Happy Holden Previews His AltiumLive Frankfurt Keynote
I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.
Additive Electronics Conference Set for October 2019 Debut
Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.
Communication, Part 2: Design Data Packages
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.
Communication, Part 1: How to Qualify a Board Shop
In Part 1 of this six-part series for "Fab Fridays," Mark Thompson, CID+, engineering support at Prototron, and CA Design CTO Bob Chandler discuss ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop.
The Institute of Circuit Technology Autumn Seminar
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.
Insulectro and DuPont Experts Talk Flex Design
I recently spoke with Insulectro’s Chris Hunrath and DuPont’s Steven Bowles at the DuPont Technology and Innovation Center in Sunnyvale, California. We discussed a variety of topics related to flex design, including the support structure that’s needed in flex design, the everchanging world of flex materials, and the need for working with a flex fabricator as early as possible in the flex design cycle.
EIPC Summer Conference 2019, Day 2
In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
The Advantages of Non-sludge Acid Copper Products
Mike Wood, technical director with Cerambus Asia Pacific, discusses the acid copper product from Cerambus Technology Inc. that doesn't generate sludge during the plating process and operates at higher production output by using higher current density. He talks about why this is important for the state of the vertical continuous plating (VCP) market in Asia, and the trends he’s seeing in that space.
Vertical Conductive Structures, Part 3: Design Tool Techniques
New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.
Focusing on Surface Sensitivity for Reliability
At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.
Altium Designer 19.0 Features Printed Electronics Design Functions
The newest version of Altium Designer—revision 19.0—includes functionality for designing printed electronic circuits. We wanted to get the scoop on Altium’s PEC tools, so we asked Nikolay Ponomarenko, Altium’s director of product management, to give us a tour of the new functions.
Mentor Tools: Optimized for Flex and Rigid-flex Design
With the launch of the new Flex007 section in Design007 Magazine, we asked David Wiens, product marketing manager with Mentor, a Siemens Business, to tell us about their tools’ flex and rigid-flex design capabilities. As David explains, today’s higher-end design software tools are optimized for flex design, making workarounds a thing of the past.
IPC High-reliability Forum and Microvia Summit Review, Part I
The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.
Crowded Congressional Calendar Affects Industry Priorities
More than five months remain in 2019, but U.S. congressional leaders are already running out of time as they face a long list of must-pass bills before year’s end. Although some of these bills do not affect the electronics industry, some of them do, and the overall agenda does affect the opportunities and risks we face.
Microvias: Links of Faith are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.
Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
Design Is a Pivotal Piece of the Puzzle
As a field applications engineer at TTM Technologies, which has fabrication and manufacturing locations around the world, Julie Ellis sees a wide variety of customer design requirements. In this interview with the I-Connect007 Editorial Team, Julie explains how PCB designers can influence the development of the PCB. She shares a variety of tips and tricks that designers can implement early in the design process to help optimize fabrication and assembly later on and keep small issues from becoming big problems downstream.
Pulsonix 10.5 Development Driven by Customer Demand
I recently spoke with Bob Williams, the managing director of Pulsonix, about the release of the EDA tool’s version 10.5. Bob explained how the company had made the tool more intuitive based on user input, and he discussed some of the more cutting-edge functionality not normally found in competitively priced tools.
Emma Hudson: From Tomboy to Tech Lead
In this interview, Emma Hudson, CTO of Gen3, and Gayle Paterson, founder of Female Leaders in Tech, Everywhere (FLITE), discuss careers and the electronics industry.
Stitching Capacitor: Crosstalk Mitigation for Return Path Discontinuity
When the return path is broken due to the switching of reference planes with different potential, e.g., from ground to power or vice versa after layer transition on PCB, the return current might detour and propagate on a longer path, which causes a rise in loop inductance. This might lead to the sharing of a common return path by different signals that pose a high risk of interference among the signals due to higher mutual inductance. This interference results in signal crosstalk. To mitigate the crosstalk due to return path discontinuity (RPD), stitching capacitors are mounted on the PCB to serve as a bridge between the two reference planes of interest on different PCB layers.
IPC’s PCB Tech Trends Study Highlights Issues Impacting Fabricators
The 2018 survey results indicated the need for speed and low loss as critical functions of the materials chosen. This is the digital age, and with the Internet of Things, virtual and augmented reality, vehicle-to-vehicle communication, etc., the need for low-loss and ultra-low-loss materials continues to grow as a percentage of circuit boards fabricated.
DuPont on Materials Challenges and New Opportunities
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.
Creating Stability in Materials Chaos
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.
DuPont on New Beginnings and Empowering the Industry
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.
Making Materials Succeed: Past, Present, and Future Trends
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.
Technically Appropriate Material Choices are Key to Design Success
Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.
Words of Advice: Long Component and Laminate Lead Times
In a recent survey, we asked the following question: What advice do you have regarding the current supply chain issues? Here are just a few of the answers, edited slightly for clarity. One reply really sticks out: "If the end customer is large, use their power."
Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas
In an interview with I-Connect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessica Zhang provides an overview of the company and shares new business trends they're seeing, including LEDs, wearable devices, and more.
Alun Morgan on Thermal Management and LEDs in Automotive
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.
Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.
Ventec Focuses on High-mix Manufacturing
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.
Bert Simonovich on Modeling Copper Roughness
I met with one of our contributors, Bert Simonovich of Lamsim Enterprises, at DesignCon 2019. Bert’s paper on interconnect modeling was nominated as a Best Paper finalist, so I asked him to discuss his paper and some of the challenges that engineers and their customers are facing right now.
3DEM Modeling: Influence of Metal Plating on PCB Channel Loss and Impedance
This article briefly introduces different types of metal plating commonly used in PCB fabrication. Subsequently, the influence of metal plating on PCB channel loss (i.e., insertion loss or S21) and impedance (i.e., time domain reflectometry or TDR) is studied with 3DEM modeling,
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
Flex/MSTC Joint Conference: A Collaborative Week in Monterey
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.
Institute of Circuit Technology Evening Seminar
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.