Article Highlights
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/24/2023 | Nolan Johnson, I-Connect007
John W. Mitchell: Fire Your Hiring Habits
03/23/2023 | Pete Starkey, I-Connect007
Advancing in a New Era
03/22/2023 | John W. Mitchell, IPC
A Promising Future for Automation
03/21/2023 | Christopher Bonsell, Chemcut
The Summit View of the Marketplace
03/21/2023 | Nolan Johnson, I-Connect007
PCB :: Business

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s almost as if upheaval is the new normal. We often describe slow-moving but unstoppable change as moving in “geologic time.” But occasionally–like an earthquake–geology shifts suddenly. Here in my office, tracking the news of the industry, things are moving faster than geologic time, but more slowly than the jolt of an earthquake. The wave seems almost surfable, where before it seemed overwhelming. In this week’s list, we bring news from five different, high-vibration areas in our industry. If you read nothing else this week, these five items will keep you informed.

John W. Mitchell: Fire Your Hiring Habits

On the Wednesday of IPC APEX EXPO week, IPC President and CEO Dr. John W. Mitchell stylishly delivered his keynote address, “Fire Your Hiring Habits!” to a packed ballroom full of round tables all immaculately laid for a sit-down lunch. Announced by IPC Hall-of-Famer Joe O’Neil with a Rolling Stones track in the background, Mitchell’s presentation, subtitled “Finding and keeping the best talent is fundamental to building electronics better,” offered relevant and valuable guidance on understanding human nature and how this knowledge can help you find and keep the right individuals for your organisation.

Advancing in a New Era

What goes down must also come up. This is not the idiom we’re used to hearing, but I’d like to apply it to IPC APEX EXPO 2023. After a few years of lower attendance numbers due to the COVID pandemic, 2023 ushered in a re-invigorated group of attendees, exhibitors, speakers, event contractors, and staff to the show floor and meeting rooms. IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.

A Promising Future for Automation

This year, I had the great opportunity to come to IPC APEX EXPO in San Diego as a contributing member in Chemcut’s booth. Being an exhibitor is always interesting because you never know what you will learn or who you will meet. Truly, it seems that every IPC APEX EXPO is an eye-opening experience. This was the second show I attended, and last year I was amazed to see how in-depth and interconnected the electronics industry is. Seeing how many different companies contribute to manufacturing today’s core technology never fails to impress me.

Optimizing Communication Between Fabricators and Designers

During DesignCon, I spoke with James Hofer from Accurate Circuit Engineering about some of his customers' biggest challenges. We discussed various ways to increase the level—and quality—of communication between designers and fabricators. James also offered some interesting observations about bridging the gap between designer and fabricator. How often do you communicate with your fabricator?

The Summit View of the Marketplace

Investments, staffing, cybersecurity, and a peek into his crystal ball—John Vaughan, vice president of strategic markets at Summit Interconnect, sits down with Nolan Johnson to talk about it all. Business is good, by the way, thanks to Summit’s portfolio of military contracts, and he has sound advice to offer for smaller shops in the United States, and their real ability to make a difference in PCB fabrication.

The Automated Future of PCB Fabrication

I have always felt that automation has the potential to make a big difference in our PCB industry, especially domestically, where labor is at premium. For the past year, I have been looking for the story of how automation can and will make a significant difference in established PCB shops. I was fortunate enough to find that story in Multicircuits, located in Oshkosh, Wisconsin. Only a few short years ago, this company was considered a “plain vanilla” PCB fabricator holding its own in our industry; now it has suddenly assumed a true leadership position in the industry in terms of capability, technology, operations, and profitability.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I try to not talk about the weather in this space, but this week I feel compelled. I’m based in the Pacific Northwest, and we’re relatively used to it being wet and rainy. But just south of us in California, the state has gone from what I read has been called the driest period in the West in the past 1,200 years to a right proper drenching. This week’s news cycle felt like one of those California-style “atmospheric rivers.” There was so much worthy reporting worthy that I was a bit overwhelmed in making my final selections. Suffice it to say that, this week, there is quite a bit of news that’s worth your time to read.

Schweitzer: The Captive Partnership

In this conversation with Schweitzer Engineering Laboratories, we spoke with John Hendrickson, engineering director; Frank Harrill, vice president of security; and Jessi Hall, senior director of vertical engineering. We wanted to learn more about the best practices they developed while specifying, selecting, and preparing to install an entire facility’s worth of equipment all at the same time.

Curtis Grosskopf: Lasting Connections Fuel Progress

Dieter Bergman IPC Fellowship Award winner Curtis Grosskopf, a senior engineer at IBM, reflects on the evolution of IPC committees and the vital importance of their work, especially in collaboratively creating industry-wide standards to guide the work of professionals in every sector. This commitment to multidisciplinary cooperation is a mindset that should be fostered at the start of every career.


Time to ‘Finish the Job’ on PCB Funding

In his State of the Union address in early February, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infrastructure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA).

EIPC Winter Conference 2023: Day 1 Review

The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.

Real Time with... IPC APEX EXPO 2023: PCBAA Legislative Update

PCBAA Chairman Travis Kelly and Editor Nolan Johnson discuss the association’s activities, including legislation in the range of $3 to $5 billion that follows the CHIPS Act, and why Congress needs to support the PCB industry as they did the semiconductor segment.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We have new projects in the U.S. Army space programs, research on gold thickness and solderability, a call for papers throughout 2023 from SMTA, an investment in Korean facilities by ASM, and an adjustment in TTM’s assignation with the U.S. DoD. All together, these five must-reads represent the hurtling trajectory that R&D seems to be following in 2023.

TTM Technologies Reports Fiscal Q4, 2022 Results

TTM Technologies, Inc., a leading global manufacturer of technology solutions including engineered systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), reported results for the fourth quarter and fiscal 2022, which ended on January 2, 2023.

Real Time with... IPC APEX EXPO 2023: Front-end Automation Solutions

Guest editor Chris Bonsell interviews Anthony Faraci from DIS Inc. about the optical lay-up of multilayers and optical alignment of rigid-flex boards. Over the last few years, DIS has redesigned their product line and introduced a robotic serialized pinless solution. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

Real Time with... IPC APEX EXPO 2023: Next-Generation Personnel

Pete Starkey talks with Chris Hrusovsky of International Electronic Components (IEC) about the work they have done with their business partners, Sigma Mecer & ASS-Luippold, and the next generation of personnel within IEC. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

The Impact of Chip Packaging

When talking about chip packaging impacts on substrates and electronic manufacturing services (EMS) providers, the focus mostly lies on large packages and very high I/O, fine pitch components; rightly so in most cases. However, several current packaging trends offer a new path forward to simplification and, thereby, cost reduction in both the printed wiring board (PWB) and EMS supply chains.

DFM 101: Final Finishes—Electrolytic Nickel/Gold

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Turn E-textiles Concepts Into Real-World Products

IPC E-Textiles 2023 is an international forum for materials suppliers, product designers, manufacturers, technical experts, and company executives from around the world to collaborate on all areas of the supply chain for e-textiles technologies in the fashion design, health and medical, sports and athletics, automotive, and military and aerospace sectors. It takes place Monday, Jan. 23, in conjunction with IPC APEX EXPO. This year’s event will feature informative and engaging presentations encompassing all areas of e-textiles, Q&A discussions with presenters, and a panel discussion on the economic and business aspects of e-textiles.


ICAPE: Solutions With No Limits

Over the past five years, ICAPE Group has strongly focused on analyzing the complex needs of the market to provide worldwide solutions for customers whose needs range from simple to very complex technologies. The services provider has done this by putting offices in key strategic locations—particularly China—with staff that understand the nuances of language and culture. These types of decisions make an important difference when it comes to getting customers exactly what, and when, they need it. Yann Duigou, CMO, and Bingling Li Sellam, VP of Northern Europe, share their secrets for success.

Ventec: Contextualizing the CHIPS Act

Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.

Workflow Challenges in Fabrication

Paul Cooke, the senior director of business development for Ventec International Group, is presenting a class at IPC APEX EXPO 2023 that looks at workflow challenges in fabrication, and the myriad drivers that can affect yield, reliability, and cost. Here he discusses the details of this Professional Development course, what he hopes attendees will take away, and why designers and design engineers would benefit from this class.

EIPC Technical Snapshot: ‘There Is No Green Without Digital’

Introduced and moderated by EIPC’s Emma Hudson, the 20th EIPC Technical Snapshot focused on sustainability, specifically on environmental issues impacting the electronics industry. The first speaker was Pia Tanskanen, head of environment at Nokia in Finland. A pioneer in mobile telecom, Nokia is primarily a network hardware and software provider, committed to reducing the environmental impact of its products, operations, manufacturing, and supply chains, with sustainability a key component of the company’s strategy.

Candor: UHDI Under Development

Candor Industries is a PCB fabricator investing in UHDI fabrication capabilities in Canada. To support advanced packaging, as well as the current pace of IC process shrinks, PCB fabrication capabilities must shrink to keep up. Sunny Patel, Candor’s technical sales manager, brings us up to speed on what Candor has learned in their journey to add UHDI. What we gain from this interview is that, while certainly not insignificant, the stretch to add UHDI may be not as far as one might think.

MKS Discusses the Cutting Edge of Technology

During a recent tour of the MKS facility in Beaverton, Oregon, I met with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick. As a reminder, MKS acquired ESI in 2019 and has retained the ESI brand. In this interview, they explain their approach to HDI and ultra HDI, the current state of base materials, and what the future looks like on the cutting edge of technology.

ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event

Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.

R&D Takes Back Seat Amidst Chip Shortage—But It Shouldn’t

As the global chip shortage continues, companies may be tempted to put research and development on the backburner to conserve capital and prioritize production. A primary area of focus has been on increasing production capabilities to meet demand. In this drive to increase capacity, R&D has fallen to the wayside as some companies consider scaling back to refocus on the expansion of manufacturing capacity at current technology nodes. This is a hard choice to make for any company, and even R&D giants like Apple, known for its dedicated investments in innovation, have had to cut R&D budgets below original projections.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

Excerpt: The Evolving PCB NPI Process, Chapter 2

Managing the supply chain for electronics manufacturing has always been challenging. About 70-80% of the cost of building an electronic product is for the parts, while the remaining cost is in the process to assemble and test the product. However, during the worldwide pandemic, the strain on the overall supply chain for any product has been stretched to the breaking point. When supply of toilet paper, hand towels, and sanitizer is disrupted and cannot be found on the grocery store shelves, one could imagine the challenges in a similarly disrupted supply chain of efficiently acquiring complex electronic components.


3D Electronic Devices With Additive Manufacturing

Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.

An Opportunity to Give Thanks

I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.

Web vs. Direct Imaging

As flexible printed circuits (FPC) continue making waves in PCB manufacturing, the Altix team of Alexis Guilbert, Damien Boureau, and Alexandre Camus look at today’s use cases for FPCs, and detail the finer points of roll-to-roll technology vs. direct imaging. For example, how long can a flexible circuit be? Which technology works best with extremely long circuits, and how does a customer know which one to use? The I-Connect007 Editorial Team explores these trending topics and what it means for PCB manufacturers.

Electronica 2022: Happy to Be Back in Munich

As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.

Electronica: Picking Up Where We Left Off

The productronica/electronica pairing of trade shows is an experience unlike any other; anyone who has ever attended is likely to back me up on that claim. This year’s iteration of electronica, taking place in Messe Munich, Nov. 15-18, is no exception. I-Connect007 was onsite to gather the news and share our impressions of the show. First, the show’s attendance was rumored to be in the 60,000+ range. This number sure seemed to be reasonable given the crowd sizes we witnessed.

Catching up with ASC’s Bob Duke

Bob Duke has been involved in global sourcing for over 20 years, and by global sourcing, it’s far beyond basic PCBs and PCBAs. Bob was doing this sort of thing before it was cool. He has been involved in everything from metal and plastic fabrication to cables and wire harnesses— just about anything an electronics customer might need. So, when American Standard Circuits started a new division to expand its global sourcing solutions, it was no surprise that CEO Anaya Vardya tapped his long-time friend Bob Duke to lead the way. I sat down to have a talk with Bob about this new division and his plans for the future.

Custom Made: The Digital Factory Suite

Stefan Stefanescu is head of business development for Atotech’s industrial digital transformation solutions. Here, he discusses how the Digital Factory Suite (DFS) fits into a PCB fabricator’s workflow. The new software connects to the onsite production equipment and continuously collects process and equipment data. But it’s more than that, Stefan says. It’s a way to help customers increase productivity and take steps toward developing a smart factory.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.

PCB Technologies Sees Substrates as a Foundation

In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.

EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace

For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?

PCB Legislative Update: HR 7677

Electronic industry association leaders like IPC, PCBAA, and USPAE have been trekking to Capitol Hill almost weekly this year to reinforce the dire state of the industry and seek additional co-sponsors for HR 7677, a bill supporting the American printed circuit board industry. However, with only 78 days until the end of the 117th Congress, it is not likely that anything will move by the end of this session.

Microvias Can Be Stacked in Certain Package Densities

Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.

IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts

After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe. The symposium, Oct. 11-12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.

Catching Up With Author Michael Kurland

"Broken to Better: 13 Ways Not to fail at Life and Leadership" is simply one of the best books I’ve read this year. In fact, I was so impressed that I decided to reach out to the author, Michael Kurland, to talk about his book, what led him to write it, and what we should all learn from it. Michael was gracious enough to take time out of his busy schedule to share his thoughts on building his business and why he wrote a book about it. I think you will find it provocative and thought provoking.

Michael Carano: A Focus on Process Control, Part 2

In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.

The New World Order of JIC

The great business thought leader Margaret Heffernan commented that we are changing from just-in-time (JIT) to just-in-case (JIC). As we’ve worked our way through the issues of the past two years, the world is changing from a complicated to a complex system, and we must be prepared to face the challenges it brings. To survive today, we need the JIC mentality. We must be prepared for the unexpected. No longer can we rely on cycles and patterns to predict the future, or what we might be able to handle based on what that future brings. Now we must prepare for the unexpected. We must be flexible and able to adapt to whatever comes our way.

A Focus on Process Control, Part 1

Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.

The Brave New World of the CTO

In this conversation with the I-Connect007 Editorial Team, Alex Stepinski shares his insight on how to automate the PCB fab. Spoiler alert: It doesn’t start with new equipment and panel handlers; it’s much more strategic than that. Alex details the new role of a chief technology officer in the 21st century and cautions that we don’t have nearly enough of them in the industry. The focus, he says, should be on statements of work rather than so much on skilled labor. He also hopes this is just the beginning of more important conversations like these.


Board Pricing Challenges and Opportunities

The cost of everything is on the way up, and fabricators are feeling the squeeze. They may hesitate to raise their prices because they don’t want to scare off business, but what options do they have? We asked James Hofer, general manager of Accurate Circuit Engineering, to weigh in with his thoughts on this conundrum.

Unimicron July Sales Up 29% YoY

Taiwan-based printed circuit board (PCB) manufacturer Unimicron Technology Corp. has posted July sales of NT$11.78 billion ($390.77 million at $1:NT$30.14), down by 4.4% from the previous month but up by 29% year-on-year.

Time for a Price Hike?

If you manage a fabrication facility, we don’t envy you. You’re being hit on all sides with price increases, you’re traditionally leery of raising your own prices, but you must do something. Do you raise prices, trying to squeeze out more efficiency, or is it some combination of both? We asked Prototron President Dave Ryder and I-Connect007 columnist Dan Beaulieu to share their thoughts on the current fab pricing environment, the need for greater cooperation, and some pricing strategies for fabricators who are nervously eyeing their bottom line.

Catching Up With NEXTGEN’S Ravi Kumar

Companies from India are becoming more sophisticated by providing complete engineering services as well as design, production, and assembly of printed circuits. In this conversation with Ravi Kumar, director of operations at NEXTGEN PCB, I learned that even though the company is only a few years old, it’s already making its mark in the industry. Ravi has a plan to not only expand in India, but to enter the U.S. and UK markets with his company’s services.

Today’s M&A: Right on Target

In this enlightening conversation with M&A specialist Tom Kastner, Nolan Johnson learns that it’s a buyer’s market—and a seller’s market too. This sets up an interesting dynamic no matter which side you might be on. What trends are in play that have led to this situation and how can you make the most of it? Tom shares valuable insights that will get you thinking and planning your own strategies.

Challenges of the 2022 PCB Market: The Party’s Over

With his knowledgeable insight into the business and technology of the printed circuit industry, Dr. Shiuh-Kao Chiang, managing partner at Prismark Partners, has put a global perspective on the challenges of the 2022 PCB market. His presentation at the EIPC Summer Conference in Orebro, Sweden, on June 14 was eagerly awaited by an attentive audience, keen to share his vision. From his comments, it was clear that 2022 will be an interesting year and does not appear particularly friendly for the PCB business.

PCB Finance Class With Jeff De Serrano

Class is in session! PCB Technologies President Jeff De Serrano takes us through some of the struggles of the PCB industry over the past 30 years, how U.S. legislation seeks to level the playing field, and whether a “monopoly” of fabricators is healthy for our industry. In his chat with Nolan Johnson, Jeff gets out his investment playbook and talks strategy. Don’t miss this one.

A Primer on M&A With Tom Kastner

Tom Kastner of GP Ventures is a busy man these days. He’s been involved in several M&A deals, including a recent acquisition by Summit Interconnect. Tom spent some time with Dan Beaulieu, who often consults with PCB and PCBA companies, about what it looks like when a company is thinking of buying or selling—and how a consultant like Tom helps negotiate the best deal.

IPC Mexico Continues to Grow

IPC Mexico has been growing for the past few years, and it’s no wonder: Mexico has become a major hub in the world of PCB manufacturing, spurred in part by reshoring as companies pulled work back from China during the pandemic. As the country’s maquiladoras thrived, IPC began expanding the Mexican educational and training operations, and the group recently named Lorena Villanueva as director of IPC Mexico. Andy Shaughnessy and Barry Matties recently spoke with Lorena and IPC Vice President of Education David Hernandez about IPC Mexico’s growth, as well as the office’s plans to provide PCB manufacturers the training resources they need to succeed.

Catching Up with Prototron’s Lee Salazar: Sales in the New Frontier

In the business world, salespeople arguably were the most affected by the pandemic. These professionals had to be the most creative when trying to ply their trade. They had to work from home, make phone calls in lieu of face to face, and learn how to use social media networks and newsletters. This was all to reach their customers—who also were working from home. Even when they got vaccinated and managed to hit the road, they often found that their customers’ doors were closed and they were not allowed inside, if their particular contact was there at all. Many times, they had to resort to meeting their customers in parking lots or restaurants with outdoor dining. And guess what? It’s not even over yet. So, how does a salesperson create success when so much seems to have changed? I reached out to Lee Salazar of Prototron to learn how he met the challenges, and his tips for others who are moving forward.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed! These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.

The Survey Said: Why Don’t You Know Your Fabricator?

When we want to find out what challenges our readers are facing, we just ask. And they don’t mind sharing—the good, the bad, and the ugly. In a recent survey, we asked our PCB designer readers, “Why don’t you know who is going to manufacture your boards?” Here are some of more interesting replies we received, edited slightly for clarity. Do you see yourself in these replies?

Catching up With Author Ed Chambliss: Fixing a ‘Broken’ Business Model

I love books, especially good business books. In fact, I read three or four a week which I believe makes me a very discerning critic when it comes to ones with the right message. "A One-Legged Stool: How Shareholder Primacy Has Broken Business (And What We Can Do About It)" by Ed Chambliss is one that can help us in both business and life. It has the right message. This book is so timely and extremely important now because Chambliss brings to light one of the great wrongs in the thinking of the last century, an error that has broken business for the past 50 years—the idea that we are all in business to make money for our shareholders and (and all others, employees, customers, and vendors be damned). We all know where this has gotten us.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re still not officially into summer yet, but Atlanta is bringing the heat, baby! It’s hit 97 degrees a few times this week, and I now have a fan aimed right at my face. At least it’s nice and humid too. I’m glad I don’t wear make-up. And it’s been a hot week in the circuit board community. This week, Eltek reported a fire at a board shop in Israel, and Flex committed to building a 145,000-square-foor facility in Jalisco, Mexico to serve the electric and autonomous vehicle segment.

Siber Circuits Owner Responds to ‘Rep’ Column: Encourage Communication

Simon Etherington, president and owner of Siber Circuits, felt so strongly about Dan Beaulieu’s weekly column titled “Reps Need a Better Deal, Part 2” that he put fingers to the keyboard and expressed his thoughts as a response. Beaulieu frequently writes about sales and marketing topics, particularly the relationship between the sales rep and the principal. Dan has argued that there needs to be improved communication, better language in the contracts, and a sales rep that’s eager to earn. See what Simon had to say.

Review: Institute of Circuit Technology 2022 Annual Symposium

The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.

PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show

Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.

I-Connect007 Editor’s Picks: Five Must-Reads for the Week

PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.

Candor Nails the ROI With InduBond

Nolan Johnson follows up on his original interview with Sunny Patel, engineering manager at Candor Industries, about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine. Capabilities and energy use are two things that are significantly better, but has there been a positive impact on throughput? Sunny explains.


Surveying the Fab Landscape: Where to Find ROI

Torsten Reckert and the team at all4-PCB have a uniquely broad view of what’s happening in the industry. When we asked Reckert about the hottest areas for return on investment, his answers were insightful and sometimes surprising. Readers will note that this conversation includes multiple references to Alex Stepinski and his approach to developing paradigm-shifting processes at GreenSource Fabrication LLC. Reckert worked closely with Stepinski during his time at GreenSource, and just as Reckert is an expert on the current market, Stepiniski is a thought leader on how to optimize processes, making his mention in a return-on-investment conversation particularly valuable.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we bring you an article about manufacturing training for veterans, and a review of a great signal integrity webinar. IPC honors its A-Teams with the coveted Golden Gnome Awards, and Technica discusses various ways for fabricators to increase ROI. Dan Beaulieu has a review of a really cool book: Back to Human—How Great Leaders Create Connection in the Age of Isolation. In spite of all the meetings on Teams and Zoom, it’s easy to feel disconnected. But great leaders find a way to foster that connectivity.

Technica Heats Up ROI Discussion

The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

FIRST: Endorsed by Teachers and Students Alike

For Inspiration and Recognition of Science and Technology (FIRST) is a robotics program at Oregon’s West Linn High School led by computer science and engineering teacher Tim Manes. Barry Matties caught up with Tim and his student team, 2BDetermined, at the FIRST Pacific Northwest District robotics event in Salem, Oregon. The team has excelled at the local and regional levels and was invited to participate in the world competition in April.
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