definite shortage of good people we can hire. Dan Beaulieu describes how the future of the electronics manufacturing industry lies in both millennials and seasoned veterans alike.

EIPC Technical Snapshot: PCB Surface Finishes

For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

Ucamco Webinar Explores Benefits of Front-End Automation Tool

I have known the Ucamco people for over 30 years and recognise their company as an industry-leading provider of PCB CAM and pre-CAM software, as well as laser photoplotters and direct imaging systems. The team has always endeavoured to understand customer needs—often to anticipate them—and to respond with innovative solutions.


Happy’s DIY Solution to Chemical Control

I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.

Pacothane on the Future of Laminate Technologies

Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.

Lorain County Community College’s Successful MEMS Program

The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.

Stephen Chavez and Happy Holden on Designing Reliable Vias

Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

GreenSource Fabrication Creates Plating Flexibility

The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.

Catching up With QCMS General Manager Rick McAnally

Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.

Institute of Circuit Technology Technical Webinar

With its regular program of physical seminars and symposia on hold, the Institute of Circuit Technology went virtual and presented a webinar of three technical papers, organized by Technical Director Bill Wilkie and introduced by IPC Chair Emma Hudson. Pete Starkey brings you all the details.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features

Altium Technical Marketing Manager Vince Mazur discusses his presentation at the recent AltiumLive, which focused on updates to Altium Designer's approach to creating design rules and constraints. Vince explains that these features will be more intuitive for the user, and the update, which is currently in beta, will be released in the future. The company is shifting from “rule-centric” design rules features to capabilities that are more “design-centric,” with applicable rules for each object available at one click.


Reducing Flux Splatter in Sensors and Camera Modules

With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization

As Lawrence Romine said in his introduction, “There’s that moment when you sit in the crowd and hear Mr. Rick Hartley speak that you know you’ve arrived in PCB design.” With 50 years in the industry focused on circuit and PCB design—and as a specialist in EMI, noise, and signal integrity issues—Rick Hartley was invited to talk about PCB optimization. Pete Starkey provides an overview of the presentation.

Gardien on the Right Track With New ERP System

Andy Shaughnessy speaks with Roland Valentini, Gardien Group COO, about the company’s new OnTrack2 ERP and process management software. He explains how OnTrack2 is purpose-built for customers around the world and why it’s much more than a replacement for OnTrack1, which was being stretched beyond its original intent.

IPC Standards Development: Business Challenges and an Inside View

With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

How to Benefit From Robotic Soldering Processes

Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.
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