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Reducing Flux Splatter in Sensors and Camera Modules

With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization

As Lawrence Romine said in his introduction, “There’s that moment when you sit in the crowd and hear Mr. Rick Hartley speak that you know you’ve arrived in PCB design.” With 50 years in the industry focused on circuit and PCB design—and as a specialist in EMI, noise, and signal integrity issues—Rick Hartley was invited to talk about PCB optimization. Pete Starkey provides an overview of the presentation.

Gardien on the Right Track With New ERP System

Andy Shaughnessy speaks with Roland Valentini, Gardien Group COO, about the company’s new OnTrack2 ERP and process management software. He explains how OnTrack2 is purpose-built for customers around the world and why it’s much more than a replacement for OnTrack1, which was being stretched beyond its original intent.

IPC Standards Development: Business Challenges and an Inside View

With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

How to Benefit From Robotic Soldering Processes

Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.

90% Solder Dross Recovery: Eliminate Waste, Save Money

The impact of 90% solder dross recovery can have a substantial impact on reducing waste and increasing cost savings. Nolan Johnson recently spoke with Jay Hardin, MS2® product manager at P. Kay Metal, about the process and benefits of efficient solder dross recovery, as well as product roadmaps, the soldering machine market, and raw materials supply chain for solder alloy manufacturing. As Jay says, “For many companies, the savings are in the thousands or millions” of dollars.

EIPC Technical Snapshot: Automotive Technology

Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

Just Ask Paul: Automotive and Lead-Free Solders

We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.

Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote

Nolan Johnson details TZero Co-founder Eli Hughes' keynote presentation titled “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” demonstrating how it takes cross-disciplinary thinking to truly innovate.

Real Time with… AltiumLive 2020: Würth Virtual Factory Tour

Since AltiumLive this year is a virtual event, coverage is limited to watching some of the presentations virtually. Dan Feinberg describes how he was pleasantly surprised with the quality and excellence of the Würth virtual factory tour.


Real Time with… SMTAI 2020: Reflections on the Technical Conference

This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.

Real Time with… SMTAI 2020: Technical Conference Review

SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

Just Ask John Mitchell: The Exclusive Compilation

We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”

Just Ask John Mitchell: Blurring the Lines of Technology

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”

Real Time with...SMTAI 2020: MacDermid Alpha’s Flash Etching Electroplating Paper

I-Connect007’s Nolan Johnson catches up with Sean Fleuriel, a chemist for MacDermid Alpha Electronics Solutions, and Richard Bellemare, director of electrolytic metalization, to discuss the SMTAI technical paper presented by Fleuriel, titled, “Pit Resistant Acid Copper Electroplating Process for Flash Etching.” Fleuriel and Bellemare highlight the challenges, processes, and conclusions from the paper, as well as which PCB fabricators are most likely to benefit from this new process.

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”

Catching up With Nate Doemling, New CEO of IMS

Dan Beaulieu recently interviewed Nate Doemling with Intelligent Manufacturing Solutions (IMS) in New England about his new role at the company. After serving on the IMS board of directors for several months, Doemling joined the company as CEO in January 2020.

New Solder Joint Technology From Schmartboard

Schmartboard has a surprisingly simple patented process to improve solder joint reliability; in this interview, they discuss the process in detail, along with their search for a go-to-market partner.

Aurora Circuits on Ultra-Heavy Copper PCBs

It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.


Nano Dimension Appoints LM Instruments to Market PCB/Hi-PEDs 3D-Printers

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, has signed an agreement with LM Instruments, which will represent Nano Dimension in the Mid-Atlantic States by marketing its 3D-Fabrication Machines for High-Performance Electronic Devices (Hi-PEDs).

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

Dana Korf: What Fabricators Expect From Designers

Andy Shaughnessy and Barry Matties spoke with Dana Korf, former chief PCB technologist for Huawei and currently principal consultant of Korf Consultancy, about the breakdown in communication between manufacturers and designers. Dana discusses exactly what a fabricator expects from a PCB designer, why these expectations are often not met, and the need for designers to make mistakes so that they can learn from them.

MTV Offers Solder Paste Testing Solution

The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

TQM: The Tyranny of the Urgent

The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.

Dan Beaulieu, Part 1: Lead Generation

Dan Beaulieu, president of D.B. Management and an I-Connect007 columnist, spoke with Nolan Johnson on the importance of continuing to generate leads and new customers. Beaulieu addressed concerns about market uncertainty, shared some real-world examples of mistakes, and made a strong case that sales and marketing is a process that must be constantly ongoing to keep a full funnel of customers and business.

Plasma Applications in the PCB Industry

Plasma, which consists of ionized gas atoms, is the fourth state of matter. On Earth, plasma does not occur naturally, but it is sometimes visible at high altitudes as auroras. But off-planet, elsewhere in the universe, almost all visible matter is plasma. Plasma is a mixture of positively charged atomic hulls, free electrons, free radicals, and neutral particles; the total electrical charge is neutral, conductive, and highly reactive. Due to permanent recombination, plasma lights can come in different colors.

Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions

On May 28, Joe O’Neil, CEO of Green Circuits, updated Nolan Johnson on how the company continues to operate during the COVID-19 restrictions. O’Neil reflects on the rapid chain of events this past March when lockdowns were instituted in the San Francisco Bay area. After a brief but rapid shutdown, Green Circuits was back up and in production.

The iNEMI 2019 Board Assembly Roadmap

iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

Autodesk’s Fusion 360 Merges ECAD, MCAD

Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.


Happy Holden Book Excerpt: CIM & Automation Strategy

The following is an excerpt from Chapter 1 of Happy Holden’s I-Connect007 eBook Automation and Advanced Procedures in PCB Fabrication. In this book, Happy explains fabrication automation with illustrative examples and anecdotes from his decades as a mechanization leader.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

iNEMI’s PCB Roadmap Explained

In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

IPC Europe Shares Technical Education and Standards Awareness

Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

Koh Young Update With Quintin Armstrong

In this video interview from the show, Quintin Armstrong, Americas service and applications senior manager for Koh Young, updates Guest Editor Dick Crowe on Koh Young America's Technical Services Team, where the focus is on AOI of components and materials on the stuffed board, as well as demonstrations and training at their new facility in Duluth, Georgia.

Via Reliability and Robustness in Today’s Environment

When Bob Neves dropped by the I-Connect007 booth at IPC APEX EXPO 2020 this year, Happy Holden took the opportunity to record the conversation. Bob had some startling and exciting updates on the testing of microvias and through-hole technology.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.

Stencil Cleaning Update With Tom Forsythe

In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.

PCB Surface Preparation Before Solder Mask on Non-copper Finishes

A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.

Arlon Takes on High-Power Failure

In this video interview from IPC APEX EXPO, Pete Starkey and Dave Nelson, director of business development at Arlon Electronic Materials, explore causes of failure in high-power PCBs and explain how resin cracking during drilling can be overcoming using thermally conductive filled resin.


Technica and Wise Partner For Atmospheric Plasma Cleaning

In this video interview from IPC APEX EXPO, Technical Editor Pete Starkey speaks with Frank Medina, president and CEO of Technica USA, who introduces Massimo Passerini, VP of Wise, and the revolutionary Wonderwise system for cleaning double-sided atmospheric plasma.

The Direction of MacDermid Alpha’s Automotive Initiative

Nolan Johnson speaks with Lenora Clark about MacDermid Alpha’s automotive initiative, where her role fits into the company’s focus on supporting carmakers in various business areas, and where the future of automotive is heading.

Todd Kolmodin: Gardien an Essential Business for U.S. DoD Work

Todd Kolmodin, VP of quality for Gardien Services USA, updates Nolan Johnson on Gardien’s operations. Specifics include Gardien’s certification as an essential business for U.S. Department of Defense work and an overview of the work and staffing policies in place at all of the company's facilities across the United States and the various work restrictions—all with the goal of “keeping the wheels turning” in the industry.

The Smart Factory: All the Bits and Bobs

“Smart factory” is another phrase that describes Industry 4.0 programs. These programs seem to have replaced CIM and CAM, but it did not make them obsolete. While these topics are getting a lot of press, there is nothing new about them. We have been on a journey to automate manufacturing since the mid-‘70s. What has evolved are faster and cheaper computers, and more complex and integrated networking.

InduBond Gets Hot With Induction Heating Lamination

In this video interview from the show, Editor Nolan Johnson sat down to speak with Víctor Lázaro, InduBond’s R&D director and technical manager, about InduBond's latest technology for panel lamination utilizing induction heating. InduBond demonstrates a lamination oven on the IPC APEX EXPO show floor, as well as the advantages of the technology.

IPC APEX EXPO 2020 Attendees Speak: Heston Singh

"We have been coming here for many years, and we had another good experience this year," said Unitron's Heston Singh. "If it wasn’t good, we wouldn’t be coming back. They have products that are needed for this market, so we’ll be back every year."

Book Review: The 10 Stories Great Leaders Tell

Everyone is talking about stories, and rightfully so. Anyone who knows anything about marketing in the 21st century knows that the way to get into peoples’ heads is to tell them a story. Dan Beaulieu reviews Paul Smith's 'The 10 Stories Great Leaders Tell.'

Trends From the Show: Solder and Software

In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Advantages of Using ZIF Connectors as a Termination Method

There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.

Are Trade Shows at a Crossroads?

With the cancellation of this year’s E3 show, the biggest gamer conference, the event’s format is shifting to a more fluid, online communication method. This may be the wave of the future. Can you imagine if the COVID-19 outbreak had occurred just three months earlier? Would there have been a Consumer Electronics Show, DesignCon, or IPC APEX EXPO? If the coronavirus is still in play in six months, will these shows take place in 2021?


Institute of Circuit Technology Spring Seminar 2020

Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.

I-Connect007 Researchers Survey Industry on COVID-19 Outbreak Effect

In the last 24 hours, we surveyed our readers regarding the coronavirus (COVID-19) outbreak and its effect on our industry. After reviewing the first 100 survey responses primarily from North America and Europe, one-third of the respondents reported that the outbreak was having at least a small effect on their orders. Two-thirds of our readers have yet to see any effect on their orders.

2020 EIPC Winter Conference, Day 2

Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

2020 EIPC Winter Conference, Day 1

Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

IPC APEX EXPO 2020 Attendees Speak: Tom Salmon

"I’m impressed by what I’ve seen and the variety of solutions. Industry 4.0 is still a big thing here," said Tom Salmon of SEMI. "I’m guessing just by the number of attendees that we took a little bit of a hit from the coronavirus. But most of the people I’ve talked to are happy with the meetings that they’re having with folks. Overall, it seems to be positive for everybody."

Joe Fjelstad Breaks Down His Occam Process

Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

XRF: An Essential Tool to Help PCB Manufacturers Meet IPC Specifications

One of the main challenges in PCB manufacturing is to create a stable, long-term coating of the copper surface to perform critical functions throughout the expected lifetime of the part. The surface coating is there to do two things: prevent the copper from oxidizing by coming in contact with the air and form a reliable contact for a soldered joint or wire-bonded connector.

Catching up With Midstate Electronics

Dan Beaulieu recently sat down with Susan Matteo, Joan Allen, and Gerri Wooten from Midstate Electronics’ sales team to discuss their company, how long they have been in business, the key ingredients to their longevity and success, and how they see the market today in general. Midstate offers everything from multilayer PCBs to flex and rigid-flex circuits and PCB assembly.

Stencils: Not As Simple As They Seem

Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

CB Tech and Technica Tout Titan’s Traits

During the show, Technical Editor Pete Starkey met with Frank Medina, president and CEO of Technica USA, and Harry Kok, international sales director at CB Tech. They discuss the features of the CB Tech Titan direct imaging system, which has very high throughput capability with best-in-class registration consistently maintained from the beginning to the end of the batch. Kok also explains how the Titan fits in with CB Tech’s ongoing plans for Industry 4.0.


IPC APEX EXPO 2020 Attendees Speak: Brian Wojtkiewicz

"It seems they are all pursuing digital imaging; whether it’s direct imaging exposure or inkjet solder mask, they’re all going that direction, and it’s not just the big customers; small customers are doing the same," said Taiyo's Brian Wojtkiewicz. "They’re investing money, which is good. New investment is what has been lacking for a couple of years."

Taiyo America Brings New Ideas to Solder Mask Development

During the show, Technical Editor Pete Starkey and Don Monn, Midwest regional sales director at Taiyo America, discuss the company’s progress with the establishment of inkjet solder mask as a production reality, now with OEM approvals. Monn also addresses the development of crack-resistant white solder mask and new screen-printable formulations with very high thermal conductivity.

Meet Sharon Cohen, I-Connect007 Columnist

Meet Sharon Cohen, one of our newest I-Connect007 columnists! Sharon’s columns will share Orbotech’s expert knowledge on how to maximize the value of manufacturing systems. Mr. Sharon Cohen is the president of Orbotech West, where he is responsible for the PCB division’s organization in North America and EMEA (Europe, Middle East, and Africa).

Burkle North America: New Equipment and ‘New Blood’ in the Industry

During the show, Guest Editor Dick Crowe and Kurt Palmer, president and CEO of Burkle North America, discuss Kurt's career history and responsibilities in his present role. Palmer also details the equipment that the company is exhibiting on the show floor, and the palpable excitement that veteran technologists feel this year seeing younger engineers and students attending IPC APEX EXPO 2020. There’s a lot of “new blood” in the industry, as Palmer explains.

Max Seeley: Some Designers Hesitant to Adopt New Tech

I spoke with Max Seeley of 3M about a design class he presented at AltiumLive in Frankfurt, Germany. We also discussed autorouting and the continuing advances in EDA tools, as well as the schism between users who embrace new technology and those who still prefer to layout their boards the old-fashioned way. Which camp do you belong to?

IPC APEX EXPO 2020 Attendees Speak: Katie Carl

"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."

Solder Paste Printing From the Stencil’s Perspective

Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Will Moisture Management Expand to the U.S. Market?

Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.

Solder in PCBA: Can’t Live Without It... or Can We?

For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

IPC: Automotive Electronics Segment Exploding

Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.


Advances in Substrates for Thermal Management

Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.

Gardien: Selling Test Equipment and Services

In this Real Time with... IPC interview, technology editor Pete Starkey speaks with Jason Posey, director of sales and service with Gardien. They discuss Gardien's range of flying probe testing and the introduction of AVI into the North American market.

Not All Plating Lines Are Created Equal

Barry Matties and Happy Holden met with CEO Michael Ludy and CMO Sarah Großmann from Ludy, a company specializing in galvanic plating equipment for PCBs. This interview gives an overview of Ludy and their latest advancements in PCB plating equipment.

RTW IPC APEX EXPO: John Mitchell Discusses the Show's Evolution

During IPC APEX EXPO, Technology Editor Dan Feinberg spoke with John Mitchell, CEO and president of IPC, about the event’s evolution from a strictly PCB show into a miniature Consumer Electronics Show, including new ideas and prototypes. They also discussed several new IPC initiatives, including IPC Design.

IPC APEX EXPO 2020 Show Week Time-lapse Video

It was a busy week at IPC APEX EXPO in San Diego, and I-Connect007 was there to cover it all. From set-up to tear down, I-Connect007 captured a four-day time-lapse video of the show floor. We’d like to thank our good friends at MacDermid Alpha for letting us set up our camera in their booth.
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