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The Sales Survival Handbook: Cold Calls, Commissions, and Caffeine Addiction—The Real Truth About Life in Sales
07/19/2017 | Dan Beaulieu
Review of the 2017 IPC Reliability Forum
07/18/2017 | Steve Williams
The Skills Gap – Meet People Where They Are!
07/14/2017 | Julie Desisto, IPC
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
07/11/2017 | Patty Goldman, I-Connect007
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
07/10/2017 | Doug Sober, Essex Technologies Group, with Stephen Tisdale, Tisdale Environmental Consulting LLC
PCB :: Materials
Review of the 2017 IPC Reliability Forum
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
A Deep Look Into Embedded Technology
In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.
Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.
Weiner’s World – June 2017
On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.
Embedding Components, Part 1
The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure.
The Significance of the PCB in the Value Chain of the European EMS Industry
At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.
A Brief Tutorial on Embedded Capacitors
Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable.
A Twist on Printed Electronics: Printing on 3D Shapes
Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
14th Electronic Circuits World Convention
The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Walt Custer’s Market Report
At the recent EIPC Conference, Walt Custer delivered his annual report detailing the trends he’s been seeing in the electronics industry for 2016 and into the first quarter of 2017. Barry Matties sat down with Walt to discuss his findings, including his forecast for the upcoming year. Also discussed are Walt’s prognosis for the market segments with the most promise and those that cause him concern.
PCB Design in the Age of IoT
From the early days of printed circuit boards, the electronics industry has made huge strides in board materials, copper printing methods, miniaturization, rigid-flex, ELIC, EDA, and much more. Many of the devices we use in our homes, our vehicles, and in our workplaces would not be possible without this continuous evolution of PCB design and technology. And yet in 2017, we are poised to shift from evolution to revolution, driven by the idea of the Internet of Things.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
Weiner’s World—May 2017
China’s central bank is effectively anchoring the yuan to the dollar, a policy twist that has helped stabilize the currency in a year of political transition and market jitters about China’s economic management. The yuan weakened more than 6% against the dollar in 2016; this year, it is up roughly 1%, and the expectation that the currency will fluctuate—a gauge known as implied volatility—is around its lowest in nearly two years.
Ladle on Manufacturing: Testing Times Ahead
Bare board electrical test: For the most part, it does what it says on the tin. Current CAM software and test hardware means that in theory, it is a pretty simple exercise to make sure that a printed circuit matches the intended design. But are you getting the test you think you are?
Growth Ahead for Flexible Hybrid Electronics Industry
According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future
The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.
Bruce Mahler Discusses Ohmega’s Resistive Material Technology
Bruce Mahler, vice president of Ohmega Technologies, sat down for an interview with me at DesignCon 2017. He discussed the company’s latest embedded resistive materials, as well as some of the drivers and challenges in that segment of the materials industry.
Innovating in the Technology of Stretchable PCBs
Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.
'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary
Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
MACFEST: Benchmarking a New Solderable PCB Finish
New, innovative manufacturing procedures have been developed by the recently completed project, Manufacturing Advanced Coating for Future Electronics SysTems (MACFEST), which has been funded by several partners and the government’s Innovate UK.
RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project
The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017
When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.
The Wide World of Flex
In one sense the flexible circuit industry has remained amazingly stable. Polyimide remains the workhorse dielectric film; imaging is done by exposing a pattern on a photosensitive film; copper is subtractively removed from a patterned substrate; and crylic adhesive is commonly used to laminate polyimide coverlay as an insulation. But there have also been some rather dramatic changes...
The Near and Far Future for Orbotech and Inspection
Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.
RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity
Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.
RTW IPC APEX EXPO: Ventec Talks Benefits of High-Level OEM Tech Team
Managing Director of Ventec Europe, Thomas Michels comments upon the complementary non-copper-clad-laminate, one-stop-shopping opportunities that have resulted from the merger of the TMT business with the Ventec operation, and discusses the benefits of a strong integrated supply chain and a high-level team of OEM applications specialists in building long-term partnerships between Ventec and its customers.
A New Power Design Methodology for PCB Designs
Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.
RTW IPC APEX EXPO: Ventec Discusses CCL Supply Chain Issue
Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.
Eagle Electronics: Success through 'Building Everything'
During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
Catching up with Polar Instruments' Geoffrey Hazelett
Product specialist Geoffrey Hazelett discusses some of the latest developments at Polar Instruments, including a new tool that will allow fabricators to determine how copper roughness will affect the end-product. He also talks about Polar's upcoming eBook on signal integrity, soon to be published by I-Connect007. Talented young technologists like Geoffrey are the future of our industry.
RTW IPC APEX EXPO: Changing Drilling With Perfect Point Drill and Jinzhou Precision Tech
Shane Stewart VP of sales for Perfect Point and Michael Kwok for Jinzhou spoke about their newest drills. A change in the stucture of the bit itself results in a cleaner hole and a better positional accuracy.
RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.
RTW IPC APEX EXPO: Arlon's Partnership With Doosan Brings Benefits All Around
The recent distribution agreement between Arlon EMD and Doosan Electro-Materials enables the supply and technical support of Doosan’s flexible laminates and high-Tg FR-4 and halogen-free materials into North America to complement Arlon’s established range of polyimide and specialty materials for the military, avionics and space market segments. Arlon vice president Brad Foster explains the opportunities and benefits.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Ladle on Manufacturing: Drilling Deep
Whether you stack high or drill thick panels, the dynamics of drilling are similar. When you overlay the outer-layer artworks you may notice that the holes on the exit side of the panel or stack have a much higher level of positional variation than the entry side holes.
Real Time with...IPC: Jim Fuller Offers HDPUG Update
Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
Weiner’s World—January 2017
This month’s column is a bit shorter than usual as we prepare for next month’s IPC APEX EXPO and its Executive Forum for PCB fabricators and their supply chain. This month also marks the 65th anniversary of Epec LLC in New Bedford, Massachusetts. The company, founded in 1952, is the oldest printed circuit fabricator in North America. Half of its $50 million in sales is reported to be with printed circuits.
Electroplated Copper Filling of Through-holes: Influence on Hole Geometry
The process consists of a two-step acid copper plating cycle. The first step utilizes periodic pulse reverse (PPR) electroplating to form a conductive copper bridge across the middle of a through-hole and is followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.
Trouble in Your Tank: Acid Copper Plating
Electroplating a printed circuit board is by no means a trivial task. Higher layer counts, smaller-diameter vias (through-hole and blind) as well as higher-performance material sets contribute to the greater degree of difficulty with today’s technology.
True DFM: Taking Control of Your EDA Tool
We PCB designers are doing some truly great things with our layout tools. But we must remember that these tools are so powerful that they will sometimes allow us to design things that can’t be manufactured! We must collaborate with our fabricator and assembly brethren and embrace the best DFM practices, or face the consequences downstream.
Study of Immersion Gold Processes Used for Both ENIG & ENEPIG
The use of electroless nickel/electroless palladium/immersion gold (ENEPIG) has been steadily increasing the past several years and benefits of the finish have now become well-known throughout the industry. The finish provides both reliable solder joints and wire bonds
Patty’s Perspective: Everything Old is New Again
This month’s issue is all about plating and surface finishes; long ago, that was pretty much my start in the world of printed circuits—wet processing. So this is kind of my home turf—and not, since I haven’t worked in wet processing for some…well, for many years. I’ve always expected that I could hop right back onto the plating room floor and pick right up where I left off all those years ago. Or could I? Have things changed much? Time to read on and see.
Ladle on Manufacturing: Material Matters
Have you considered whether or not you could improve your multilayer yields by better use of your base materials? Perhaps the following could give you a few ideas of how this could help you.
CES 2017: Disruptive Technologies
Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.
Catching up with...Coast to Coast Circuits CEO Walt Stender
Coast to Coast is an independent American circuit board manufacturing company. Yes, the key word here is “independent.” After many mergers and acquisitions that have diminished the mil/aero PCB vendor base, there are only a handful of independent companies for our country’s defense and aerospace contractors to choose from.
Emmy Ross Discusses the New I-Connect007 E-Book Series
One thing that is long overdue in our industry is a series of guidebooks focused on helping companies with all their needs, from qualifications like AS9100 and Mil-P-31032 to various technologies, heavy copper, rigid-flex and microvias. I-Connect007 is now providing our industry with an entire series of these guidebooks, starting with the first book, "The Printed Circuits Buyers Guide to… AS9100 Certification." Authored by Imagineering Inc., this book educates readers about the AS9100 quality standard, and explains how to earn this certification.
Catching up with…Dr. Anthony Caputo
I met Dr. Anthony Caputo last year while helping one of my clients secure some strong engineering talent. Anthony had been reading my columns and reached out to me since he was looking for a new opportunity in a high-tech printed circuit board facility. Once I read his CV and saw his credentials, I jumped at that chance to help this talented young man.
TTM President Thomas Edman on the Global PCB Market, Technology, and More
The TTM and Viasystems merger put the PCB industry on notice last year when it created one of the biggest powerhouses in the world. At this year’s HKPCA and IPC show, Barry Matties met with TTM Technologies President and Chief Executive Officer, Thomas Edman to get his views on the market, technology, the culture of TTM and even the Trump effect.
Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri of Rogers Corp. speaks with I-Connect007's Stephen Las Marias about the 5G trend and thermal management issues in power electronics and how they will impact PCB materials requirements.
Innovative Use of Vias for Density Improvements
In today’s fast-paced global, economic environment—which requires constant innovation, upskilling, and performance improvements— there is a need for increasing density. The classic way to increase density is to reduce the trace and spacing.
Patty’s Perspective: Everything You Want to Know about Vias but Were Afraid to Ask
Regarding our survey on vias, almost 85% of our respondents said they used blind/buried vias. And since 15% of those answering were either suppliers or consultants, it seems that approximately 100% use the B/Bs. OK then, on to a tougher question. We then asked how often, and it turns out that “use” covers everything from rarely to pretty much all the time, with a definite undercurrent of “because we have to.”
Advanced UV Lasers for Fast, High-Precision PCB Manufacturing
For more than 30 years, lasers have played a significant role in the manufacturing of PCBs. It is not a coincidence that electronic devices have, at the same time, become increasingly miniaturized. The ability to tightly focus a laser beam much smaller than a mechanical tool has been an enabler of such dense, compact circuitry; and the elimination of consumables such as drilling and routing bits has reduced manufacturing costs.
Aismalibar on Markets, Materials, and the Increase in Copper Prices
As a European laminate provider specializing in insulated metal substrates and thermal management, Aismalibar is often put in the demanding position of catering to some of Europe’s toughest customers, including the automotive industry. Pete Starkey and Barry Matties caught up with Director General Eduardo Benmayor at the most recent Electronica trade show to learn more about the company and get his take on the current state of the IMS marketplace.
Here we go again! The winter holiday (and trade show) season is upon us! Electronica's mood was upbeat. Next, the Asia and San Diego shows. We just received word as we were preparing for our trip to next month's HKPCA/IPC event in Shenzhen China that the CPCA (China Printed Circuit Association) show suddenly changed its March 2017 date and venue. Meanwhile, the HKPCA show, now billed as our industry's largest event, will have nearly 550 exhibitors—of which 20% are new.
KCE Group: A Thailand-Based PCB Manufacturer with a Growing Global Footprint
Recently, while at electronica in Munich, Germany I-Connect007's Judy Warner met KCE America President Rick Rhodes, and Joe Yeo of KCE Group. They discuss the unique challenges and opportunities that come with the rigorous automotive market, and explain why they continue to enjoy explosive growth.
A Scientific Response to Mr. Laminate Tells All
We read with interest Doug Sober’s recent Mr. Laminate Tells All column, "The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware." The article raises interesting questions about the IPC 4101 classification system, primarily, how is a pure resin defined?
Walt Custer’s Global Market Outlook
With 2016 winding down, Walt Custer shared his end-of-the-year market research data with me at the recent electronica trade show in Munich, Germany. In our interview, Walt breaks down his findings and offers insight into the changing trends as we head into 2017.
Mr. Laminate Tells All: The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware
At the most recent IPC meeting held in Rosemont, Illinois, one of the hot topics of discussion at the Laminate and Prepreg Subcommittee was the three polyimide specification sheets. The header portion for the three polyimide-based copper-clad laminates and prepregs are shown in Figure 1, for easy comparison of polyimide grades.
Rogers Highlights Thermally Enhanced 92ML Materials at electronica
I met with Rogers Corporation Business Development Manager John Ranieri at Electronica recently. Ranieri’s professional focus is on the 92ML series of laminate, prepregs, and IMS, which was highlighted at the Munich show. The 92ML products are geared for the power electronics marketplace where thermal management is a major concern.
electronica 2016 Impressions
Germany’s third-largest city, and capital of the southeastern state of Bavaria, Munich was once more host to electronica, which can justifiably claim to be the world’s leading trade fair for electronic components, systems and applications.
Streamline Circuits: The Importance of Being a Sales-Driven Organization
I recently had the pleasure of catching up with Tom Doslak, senior VP of sales and marketing for Streamline Circuits. We discussed how the company got started, technologies that seem to be driving the marketplace, critical equipment for today’s PCB fabricator, and how being a customer-centered, sales-driven organization serves as the key to their success.
To Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly
Moisture plays a critical role in lead-free PCB assembly—and one process that aims to drive moisture out of the PCB is baking. In this article, Yash Sutariya explains the results of his study on the impact of waiving PCB pre-baking prior to assembly. His study includes via integrity, via life impact, via failure, and overall reliability failures.
What’s New with IPC’s Validation Services
During this year’s IPC Fall Committee Meetings, held in conjunction with SMTAI in Chicago, I met with my friend Randy Cherry, director of IPC Validation Services. Since the inception of Validation Services three years ago, I’ve conducted video interviews with Randy at IPC APEX EXPO, and I've been tracking the growth and progress of this program. I decided that this would be a great opportunity to do a mid-year check-up on IPC’s Validation Service programs.
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