Article Highlights
Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review
02/21/2018 | Pete Starkey, I-Connect007
EIPC’s Winter Conference in Lyon, France: Day 2 Review
02/20/2018 | Pete Starkey, I-Connect007
Blue Sky for Eagle Electronics
02/19/2018 | Patty Goldman, I-Connect007
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
02/14/2018 | Barry Matties, I-Connect007
EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
02/12/2018 | Pete Starkey, I-Connect007
PCB :: Fabrication Process

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Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s Winter Conference in Lyon, France: Day 2 Review

The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

Blue Sky for Eagle Electronics

I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

Aismalibar on Laminates, Following the Market, and More

At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.

Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design

This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.

Solder Limits: Updates for the Age of Surface Mount

Solder limits are one of the fundamental parameters used when evaluating the PCB, solder resists, and metal-clad base materials for safety under the UL Recognition programme.

The Best It’s Ever Been, Every Year: The Goal for IPC, Part 2

In the continuation of this interview, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.


Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?

SICK AG is a global manufacturer of sensors and sensor solutions for industrial applications, with headquarters located in Waldkirch, Germany. After a demo of Nano Dimension’s new 3D printing machine at productronica, Barry Matties met with SICK’s Danny Wernet to discuss its pros and cons and get his overall impression of the technology. Are 3D prototypes really as simple as feeding in a Gerber file and pushing a button?

Staying Ahead of Market Trends through Education

ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.

productronica 2017 Means Connecting to Global Customer Base for Circuit Automation

Circuit Automation’s Tom Meeker joined me for a conversation at productronica 2017 in Munich, to update me about what the company has been doing in solder mask coating equipment.

In Terms of Experience, a 10,000-foot View of China

In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.

The Benefits of Coming Together to Form a Global Reach

At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.

Schmid: Bringing Integrated Solutions to the Market

With China’s recent shift towards quality, the next generation of PCB fabrication equipment must target yields and include the ability to track those yields, says Schmid’s Laurent Nicolet and Demitry Kostouros. Barry Matties recently sat down with these two gentlemen to talk more about the market shift and Schmid’s introduction of their new vertical line aimed at carving a niche in the market.

Lamination to Drilling in Minutes: It's New and it's Not

Barry Matties met with Lino Sousa at productronica to check out Pluritec’s new Pluricut HPL machine, which offers an all-in-one solution for flash routing, beveling, measuring, and corner routing. See this machine in action by viewing the attached video content.

Weiner’s World—December 2017

Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.

The Impact of HDI on PCB Power Distribution

A key aspect of HDI technology is the use of microvias. For reference, the IPC HDI Design Committee has identified microvias as any hole equal to or less than 150 microns. Multiple types of HDI stack-ups associated with blind and buried microvias can be used to meet the density and cost requirements for today’s products. Design teams should develop stack-ups in conjunction with the fabricator to minimize cost and meet signal integrity requirements.

Isola: Evolving with the Market

In this interview from productronica 2017, Isola’s Karl Stollenwerk discusses the decline of the laminate market in Europe over the past 17 years, current demands on raw materials, and Isola’s new strategy to remain competitive.


A Unique Norwegian Approach to Serving Customers

I met a lot of interesting people at productronica, with an assortment of different products on display. Such was my visit with Oyvind Tafjord, CEO of Visitech. His purpose at the show was to meet with his customers, so nothing unusual about that. But his customers also had booths (or stands, as they call them), which is an advantage for him, as he explains here.

AGFA: From Film to Inkjet Solder Mask

The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.

Ventec: Eye on the Future, with Automotive and Lighting Front and Center

Ventec’s Thomas Michels and Didier Mauve sat down with I-Connect007 Editors Patty Goldman and Pete Starkey and enjoyed an upbeat and enlightening conversation. Among the topics covered were the importance of working partnerships in maintaining supply chain continuity, market drivers for thermally conductive materials, and development of enabling technologies to support the automotive electronics revolution.

A Fresh Look at Outsourcing Solutions in Electrical Testing

In this interview conducted at productronica 2017, Gardien Group COO Roland Valentini describes to Pete Starkey the limitations of the traditional outsourcing model for electrical testing and explains the need for customised solutions directly catered to customers’ individual requirements.

Viking: Covering the Globe with Value-Added Services

In the final hours of productronica 2017, Barry Matties met with Jake Kelly of Viking to discuss the company’s value-added services, their growth in the India and America markets, and the UCE manufactured line they displayed at productronica.

Institute of Circuit Technology Harrogate Seminar 2017

A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.

Full-Service Plating at Hofstetter

While strolling the aisles at productronica, I happened upon the booth of Hofstetter Plating. I was not familiar with this PCB company so I stopped to chat. It turns out they aren’t exactly a PCB fabricator, but provide a comprehensive plating service in Europe and occasionally beyond that, offering several exotic and unique plating processes.

Pluritec Wants to Remove Human Factor from Solder Mask

Solder mask remains a relatively hands-on task, which can result in human error. But equipment manufacturer Pluritec wants to change that. At PCB West, I spoke with Pluritec Vice President of Sales Lino Sousa about the company’s new spray technology that can turn solder mask application into what is essentially a push-button operation.

35 Years of HDI Fabrication Processes and Obstacles for Implementation

The electronics industry is the world’s largest and most robust market. It is also a bulwark of American creativity, with Silicon Valley as its origin and fortress.

Bay Area Circuits Updates InstantDFM Tool

Bay Area Circuits is on a quest to help PCB designers and design engineers. For the past few years, the company has been holding facility tours and open house events to help designers understand more about the fabrication process. Now, Bay Area Circuits has upgraded its free design tool, InstantDFM.com, which allows customers and non-customers alike to check manufacturability and request pricing of their jobs. At PCB West, Andy Shaughnessy spoke with President Stephen Garcia and COO Brian Paper about the new tool update, and some of the other services they offer for PCB designers.


A Conversation with EIPC Executive Director Kirsten Smit-Westenberg

The EIPC booth was a busy place during productronica, with several members and other organizations headquartered there, resulting in a constant stream of people stopping by to visit, get information and study the upcoming conference agendas. Overseeing the big, and even the little things, was Executive Director Kirsten Smit-Westenberg, who made sure important questions got answered, people stayed hydrated, and EIPC’s magnetic pins found homes on shirt collars.

Zuken Teams With Nano Dimension for 3D Printing Design Flow

At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.

HDI: Born in the USA and Making a Comeback

There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

Video from productronica 2017: Electra Polymers Updates on the Latest Developments in DI Soldermask

From the show floor at productronica 2017, Electra Polymers' sales manager Ashley Steers discusses the state of the art in soldermask for direct imaging. Sales and marketing director Shaun Tibbals comments on developments in ink-jet soldermask, and opportunities in wafer-level packaging.

Video from productronica 2017: Taiyo America Highlights Ink-Jettable Solder Mask

After a long-term program of cooperative development, evaluation and qualification, Taiyo America’s solvent-free ink-jet solder mask formulation is working successfully in a technically demanding production environment. Don Monn recounts his experiences from the show floor at productronica 2017.

The PCB Norsemen: Industry 4.0, AI and CircuitData

As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.

Groundbreaking Developments at liloTree

I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.

AltiumLive Summit—Munich, Germany, Part 1

Altium held a very successful AltiumLive PCB Design Summit in San Diego, California at the beginning of October for the benefit of their North American design community, and followed it three weeks later with a counterpart European event in Munich. And what an eye-opener it proved to be—literally hundreds of delegates, a superbly organised and managed programme, billed as a completely immersive two-day interactive design experience on a theme of learning, connecting and getting inspired.

Leveraging Industry Shows to Create a Presence

At the recent SMTA International show in Rosemont, Illinois, I had an opportunity to meet with Mark Osborn, president and owner of Colonial Circuits, based in Fredericksburg, Virginia. Colonial Circuits is a supplier of PCBs, mainly for the defense industry.

New I-Connect007 Team Members Tour American Standard Circuits

Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.


Planning a PCB: Signal Integrity and Controlled Impedance Considerations

Knowledge and experience are the two key elements when planning a PCB. Today’s PCB designers must have far more knowledge and understanding of the PCB production process than in the past. This is especially important when they plan and how they plan the stackup, via span, routing and power distribution.

Final Finishes: Taking Gold Thickness into Account

Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.

HDI’s Beneficial Influence on High-Frequency Signal Integrity

The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

PCB Signal Integrity Optimization Using X-ray Metrology

It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components.

Strategies for Developing Copper Plating Systems

I-Connect007's Patty Goldman met with Dr. Albert Angstenberger, global technology manager for metallization with MacDermid Enthone Electronics Solutions, while at SMTA International. He presented a most interesting paper on copper pillar plating systems that we hope to publish in The PCB Magazine sometime in the future.

Experts Discussion: Signal Integrity and Impedance Control

When the content gathering for an issue on signal integrity and controlled impedance was officially underway, our I-Connect007 editorial team’s first stop was an “experts discussion” with industry experts: Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries. This teleconference call was a whirlwind at times, but we captured valuable information that we have distilled here, for our readers.

Process Engineering & Defect Prevention

Defects may “manifest” or be detected in or after a specific operation within the printed circuit board manufacturing process, but the underlying root cause may have occurred earlier (perhaps much earlier) in the process.

3D Printed Electronics for Printed Circuit Structures

Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.

Institute of Circuit Technology Hayling Island Seminar 2017

This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.

The State-of-the-Art in PCB Pre-production Engineering

If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.


Ventec Shares Their Insights on the Laminate Market, Part II

The discussion on laminates and markets with Ventec’s Mark Goodwin continues as he talks about the importance of service, where Ventec is headed, and offers some advice on partnering with your supplier.

'Can Do' in CAM Outsourcing

Time-to-market has been the mantra for every successful technology company. The best among them have strong and integrated supply chains that march to the drum of the OEMs and EMS providers that bring that technology to market. A big part of that success, especially in North America and Europe, is the ability for PCB manufacturers to turn around complex PCBs very quickly. The hallmark of PCB production in these higher-tech, higher-cost regions is flexibility and responsiveness.

High-Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes

The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors.

Hamed El-Abd: A New Beginning, Part 2

In Part 2 of this interview with Hamed El-Abd, Barry Matties continues the conversation as Hamed recalls witnessing the growth of China through the past 30 years. We also learn what Hamed plans to do in his retirement and it doesn't involve being static!

Hamed El-Abd: A New Beginning, Part 1

While in China recently, Barry Matties joined longtime I-Connect007 friend and contributor Hamed El-Abd of WKK to congratulate him on his upcoming retirement. They reflected on his time spent in the industry, specifically in China, how far it’s come, and where it might be headed next.

Laser Patterning & Metallization to Reduce Process Steps for PCB Manufacturing

This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.

Cycle Time Reduction Through W.O.R.C.

Lean, theory of constraints (ToC), quick response manufacturing (QRM), cross-training, and staticstical process control (SPC) are powerful, tried and true methodologies for process improvement. However, these tools are rooted in high-volume manufacturing environments and don’t always play nice in a high-mix, low volume (HMLV) operation. The new W.O.R.C. manufacturing strategy was specifically developed to overcome these shortcomings while capitalizing on their strengths.

Patty's Perspective: How do You Define Process Step Elimination and Automation?

This month, we can call our theme PSE&A—a fancy acronym for process step elimination and automation. Sounds straightforward, but what exactly do we mean by “process step elimination?” Does it refer to shortening the numerous steps involved in making a printed circuit board? There sure are a lot of them, but they all must be necessary—or why would we have them?

Victory Giant Technology: The Qualified Forerunner of PCB Smart Factories

The topic of the July issue of PCB007’s China Online Magazine is “Automatic PCB Factories,” focusing on the pressures of cost, delivery time and process, and the irreversible trend toward automated PCB factories. Centering on this theme, we interviewed Andy Zhou, COO of Victory Giant Technology (HuiZhou) Co. Ltd., the first domestic PCB manufacturer who carries out large-scale implementation of intellectualization throughout the factory.

Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111

There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.


I-Connect Survey on Process Step Elimination: What is More Important for Productivity?

Is utilizing the best technology out there the most important factor in improving productivity? Or is it automating certain, if not all, processes in your production? What about employee morale, what is its impact on the overall productivity of your line?

A Deep Look Into Embedded Technology

In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.

Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects

A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.

I-Connect Survey on Process Step Elimination: Cycle Time Spent on Final Inspection

In our recent survey on process step elimination for the upcoming issue of The PCB Magazine, one of the questions asked was the percentage of total cycle time spent on final inspection. Around half of the respondents answered they only spend generally between 1% and 5% of their total cycle time doing final inspection of their products.

Designing with Ultra-Thin Flexible Printed Circuit Boards

Designing with flexible PCBs is not much different from doing the same with rigid boards, except that the designer must account for the mechanical complexity associated with flex circuits. For instance, a flexible PCB can tear if flexed beyond its capability during installation. Therefore, it is very important to create a mechanical model of the PCB and test it for a proper fit, before taking up the electrical design.

Weiner’s World – June 2017

On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.

Embedding Components, Part 1

The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure.

The Significance of the PCB in the Value Chain of the European EMS Industry

At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.

A Brief Tutorial on Embedded Capacitors

Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable.

A Twist on Printed Electronics: Printing on 3D Shapes

Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.


Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Romania’s PCB Design Students Compete at TIE 2017

During the last week in April, the 26th Interconnection Techniques in Electronics (TIE) show was held at the Gheorghe Asachi Technical University in Iasi, Romaina, a wonderful hill town not unlike Rome. The event, a convention for the Romanian electronic packaging community, included a series of actions designed to draw smart young students to the electronics industry, which is clearly growing. Participants had only four hours to create this PCB design, which was generated by a team of professionals from Continental Automotive Romania Timisoara.

Mitch Altman Discusses Bringing Youth into the PCB industry

Publisher Barry Matties is joined by Mitch Altman, creator of TV-B-Gone, a device that can turn off TVs in public, and co-founder of Noisebridge, an educational hackerspace based in San Francisco. In this interview, they discuss the importance of bringing youth into the PCB industry and how Noisebridge has inspired people of all ages to get started creating their own electronics.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
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