Growth Ahead for Flexible Hybrid Electronics Industry
According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.
Help Wanted With IMI’s Peter Bigelow
In preparation for this month’s topic, especially what companies in our industry are currently experiencing when it comes to finding and hiring the right people, I sought out Peter Bigelow, president and CEO of circuit board fabricator IMI Inc. We spoke in February at IPC APEX EXPO.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and Their Road Show
I was happy to see Rockwell Collins’ Doug Pauls receive IPC’s Raymond E. Pritchard Hall of Fame award at IPC APEX EXPO, well-deserved for him, and I wanted to chat with him about it. As with so many conversations at the conference this year, the talk quickly turned to inspiring interested young people in our “graying” industry. We also discussed the nature of volunteering and what we get out of it.
Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future
The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.
Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation
The DoD mandate for trust in the PrCB supply chain is mirrored in DoDI 5200.44, which states: “Employ protections that manage risk in the supply chain for components or subcomponent products and services (e.g., integrated circuits, FPGAs, PrCBs) when they are identifiable (to the supplier) as having a DoD end-use.” In response to congressional and DoD directives, the PrCB EA proposed pursuing a trust accreditation program for PrCB suppliers.
Weiner’s World—April 2017
China’s economy accelerated for a second straight quarter as investment picked up, retail sales rebounded, and factory output accelerated in March. Gross domestic product increased 6.9% in the first quarter from a year earlier, compared with a 6.8% median estimate in a Bloomberg survey.
Innovating in the Technology of Stretchable PCBs
Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.
Material Choices for High-Speed Flexible Circuits
Materials to make high-speed flexible circuits are now available from many material suppliers. In deciding which materials to test or use, remember the tradeoffs the suppliers made in categories we discussed: electrical properties, mechanical/flex properties, and ease of processing. A choice should only be made after considering these options. Remember with any new materials it is very important to find fabricators that are knowledgeable about processing these new materials.
Patty’s Perspective: Faster, Faster, Faster…or the Need for Speed, More Speed!
I wonder: Do we really need more speed in our connections? When will we hit that proverbial wall everyone worries about? Of course, if we want things like autonomous cars, intelligent robotics, and extended IoT, then we will continue to press forward—or rather you, the PCB manufacturer, designer, and supplier of high-speed materials will keep at it.
Fabricators Speak Out on High-Speed Materials
Recently, I-Connect007 Publisher Barry Matties and his editorial team joined with two PCB fabricators to discuss the state of advanced materials. The meeting included Gerry Partida, director of engineering at Summit Interconnect and Joe Menning, program manager at All Flex Flexible Circuits. The discussion centered on the processes, challenges, and procurement of high-speed materials, as well as need to work with customers during the design stage.
Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017
Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
Coast to Coast Circuits Talks Print-and-Etch Technology
I recently learned that a high-tech PCB supplier, Coast to Coast Circuits, had decided to provide their customers with quick-turn, high-value print-and-etch printed circuit boards. I talked with CEO Walt Stender and Marketing and Key Account Manager Michael Cisco, and I asked them to provide more details about this interesting decision.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
RTW IPC APEX EXPO: Updates on Formulations for Direct Imaging and Inkjet Technologies
Chris Wall, technical director and Shaun Tibbals, sales and marketing director at Electra Polymers, review latest developments in digital imaging technologies for solder resist. Multi-wave direct imaging systems give more scope to the ink supplier to optimize formulation and offer improved flexibility of operation to the user.
Capitol Connection: Drumroll, Please…Announcing the IPC Government IMPACT Awardees
Government relations are essential to our industry as many of the policy debates taking place will have long-lasting impact on our industry. Tax and regulations reform, immigration, and environmental regulations are up for debate and it is time for our industry to take a seat at the table.
Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started
I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.
RTW IPC APEX EXPO: ELCINA Inducted as a Member of WECC
WECC, the World Electronics Circuits Council, brings together industry trade associations worldwide to address issues of global importance. Secretary General Rex Rozario introduces Paresh Vasani, Honorary Secretary of ELCINA, the electronics industry association representing 300 companies in India, newly inducted as a member of WECC, and they discuss the significance of the relationship in the light of rapidly accelerating growth of electronics manufacturing in India.
RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.
RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity
Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.
Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017
This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.
RTW IPC APEX EXPO: Ventec Talks Benefits of High-Level OEM Tech Team
Managing Director of Ventec Europe, Thomas Michels comments upon the complementary non-copper-clad-laminate, one-stop-shopping opportunities that have resulted from the merger of the TMT business with the Ventec operation, and discusses the benefits of a strong integrated supply chain and a high-level team of OEM applications specialists in building long-term partnerships between Ventec and its customers.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider.
He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: Taiyo Discusses Option for PCB Heat Dissipation—Thermally Conductive Solder Resist
Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.
RTW IPC APEX EXPO: Ventec Discusses CCL Supply Chain Issue
Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.
Eagle Electronics: Success through 'Building Everything'
During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.
Imagineering CEO Khurrum Dhanji Discusses New AS9100 Guidebook
I have had many conversations with Imagineering President and CFO Parvin Dhanji, and CEO Khurrum Dhanji, and I always come away very impressed with their dedication to their community, associates and their customers. That’s why it was no surprise to me that they teamed with I-Connect007 to publish this long overdue guide to AS9100.
Vertical Conductive Structures–a New Dimension in High-Density Printed Circuit Interconnect
From our previous conversations, I knew that Joan Tourné was working on a novel high-density interconnection concept. Having eagerly awaited the chance to discuss the technology in detail, I was delighted when he contacted me to confirm that his IP had been secured and that he could now talk openly about VeCS, the Vertical Conductive Structure designed to provide a cost-effective alternative for complex fan-out from fine-pitch grid array components.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.
Real Time with...IPC: IPC Market Research Update
Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".