Article Highlights
The iNEMI 2019 Roadmap: Flexible Hybrid Electronics
06/04/2020 | Pete Starkey, I-Connect007
Plasma Applications in the PCB Industry
06/03/2020 | Nikolaus Schubkegel
Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions
06/01/2020 | Nolan Johnson, PCB007
Rogers Corporation Keeps Materials Moving
05/28/2020 | I-Connect007 Editorial Team
3D Additive Electronics Manufacturing: Are We Nearing an Inflection Point?
05/28/2020 | Dan Feinberg, I-Connect007
PCB :: Fabrication Process

Latest Articles

Plasma Applications in the PCB Industry

Plasma, which consists of ionized gas atoms, is the fourth state of matter. On Earth, plasma does not occur naturally, but it is sometimes visible at high altitudes as auroras. But off-planet, elsewhere in the universe, almost all visible matter is plasma. Plasma is a mixture of positively charged atomic hulls, free electrons, free radicals, and neutral particles; the total electrical charge is neutral, conductive, and highly reactive. Due to permanent recombination, plasma lights can come in different colors.

Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions

On May 28, Joe O’Neil, CEO of Green Circuits, updated Nolan Johnson on how the company continues to operate during the COVID-19 restrictions. O’Neil reflects on the rapid chain of events this past March when lockdowns were instituted in the San Francisco Bay area. After a brief but rapid shutdown, Green Circuits was back up and in production.

The iNEMI 2019 Board Assembly Roadmap

iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

Autodesk’s Fusion 360 Merges ECAD, MCAD

Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.

Happy Holden Book Excerpt: CIM & Automation Strategy

The following is an excerpt from Chapter 1 of Happy Holden’s I-Connect007 eBook Automation and Advanced Procedures in PCB Fabrication. In this book, Happy explains fabrication automation with illustrative examples and anecdotes from his decades as a mechanization leader.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

iNEMI’s PCB Roadmap Explained

In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

IPC Europe Shares Technical Education and Standards Awareness

Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

Koh Young Update With Quintin Armstrong

In this video interview from the show, Quintin Armstrong, Americas service and applications senior manager for Koh Young, updates Guest Editor Dick Crowe on Koh Young America's Technical Services Team, where the focus is on AOI of components and materials on the stuffed board, as well as demonstrations and training at their new facility in Duluth, Georgia.

Via Reliability and Robustness in Today’s Environment

When Bob Neves dropped by the I-Connect007 booth at IPC APEX EXPO 2020 this year, Happy Holden took the opportunity to record the conversation. Bob had some startling and exciting updates on the testing of microvias and through-hole technology.


SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.

Stencil Cleaning Update With Tom Forsythe

In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.

PCB Surface Preparation Before Solder Mask on Non-copper Finishes

A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.

Arlon Takes on High-Power Failure

In this video interview from IPC APEX EXPO, Pete Starkey and Dave Nelson, director of business development at Arlon Electronic Materials, explore causes of failure in high-power PCBs and explain how resin cracking during drilling can be overcoming using thermally conductive filled resin.

Technica and Wise Partner For Atmospheric Plasma Cleaning

In this video interview from IPC APEX EXPO, Technical Editor Pete Starkey speaks with Frank Medina, president and CEO of Technica USA, who introduces Massimo Passerini, VP of Wise, and the revolutionary Wonderwise system for cleaning double-sided atmospheric plasma.

The Direction of MacDermid Alpha’s Automotive Initiative

Nolan Johnson speaks with Lenora Clark about MacDermid Alpha’s automotive initiative, where her role fits into the company’s focus on supporting carmakers in various business areas, and where the future of automotive is heading.

Todd Kolmodin: Gardien an Essential Business for U.S. DoD Work

Todd Kolmodin, VP of quality for Gardien Services USA, updates Nolan Johnson on Gardien’s operations. Specifics include Gardien’s certification as an essential business for U.S. Department of Defense work and an overview of the work and staffing policies in place at all of the company's facilities across the United States and the various work restrictions—all with the goal of “keeping the wheels turning” in the industry.

The Smart Factory: All the Bits and Bobs

“Smart factory” is another phrase that describes Industry 4.0 programs. These programs seem to have replaced CIM and CAM, but it did not make them obsolete. While these topics are getting a lot of press, there is nothing new about them. We have been on a journey to automate manufacturing since the mid-‘70s. What has evolved are faster and cheaper computers, and more complex and integrated networking.

InduBond Gets Hot With Induction Heating Lamination

In this video interview from the show, Editor Nolan Johnson sat down to speak with Víctor Lázaro, InduBond’s R&D director and technical manager, about InduBond's latest technology for panel lamination utilizing induction heating. InduBond demonstrates a lamination oven on the IPC APEX EXPO show floor, as well as the advantages of the technology.

IPC APEX EXPO 2020 Attendees Speak: Heston Singh

"We have been coming here for many years, and we had another good experience this year," said Unitron's Heston Singh. "If it wasn’t good, we wouldn’t be coming back. They have products that are needed for this market, so we’ll be back every year."


Book Review: The 10 Stories Great Leaders Tell

Everyone is talking about stories, and rightfully so. Anyone who knows anything about marketing in the 21st century knows that the way to get into peoples’ heads is to tell them a story. Dan Beaulieu reviews Paul Smith's 'The 10 Stories Great Leaders Tell.'

Trends From the Show: Solder and Software

In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Advantages of Using ZIF Connectors as a Termination Method

There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.

Are Trade Shows at a Crossroads?

With the cancellation of this year’s E3 show, the biggest gamer conference, the event’s format is shifting to a more fluid, online communication method. This may be the wave of the future. Can you imagine if the COVID-19 outbreak had occurred just three months earlier? Would there have been a Consumer Electronics Show, DesignCon, or IPC APEX EXPO? If the coronavirus is still in play in six months, will these shows take place in 2021?

Institute of Circuit Technology Spring Seminar 2020

Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.

I-Connect007 Researchers Survey Industry on COVID-19 Outbreak Effect

In the last 24 hours, we surveyed our readers regarding the coronavirus (COVID-19) outbreak and its effect on our industry. After reviewing the first 100 survey responses primarily from North America and Europe, one-third of the respondents reported that the outbreak was having at least a small effect on their orders. Two-thirds of our readers have yet to see any effect on their orders.

2020 EIPC Winter Conference, Day 2

Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

2020 EIPC Winter Conference, Day 1

Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

IPC APEX EXPO 2020 Attendees Speak: Tom Salmon

"I’m impressed by what I’ve seen and the variety of solutions. Industry 4.0 is still a big thing here," said Tom Salmon of SEMI. "I’m guessing just by the number of attendees that we took a little bit of a hit from the coronavirus. But most of the people I’ve talked to are happy with the meetings that they’re having with folks. Overall, it seems to be positive for everybody."

Joe Fjelstad Breaks Down His Occam Process

Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?


XRF: An Essential Tool to Help PCB Manufacturers Meet IPC Specifications

One of the main challenges in PCB manufacturing is to create a stable, long-term coating of the copper surface to perform critical functions throughout the expected lifetime of the part. The surface coating is there to do two things: prevent the copper from oxidizing by coming in contact with the air and form a reliable contact for a soldered joint or wire-bonded connector.

Catching up With Midstate Electronics

Dan Beaulieu recently sat down with Susan Matteo, Joan Allen, and Gerri Wooten from Midstate Electronics’ sales team to discuss their company, how long they have been in business, the key ingredients to their longevity and success, and how they see the market today in general. Midstate offers everything from multilayer PCBs to flex and rigid-flex circuits and PCB assembly.

Stencils: Not As Simple As They Seem

Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

CB Tech and Technica Tout Titan’s Traits

During the show, Technical Editor Pete Starkey met with Frank Medina, president and CEO of Technica USA, and Harry Kok, international sales director at CB Tech. They discuss the features of the CB Tech Titan direct imaging system, which has very high throughput capability with best-in-class registration consistently maintained from the beginning to the end of the batch. Kok also explains how the Titan fits in with CB Tech’s ongoing plans for Industry 4.0.

IPC APEX EXPO 2020 Attendees Speak: Brian Wojtkiewicz

"It seems they are all pursuing digital imaging; whether it’s direct imaging exposure or inkjet solder mask, they’re all going that direction, and it’s not just the big customers; small customers are doing the same," said Taiyo's Brian Wojtkiewicz. "They’re investing money, which is good. New investment is what has been lacking for a couple of years."

Taiyo America Brings New Ideas to Solder Mask Development

During the show, Technical Editor Pete Starkey and Don Monn, Midwest regional sales director at Taiyo America, discuss the company’s progress with the establishment of inkjet solder mask as a production reality, now with OEM approvals. Monn also addresses the development of crack-resistant white solder mask and new screen-printable formulations with very high thermal conductivity.

Meet Sharon Cohen, I-Connect007 Columnist

Meet Sharon Cohen, one of our newest I-Connect007 columnists! Sharon’s columns will share Orbotech’s expert knowledge on how to maximize the value of manufacturing systems. Mr. Sharon Cohen is the president of Orbotech West, where he is responsible for the PCB division’s organization in North America and EMEA (Europe, Middle East, and Africa).

Burkle North America: New Equipment and ‘New Blood’ in the Industry

During the show, Guest Editor Dick Crowe and Kurt Palmer, president and CEO of Burkle North America, discuss Kurt's career history and responsibilities in his present role. Palmer also details the equipment that the company is exhibiting on the show floor, and the palpable excitement that veteran technologists feel this year seeing younger engineers and students attending IPC APEX EXPO 2020. There’s a lot of “new blood” in the industry, as Palmer explains.

Max Seeley: Some Designers Hesitant to Adopt New Tech

I spoke with Max Seeley of 3M about a design class he presented at AltiumLive in Frankfurt, Germany. We also discussed autorouting and the continuing advances in EDA tools, as well as the schism between users who embrace new technology and those who still prefer to layout their boards the old-fashioned way. Which camp do you belong to?

IPC APEX EXPO 2020 Attendees Speak: Katie Carl

"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."


Solder Paste Printing From the Stencil’s Perspective

Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Will Moisture Management Expand to the U.S. Market?

Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.

Solder in PCBA: Can’t Live Without It... or Can We?

For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

IPC: Automotive Electronics Segment Exploding

Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.

Advances in Substrates for Thermal Management

Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.

Gardien: Selling Test Equipment and Services

In this Real Time with... IPC interview, technology editor Pete Starkey speaks with Jason Posey, director of sales and service with Gardien. They discuss Gardien's range of flying probe testing and the introduction of AVI into the North American market.

Not All Plating Lines Are Created Equal

Barry Matties and Happy Holden met with CEO Michael Ludy and CMO Sarah Großmann from Ludy, a company specializing in galvanic plating equipment for PCBs. This interview gives an overview of Ludy and their latest advancements in PCB plating equipment.

RTW IPC APEX EXPO: John Mitchell Discusses the Show's Evolution

During IPC APEX EXPO, Technology Editor Dan Feinberg spoke with John Mitchell, CEO and president of IPC, about the event’s evolution from a strictly PCB show into a miniature Consumer Electronics Show, including new ideas and prototypes. They also discussed several new IPC initiatives, including IPC Design.

IPC APEX EXPO 2020 Show Week Time-lapse Video

It was a busy week at IPC APEX EXPO in San Diego, and I-Connect007 was there to cover it all. From set-up to tear down, I-Connect007 captured a four-day time-lapse video of the show floor. We’d like to thank our good friends at MacDermid Alpha for letting us set up our camera in their booth.

AT&S: Working With Designers on a Global Level

Barry Matties recently took a tour of AT&S’s Austrian factory, which is developing new circuit design strategies surrounding embedded and active components. Gerald Weis discusses the company’s focus on serving and educating PCB designers around the world, as well as their plans to embrace the latest technology and Industry 4.0 processes going forward.


IPC APEX EXPO 2020: Day 1 Review

2020 was a special anniversary year for IPC APEX EXPO: “Celebrating 20 years of excellence in electronics” was the tagline. Pete Starkey provides a review of the Day 1 activities on the show floor and beyond.

‘A Night of Happy-ness’ and 2020 Good for the Industry Awards

The Horton Grand Hotel in San Diego was the site of “A Night of Happy-ness” on the evening of Monday, February 3, 2020. I-Connect007 transformed the Regal Ballroom into a cozy lecture hall with two key objectives: to award the I-Connect007 Good for the Industry awards, and to celebrate the life, achievements, and personality that is industry pioneer Happy Holden.

Upcoming IPC APEX EXPO Offers Sessions on 5G

Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.

IPC Solder Stencil Task Group—Inviting OEM Input to IPC APEX EXPO Meeting

Jeff Schake of ASM Assembly Systems is chairman of IPC’s Solder Stencil Task Group. In this conversation with Nolan Johnson and Barry Matties, Jeff discusses what they will be meeting about at the upcoming IPC APEX EXPO.

I-007e Micro Webinars Releases Part 3 in ‘Coatings Uncoated!’ Series

Have you ever wondered about the process of corrosion and the formation of tin whiskers? The third episode of the popular webinar series, "Coatings Uncoated," is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.

Kurt Palmer Takes on New Role as Burkle America President

During productronica 2019, Barry Matties chatted with Kurt Palmer about his new role as president of Burkle America, the work they do with Schmoll Maschinen, and why customers in North America must continue to invest to keep up with the technology and be profitable.

Four Reasons to Choose Polycapillary Optics for XRF Coatings Analysis

As electronic components continue to shrink and increase in complexity, metal finishes on these components need to be plated onto smaller features. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition because it’s non-destructive, fast and straightforward to use.

CES: The Main Halls

CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.

Fresh Thinking on the Logistics of Laminate Distribution

Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.

Flexibility Is Key to Direct Imaging Success

Brendan F. Hogan, managing director of MivaTek, explains that while each industry has its own set of requirements and difficulties, the lines between semiconductor and PCB markets are blurring, demanding more flexibility from equipment suppliers.


Streamlining Inspection and Verification

Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.

Alex Stepinski: GreenSource Fabrication Update

Alex Stepinski gives an update on GreenSource, their acquisition of AWP, and their move to full production after some delays. Barry Matties and Alex also discuss automation and the difficulties in hiring in the U.S. and announces the decision to go to market with their recycling equipment in 2020.

Logistics Are Frank Lorentz’s Passion

Recently, Barry Matties had the chance to visit Ventec International Group’s German facility in Kirchheimbolanden (KIBO), where he met Frank Lorentz, Ventec’s general manager for the location. Logistics are clearly Frank’s passion. He lives and breathes it. If you spend any amount of time with him, that is abundantly clear. This interview with Frank was conducted after a tour of the KIBO site.

The World of PCBs: Anything But Boring

Andy Shaughnessy had the chance to catch up with Megan Teta, CID+, product manager of design and education services at Insulectro. Megan explains why she’s excited to become more involved in training and why the world of PCBs is anything but boring, contrary to popular opinion.

CES: Sands Show Floor and ShowStoppers

Every year at CES, ShowStoppers and a similar event, Pepcom, demonstrate many new devices and technologies. Again, some will become devices we can’t live without, and some you will never hear about again. Seeing all of these new ideas is one of the highlights of attending CES. Enjoy this look at a potpourri of new, innovative high-tech products.

Updates on Cleaning Standards and Committees

Graham Naisbitt of Gen3 discusses the changes he's seeing in cleaning, including how the WP-019 white paper has caused a closer look at electrochemical reliability. As a long-time head of committees, Graham also breaks down many of the topics he hopes are addressed at this year’s IPC APEX EXPO.

What’s the SCOOP: Chinese New Year

Chinese New Year really is an amazing celebration with millions of workers returning to their families for the celebrations. But with the shutdown and mass migration come stress on infrastructure, supply chain and the whole manufacturing and fulfillment ecosystem. I asked a few Industry experts what they thought the key issues are and what advice they’d offer.

Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision

Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.

Clean vs. No-clean: A Generational Difference

Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.

MacroFab: Manufacturing Digitized

MacroFab CEO Misha Govshteyn explains how a digital manufacturing platform connected to a network of vetted partner factories can help eliminate a lot of variability from the fabrication process.


Wi-Fi 6: Wired vs. Wireless

We all know that it makes no sense to get the latest device just because they come out with a new one every year. Sure, post-millennials tend to want a new phone every year, but most of us are well past that. However, as the competitive nature of the consumer tech industry continues to increase, the rate of change is also accelerating, as is the peer pressure to upgrade. Non-techies get new phones every year, techies get new CPU and GPUs every two years, average consumers get bigger and higher-res TVs every three years, and on it goes.

Insulectro Works to Bridge the Fabricator/Designer Gap

Barry Matties sat down with Insulectro’s Megan Teta and Mike Creeden to discuss trends they see in the materials market and how they’re working to bridge the gap between fabrication and design, including helping designers understand what they can do to make a board more manufacturable.

Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation

The latest book in I-Connect007’s "The Printed Circuit Assembler’s Guide to…" series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.

BTU Discusses its Next-generation Flux Management System

At productronica 2019, Nolan Johnson spoke with Peter Franklin, managing director of BTU Europe, about BTU’s next-generation solder reflow flux management system—Aqua Scrub. A winner of the show’s Global Technology Award for Soldering, Peter breaks down the specifics of what makes Aqua Scrub such an intriguing technology.

CIMS Galaxy: More Than an Inspection System

Editor Pete Starkey and Vladi discuss the newest CIMS AOI platform, Galaxy, which is more compact and more versatile than the previous Phoenix model. The Galaxy is scalable and can be equipped with more functions and connected to a variety of Industry 4.0 databases. Vladi explains that the Galaxy can be used for everything from inner layer inspection to final inspection, detecting defects down to 1 pixel. The system is available with multiple metrology options as well.
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