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The Sales Survival Handbook: Cold Calls, Commissions, and Caffeine Addiction—The Real Truth About Life in Sales
07/19/2017 | Dan Beaulieu
Review of the 2017 IPC Reliability Forum
07/18/2017 | Steve Williams
The Skills Gap – Meet People Where They Are!
07/14/2017 | Julie Desisto, IPC
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
07/11/2017 | Patty Goldman, I-Connect007
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
07/10/2017 | Doug Sober, Essex Technologies Group, with Stephen Tisdale, Tisdale Environmental Consulting LLC
PCB :: Fabrication Process
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
I-Connect Survey on Process Step Elimination: What is More Important for Productivity?
Is utilizing the best technology out there the most important factor in improving productivity? Or is it automating certain, if not all, processes in your production? What about employee morale, what is its impact on the overall productivity of your line?
A Deep Look Into Embedded Technology
In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.
Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.
I-Connect Survey on Process Step Elimination: Cycle Time Spent on Final Inspection
In our recent survey on process step elimination for the upcoming issue of The PCB Magazine, one of the questions asked was the percentage of total cycle time spent on final inspection. Around half of the respondents answered they only spend generally between 1% and 5% of their total cycle time doing final inspection of their products.
Designing with Ultra-Thin Flexible Printed Circuit Boards
Designing with flexible PCBs is not much different from doing the same with rigid boards, except that the designer must account for the mechanical complexity associated with flex circuits. For instance, a flexible PCB can tear if flexed beyond its capability during installation. Therefore, it is very important to create a mechanical model of the PCB and test it for a proper fit, before taking up the electrical design.
Weiner’s World – June 2017
On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.
Embedding Components, Part 1
The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure.
The Significance of the PCB in the Value Chain of the European EMS Industry
At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.
A Brief Tutorial on Embedded Capacitors
Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable.
A Twist on Printed Electronics: Printing on 3D Shapes
Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
Romania’s PCB Design Students Compete at TIE 2017
During the last week in April, the 26th Interconnection Techniques in Electronics (TIE) show was held at the Gheorghe Asachi Technical University in Iasi, Romaina, a wonderful hill town not unlike Rome. The event, a convention for the Romanian electronic packaging community, included a series of actions designed to draw smart young students to the electronics industry, which is clearly growing. Participants had only four hours to create this PCB design, which was generated by a team of professionals from Continental Automotive Romania Timisoara.
Mitch Altman Discusses Bringing Youth into the PCB industry
Publisher Barry Matties is joined by Mitch Altman, creator of TV-B-Gone, a device that can turn off TVs in public, and co-founder of Noisebridge, an educational hackerspace based in San Francisco. In this interview, they discuss the importance of bringing youth into the PCB industry and how Noisebridge has inspired people of all ages to get started creating their own electronics.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
A Conversation with an Industry Twenty-Something
At a recent SMTA Expo, I met with Matt Hammesfahr, a salesperson with Amitron. Matt is young, by our industry standards—in his midtwenties. Just a few years out of college, Matt holds a business degree and is already a top salesman with the company. Here’s one of those twenty-somethings we keep saying we want to attract to our industry. How did this happen? I had to get the story.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
Innovator Bob Tarzwell Retires From PCB Industry to Focus on New Career in Art
I have known Bob Tarzwell for more than 18 years, since he first called me looking for some help with his company. His first words to me were, “Hi, my name is Bob Tarzwell and I own a shop in Carleton Place, Ontario. I need your help."
Ladle on Manufacturing: Testing Times Ahead
Bare board electrical test: For the most part, it does what it says on the tin. Current CAM software and test hardware means that in theory, it is a pretty simple exercise to make sure that a printed circuit matches the intended design. But are you getting the test you think you are?
Help Wanted With IMI’s Peter Bigelow
In preparation for this month’s topic, especially what companies in our industry are currently experiencing when it comes to finding and hiring the right people, I sought out Peter Bigelow, president and CEO of circuit board fabricator IMI Inc. We spoke in February at IPC APEX EXPO.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future
The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.
Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation
The DoD mandate for trust in the PrCB supply chain is mirrored in DoDI 5200.44, which states: “Employ protections that manage risk in the supply chain for components or subcomponent products and services (e.g., integrated circuits, FPGAs, PrCBs) when they are identifiable (to the supplier) as having a DoD end-use.” In response to congressional and DoD directives, the PrCB EA proposed pursuing a trust accreditation program for PrCB suppliers.
Weiner’s World—April 2017
China’s economy accelerated for a second straight quarter as investment picked up, retail sales rebounded, and factory output accelerated in March. Gross domestic product increased 6.9% in the first quarter from a year earlier, compared with a 6.8% median estimate in a Bloomberg survey.
Innovating in the Technology of Stretchable PCBs
Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.
Material Choices for High-Speed Flexible Circuits
Materials to make high-speed flexible circuits are now available from many material suppliers. In deciding which materials to test or use, remember the tradeoffs the suppliers made in categories we discussed: electrical properties, mechanical/flex properties, and ease of processing. A choice should only be made after considering these options. Remember with any new materials it is very important to find fabricators that are knowledgeable about processing these new materials.
Patty’s Perspective: Faster, Faster, Faster…or the Need for Speed, More Speed!
I wonder: Do we really need more speed in our connections? When will we hit that proverbial wall everyone worries about? Of course, if we want things like autonomous cars, intelligent robotics, and extended IoT, then we will continue to press forward—or rather you, the PCB manufacturer, designer, and supplier of high-speed materials will keep at it.
PCB Technology Requirements for Millimeter-Wave Interconnect and Antenna
The work done by Optiprint AG in support of MiWaveS substantiates that PCB technology can satisfy the engineering requirements for mmW circuitry providing the manufacturing capabilities can match the positional accuracy, feature tolerance and surface finish requirements.
Crucial Considerations for Building Flexible Heaters
An electronic heater is created by driving electric current through a resistive element. As the current is drawn through the element, some of the energy is expelled as heat. That heat can then be transferred to other surfaces with positive effects.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
MACFEST: Benchmarking a New Solderable PCB Finish
New, innovative manufacturing procedures have been developed by the recently completed project, Manufacturing Advanced Coating for Future Electronics SysTems (MACFEST), which has been funded by several partners and the government’s Innovate UK.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
Stretching Beyond Flex
Emerging end-use electronic applications are driving dramatic innovations in circuit board and interconnection technology. New form factors, functionality and durability requirements are challenging the status quo for the PCB industry and pushing design, material and process development to the limit.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
EIPC Workshop on PCB BioMEMS
The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-on-chip.
Inkjet Printing Solder Mask
Known for their film-based products, AgfaGevaert has turned its focus to the difficult task of inkjet printing solder mask by partnering with solder mask expert Electra Polymers. Sitting down with Frank Louwet and Mariana Van Dam of Agfa Specialty Products, Publisher Barry Matties and Technical Editor Pete Starkey learn more about the partnership and where they currently stand in the development of what will be a definite game changer.
The Wide World of Flex
In one sense the flexible circuit industry has remained amazingly stable. Polyimide remains the workhorse dielectric film; imaging is done by exposing a pattern on a photosensitive film; copper is subtractively removed from a patterned substrate; and crylic adhesive is commonly used to laminate polyimide coverlay as an insulation. But there have also been some rather dramatic changes...
The Near and Far Future for Orbotech and Inspection
Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.
RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity
Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.
Now, isn’t that the mantra we all hear today? For me, it’s Tai Chi to maintain physical flexibility. But of course, that is not what we’re here for. We’re talking flexible circuits including all the variations of same, which is why we called this issue “The Wide World of Flex.” Because the world of flex is broad—and it’s rapidly getting wider.
RTW IPC APEX EXPO: Schmoll and Taiyo America Partner to Speed Up Solder Mask Development
How to accelerate the development of specialist direct-imaging solder resists to suit the requirements of the Asian and North American markets? Jesse Session, technical manager at Taiyo America, describes how close collaboration between ink formulator and equipment supplier enables the optimization to be achieved most effectively.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider. He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: Taiyo Discusses Option for PCB Heat Dissipation—Thermally Conductive Solder Resist
Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.
Industry 4.0–Inkjet Technology is Changing the World of PCB Manufacturing
When the Germans coined the term Industry 4.0 back in 2011, it wasn’t clear to many what it actually stood for. Although the debate about all the nuances of the term’s meaning is still ongoing, one aspect of it is undisputed: The “computerization of manufacturing” is at the heart of it.
RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density
Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
Eagle Electronics: Success through 'Building Everything'
During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
The Power of Three: A Solder Mask Solution for North America
Technology and process developments in mature industries like the printed wiring board industry are not always easy. Many new products are evolutionary enhancements of existing processes. Often, these developments enhance the process and improve overall process control.
Schmoll Talks Technology
Schmoll’s Thomas Kunz and I had a chat recently at the HKPCA show. In our short discussion, we covered several topics, including Schmoll’s approach to the U.S. market, their work in direct imaging, and the nature of their relationship with ink suppliers.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
Vertical Conductive Structures–a New Dimension in High-Density Printed Circuit Interconnect
From our previous conversations, I knew that Joan Tourné was working on a novel high-density interconnection concept. Having eagerly awaited the chance to discuss the technology in detail, I was delighted when he contacted me to confirm that his IP had been secured and that he could now talk openly about VeCS, the Vertical Conductive Structure designed to provide a cost-effective alternative for complex fan-out from fine-pitch grid array components.
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Ladle on Manufacturing: Drilling Deep
Whether you stack high or drill thick panels, the dynamics of drilling are similar. When you overlay the outer-layer artworks you may notice that the holes on the exit side of the panel or stack have a much higher level of positional variation than the entry side holes.
Catching up with…Prototron Tucson’s General Manager Kim O’Neil
Prototron’s Tucson Division serves as the company’s military defense division as well. They focus on mil-spec and aerospace work as well as special technology PCBs such as RF, microwave and flex circuits. During the past few months Kim 0’Neil and his team have been working on updating their mil-spec qualification from MIL-PRF-55110 to MIL-PRF-31032. Since Prototron is one of the first companies to make this transition, I wanted to talk to Kim about this accomplishment.
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
Electroplated Copper Filling of Through-holes: Influence on Hole Geometry
The process consists of a two-step acid copper plating cycle. The first step utilizes periodic pulse reverse (PPR) electroplating to form a conductive copper bridge across the middle of a through-hole and is followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.
Trouble in Your Tank: Acid Copper Plating
Electroplating a printed circuit board is by no means a trivial task. Higher layer counts, smaller-diameter vias (through-hole and blind) as well as higher-performance material sets contribute to the greater degree of difficulty with today’s technology.
True DFM: Taking Control of Your EDA Tool
We PCB designers are doing some truly great things with our layout tools. But we must remember that these tools are so powerful that they will sometimes allow us to design things that can’t be manufactured! We must collaborate with our fabricator and assembly brethren and embrace the best DFM practices, or face the consequences downstream.
Study of Immersion Gold Processes Used for Both ENIG & ENEPIG
The use of electroless nickel/electroless palladium/immersion gold (ENEPIG) has been steadily increasing the past several years and benefits of the finish have now become well-known throughout the industry. The finish provides both reliable solder joints and wire bonds
Catching up with…Nessis Inc. President Kathleen Niles
When I checked in on one of my old PCB sales associates recently, he told me that he had a new gig selling the latest and greatest new productivity software tools. He spoke so highly about Nessis Inc. and what their tools could do for companies, especially PCB shops, that I decided to learn more. I arranged to talk with Kathleen Niles, the co-founder and president of Nessis Inc. Here is a portion of that conversation.
Patty’s Perspective: Everything Old is New Again
This month’s issue is all about plating and surface finishes; long ago, that was pretty much my start in the world of printed circuits—wet processing. So this is kind of my home turf—and not, since I haven’t worked in wet processing for some…well, for many years. I’ve always expected that I could hop right back onto the plating room floor and pick right up where I left off all those years ago. Or could I? Have things changed much? Time to read on and see.
WKK and Schmoll Join Forces in China
Tom Burkhardt of Schmoll Maschinen and Hamed El-Abd of WKK spoke with Publisher Barry Matties about the recently formed distribution partnership between the two companies and specifically how each company stands to benefit from this pairing.
Ladle on Manufacturing: Material Matters
Have you considered whether or not you could improve your multilayer yields by better use of your base materials? Perhaps the following could give you a few ideas of how this could help you.
Catching up with...Coast to Coast Circuits CEO Walt Stender
Coast to Coast is an independent American circuit board manufacturing company. Yes, the key word here is “independent.” After many mergers and acquisitions that have diminished the mil/aero PCB vendor base, there are only a handful of independent companies for our country’s defense and aerospace contractors to choose from.
CES 2017: Press Day, Launch.It and Showstoppers
Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.
Emmy Ross Discusses the New I-Connect007 E-Book Series
One thing that is long overdue in our industry is a series of guidebooks focused on helping companies with all their needs, from qualifications like AS9100 and Mil-P-31032 to various technologies, heavy copper, rigid-flex and microvias. I-Connect007 is now providing our industry with an entire series of these guidebooks, starting with the first book, "The Printed Circuits Buyers Guide to… AS9100 Certification." Authored by Imagineering Inc., this book educates readers about the AS9100 quality standard, and explains how to earn this certification.
Catching up with...M&A Expert Tom Kastner
If you want to know what is going on in our industry when it comes to mergers and acquisitions, there is no better person to turn to than Tom Kastner. Whenever I want to verify a rumor of a company being bought or sold, Tom is the first person I call, and unless he is under an NDA, he will fill me in. In this, our latest discussion, we talked about the PCB industry’s M&A activity in 2016 and what Tom expects to see in 2017.
Catching up with…Dr. Anthony Caputo
I met Dr. Anthony Caputo last year while helping one of my clients secure some strong engineering talent. Anthony had been reading my columns and reached out to me since he was looking for a new opportunity in a high-tech printed circuit board facility. Once I read his CV and saw his credentials, I jumped at that chance to help this talented young man.
Rather than joining the annual forecast fray by attempting to provide guidance or guesses as to the outlook for the PCB and electronic assembly businesses in 2017, I thought I would provide a different year-end assessment. Here are a few thoughts for the New Year and beyond from a long-term colleague and friend of the past half century, Harvey Miller, electronics market researcher, consultant and founder of Fabfile Online.
Innovative Use of Vias for Density Improvements
In today’s fast-paced global, economic environment—which requires constant innovation, upskilling, and performance improvements— there is a need for increasing density. The classic way to increase density is to reduce the trace and spacing.
Patty’s Perspective: Everything You Want to Know about Vias but Were Afraid to Ask
Regarding our survey on vias, almost 85% of our respondents said they used blind/buried vias. And since 15% of those answering were either suppliers or consultants, it seems that approximately 100% use the B/Bs. OK then, on to a tougher question. We then asked how often, and it turns out that “use” covers everything from rarely to pretty much all the time, with a definite undercurrent of “because we have to.”
Advanced UV Lasers for Fast, High-Precision PCB Manufacturing
For more than 30 years, lasers have played a significant role in the manufacturing of PCBs. It is not a coincidence that electronic devices have, at the same time, become increasingly miniaturized. The ability to tightly focus a laser beam much smaller than a mechanical tool has been an enabler of such dense, compact circuitry; and the elimination of consumables such as drilling and routing bits has reduced manufacturing costs.
Here we go again! The winter holiday (and trade show) season is upon us! Electronica's mood was upbeat. Next, the Asia and San Diego shows. We just received word as we were preparing for our trip to next month's HKPCA/IPC event in Shenzhen China that the CPCA (China Printed Circuit Association) show suddenly changed its March 2017 date and venue. Meanwhile, the HKPCA show, now billed as our industry's largest event, will have nearly 550 exhibitors—of which 20% are new.
KCE Group: A Thailand-Based PCB Manufacturer with a Growing Global Footprint
Recently, while at electronica in Munich, Germany I-Connect007's Judy Warner met KCE America President Rick Rhodes, and Joe Yeo of KCE Group. They discuss the unique challenges and opportunities that come with the rigorous automotive market, and explain why they continue to enjoy explosive growth.
Rogers Highlights Thermally Enhanced 92ML Materials at electronica
I met with Rogers Corporation Business Development Manager John Ranieri at Electronica recently. Ranieri’s professional focus is on the 92ML series of laminate, prepregs, and IMS, which was highlighted at the Munich show. The 92ML products are geared for the power electronics marketplace where thermal management is a major concern.
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