Article Highlights
Michael Carano: A Focus on Process Control, Part 2
09/28/2022 | I-Connect007 Editorial Team
The New World Order of JIC
09/27/2022 | Dan Beaulieu, D.B. Management Group
A Focus on Process Control, Part 1
09/27/2022 | I-Connect007 Editorial Team
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/23/2022 | Andy Shaughnessy, Design007 Magazine
IPC: Companies Are Intentional About Tracking Environmental and Social Risks
09/22/2022 | Suhani Chitalia and Kelly Scanlon, IPC
PCB :: Fabrication Process

Latest Articles

Conducting Very High Currents through PCB Substrates at High Ambient Temperatures

One of the major challenges of our time is climate change and the associated need to reduce greenhouse gas emissions. The requirement to reduce CO2 emissions has brought about significant changes in the area of power generation, and also in the area of mobility. Supported by a favorable subsidy policy, the solar boom originated in Germany and quickly spread widely across Europe.

Specialist Coatings for Specialist Applications

Taiyo America’s Josh Goldberg agreed to spend a few minutes with I-Connect007's Pete Starkey at productronica recently, where he indeed climbed out of the box and explored the broader market for high-performance polymer coatings in the electronics industry.

productronica 2015: Ventec's Latest Developments in the UK

Ventec continue to invest in the pursuit of ultra-cleanliness in pre-preg fabrication and packaging in their UK distribution operation, and announce a range of complementary consumable materials - foils, drill boards and release films - as proven in their Ventec-Option laminating and drilling service, leveraging their purchasing power and sharing the cost benefits with their laminate customers.

For Pioneer MuTracx, the Future Looks Bright

In this interview conducted at productronica recently, I-Connect007 Tech Editor Pete Starkey and Publisher Barry Matties speak with Arnoud de Geus, Executive Board member at technology company Sioux. They discuss the success of MuTracx’s (owned by Sioux) first installation of the Lunaris machine in the Whelen factory in New Hampshire, and what this has meant towards proving it can operate in a full-time production process. Arnoud forecasts what’s next for MuTracx and what they must do in order to capitalize on the positive exposure.

For Pioneer MuTracx, the Future Looks Bright

In this interview conducted at productronica recently, I-Connect007 Tech Editor Pete Starkey and Publisher Barry Matties speak with Arnoud de Geus, Executive Board member at technology company Sioux, about the success of MuTracx’ (owned by Sioux) first installation of the Lunaris machine in the Whelen factory in New Hampshire, and what this has meant towards proving it can operate in a full-time production process. Arnoud forecasts what’s next for MuTracx and what they must do in order to capitalize on the positive exposure.

The Opportunities for Plasma Processing

Pete Starkey interviewed Andre Bodegom, managing director of Netherlands-based Adeon Technologies B.V., about their long relationship with Nordson MARCH, typical applications for plasma equipment, and what the most challenging materials are from the point of view of plasma processing in the PCB industry.

HKPCA & IPC Show 2015 Kicks Off in Shenzhen China

Barry Matties talks with Daniel Chan, executive director of the HKPCA, about the organization’s expanded global outreach. They discuss what attendees can expect from this South China trade show that has become one of the biggest and most important shows in the PCB industry.

On Scene: ICT Darlington Seminar, 24 November 2015

Darlington, in the north-east of England, has become an established venue for the Institute of Circuit Technology’s annual Northern Seminar, a not-to-be-missed opportunity for the UK’s PCB technologists to keep abreast with current developments and to network and exchange ideas and experiences with their peers. Coordinated by ICT technical director Bill Wilkie, and generously supported by Merlin PCB Group, the programme consisted of papers on funded projects and project funding, and updates on chemical process technology.

productronica 2015: Taiyo's Exciting Inkjet Solder Mask Options are on the Horizon

Donald Monn, European Sales Manager, Taiyo America, discusses with I-Connect007's Pete Starkey about the latest developments in ink-jetting solder masks.

productronica 2015: Electra's LDI Soldermasks for LED and Future Ink-jet Developments

Ashley Steers of Electra Polymers Ltd discusses with I-Connect007's Pete Starkey about the continuing developments in LDI soldermasks, and how the challenges associated with highly reflective white soldermasks for LED applications are progressively being overcome.


All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.

productronica 2015: Ucamco's Integr8tor Incorporates Polar Stack-up Functionality

Big extensions to the capabilities of the Integr8tor client-server work-flow system, way beyond the established CAM functions, now include full product definition covering all production stages of PCB manufacture, including flex and flex-rigid technologies. Integr8tor now incorporates all of the functionality of Polar Instruments’ stack-up design package, instantly accessible.

productronica 2015: Orbotech's Nuvogo 1000 Brings High Speed to Solder Mask LDI

28 watts of laser power enables the Nuvogo 1000 dual wavelength direct imaging system to achieve production throughput for solder mask up to 40 double-sided panels per hour, while retaining the versatility to image inner layer and outer layer features as fine as 24 microns.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs. There are many similarities between the two, but also significant differences.

Mr. Laminate Tells All: Where in the Holy Halogens did 900, 900, 1500 Come From?

The 900, 900, 1500 is not a combination to an enormous safe that contains the remains of Jimmy Hoffa, nor is it the weight of three elephants at the San Diego Zoo in kilograms. The 900, 900, 1500 is the maximum parts per million (ppm) of bromine and chlorine and the total bromine and chlorine in a material that can be defined as “halogen-free” in the electronics industry today. But where did these requirements come from? Clearly, 900 ppm of bromine or chlorine is obviously not halogen-free. Some would argue that it is not even low-halogen at all.

Catching up with PNC

PNC, in Nutley, New Jersey, is a truly unique company. Started in 1968, and then taken over by Sam Sangani in 1996, it has evolved into one of the premier PCB companies on the East Coast, if not the country. Over the years, the company has grown to the point where it now offers circuit design, layout, fabrication and assembly to its customers, making it one of the few total concept under one roof companies in North America.

Plant Culture: a Direct Contributor to Quality, Output and Predictable Manufacturing

The culture of any organization influences the net output of any product or service it produces. That being said, the manufacturing of products brings complexity with an order of magnitude that can affect the net output at any given point along the build cycle, starting with the sub-component supply chain to final pack.

Whelen & IPS: A Strategic Partnership—A Winning Combination

Of the 39 suppliers Whelen chose to use, none were as integral to the automation and overall design and layout of the line as IPS, with its team led by President Mike Brask.

Catching up with Cosmotronic’s Gary Abel

Cosmotronic’s history spans a number of decades, from the hot-as-hell boom days of the '60s and early '70s when Southern California was leading the world in electronics, from weaponry to avionics to apace exploration. Today, as innovation has become more focused on personal electronics, Cosmotronic has been there, leading the way and serving a customer base that is uniquely similar to the one they had back in the day.

Recruiting for Growth - An Interview with Jack Pattie, President & CEO of Ventec USA

Ventec USA is growing its successful US team, whilst others seem to be suffering from closures, stock downgrades and market challenges. I caught up with Ventec USA President Jack Pattie to find out why they are busy bucking trends.


American Standard Circuits Taking Business to New Heights

PCB007 Managing Editor Patty Goldman sat down with American Standard Circuits President Anaya Vardya at the recent SMTAI show and conference in Rosemont, IL. Anaya wanted to share all the great new things going on at his company. Among the topics they discussed: new equipment, new processes, new people, and what it all means for ASC’s growth.

Breaking the Bottleneck: Electrical Test Cycle Time Reduction

From the conception of the design and issuance of the procurement document, dozens of processes must take place before the PCB is shipped for assembly. This article looks at reducing the cycle time in electrical test of PCBs, and highlight strategies to do so.

Cycle Time Reduction in a Flexible Circuit Facility

Managing product flow and cycle time across a wide range of product constructions and volumes in a high-mix flexible circuit fabrication facility can be extremely challenging. What seems to work best is a tailored hybrid system, with concepts adopted from classic just in time manufacturing (JIT), theory of constraints (TOC) and quick response manufacturing (QRM).

All About Flex: Plated Through-holes in Flexible Circuits

There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.

The Economics of Reducing Cycle Time in PCB Fabrication

As circuit board fabricators are constantly pressured for cost reductions, speed is definitely one thing worth paying for in 2015. This article highlights examples of industry practices that successful fabricators in the quick-turn market embrace that can help those companies who want to reduce cycle times in their operations.

The PCB Marathon

Printed circuit board shops have been driven to build new business strategies that overcome the paradigm of trade-offs, in which customers had to choose between one characteristic or another, into a new way of doing business in which an equilibrium is found that meets customer needs.

Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

Practical Application of Lean Six Sigma to Drive Cycle Time Reduction, Part 1

One of the most systematic and successful approaches to the challenge of cycle time reduction can be found in the principles and tools of lean six-sigma methodology. The success of this strategy requires commitment; it is not a quick fix, nor will it be effective if it is only used as an occasional housecleaning activity.

Interim CEO Jeff McCreary Discusses Recent Changes at Isola

Isola’s Interim President and CEO Jeff McCreary explains to Barry Matties the impetus for the personnel reduction taking place at Isola, the closing of their northern California facility, and why there’s no need to panic. He also shares his view of what the industry may expect from Isola going forward and what the company is looking for in a new CEO, the name of which McCreary expects to announce in the next few months.

Mutracx: First Install Achieves CAM to Etch in 5 Minutes

Mutracx Sales and Marketing Director Peter Coakley discusses with I-Connect007's Barry Matties how the new Lunaris machine installed at Whelen Engineering works and explains how it can save time and money on the shop floor.


How to Handle Short Development Cycles

Automotive is a segment that any market can learn from. In past years, we had a saying: “You can have cheap, on-time or high quality; pick two.” Going back five years, this was the response to short development cycles. In looking at the last two years, however, we have the reality of the short development cycle. Mix this with the recent recalls and safety issues, and it is now an unwritten requirement to deliver low cost, high quality and on time. It is not uncommon to go from idea to series production in only 14 months.

The Application of Advanced Ultrasonics in Metal Plating Processes

Most surface modification chemical treatments by their very nature contain hazardous and oxidising chemicals; there is a major concern that these chemicals are used maliciously with the intent to manufacture explosives or formulate poisons to harm the public. Cyanide-based plating solutions and high concentrations of hydrogen peroxide used in current techniques are a significant use of these materials in industry.

Cycling Around

This month in The PCB Magazine we are paying attention to cycle time and the many ways to reduce it in your process—whatever you consider your process to be. Beginning with the story of Whelen’s new fully automated facility in New Hampshire and continuing through discussions on Lean Six Sigma, Kanban, Value Stream Mapping and other cycle time reduction strategies, our contributors have it covered.

Stepping Up To Laser Processing for Flex, Part 1: Opportunities and Implications

Market demand for smaller, faster, wearable, lighter and more powerful devices continues to keep PCB manufacturers scrambling to keep up as they evolve and adapt their manufacturing capabilities to meet changing customer needs. But keeping up with the dizzying pace of change in the world of PCB manufacturing need not be a daunting task.

New Leadership at MuTracx

I-Connect007's Barry Matties speaks with Arnoud De Geus, managing director of the Sioux Group, who discusses the recent integration of MuTracx into the Sioux Group, and how Whelen Engineering, who has installed the MuTracx Lunaris primary imaging equipment and happens to be the United States’ first captive PCB manufacturing facility in many years, will impact U.S. manufacturing.

Testing Flexible Circuits, Part 2: Raw Materials and Components

Even though the raw materials may individually meet certain specifications, it is important to determine if the final product configuration meets those specs. So testing done at the finished circuit level is also needed. Tests specific to the finished circuit will be the topic of our next column on testing.

Carmakers Now Embracing Plasma Treatment

The growing complexity of automotive electronics is leading more carmakers to consider using plasma treatment to ensure greater reliability. Nordson MARCH's Jonathan Doan shares the benefits of the process along with some new information regarding the MES3 requirement with I-Connect007 publisher Barry Matties.

The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Final Surface Finishes for Automotive: No One-Size-Fits-All Solution

Regardless of whether your application is automotive, medical or military, there are many factors to consider when selecting a final surface finish. Cost, lead or lead-free requirements, end environment, shelf life, fine-pitch components, RF applications, probe-ability, thermal resistance and shock and drop resistance, to name a few. There is not a one-size-fits-all finish. Understanding the advantages and disadvantages of each surface finish allows the designer to select the finish that best fits each particular application.

Big Strategies for Success

I-Connect007’s Barry Matties speaks with Pratish Patel of Electronic Interconnect about the new strategies and capabilities the company is building. The conversation also covers Electronic Interconnect’s move into the automotive industry and how strategies for buyers could help to lower cost and improve quality.


HDI Technology - Flex Circuits

The flex circuit industry in North America is moving rather quickly. The packaging densities are moving to smaller and the electrical requirements much faster. In order to keep pace with the industry requirements of HDI, North American flex vendors need to invest in equipment, resources and R&D.

Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics?

For the past several decades, modern cars have not changed much. They have four wheels, an engine, a radio (possibly even an 8-track) and seatbelts. Over time, however, cars’ electronics parts have evolved faster than any other part of a car with enhancements like power windows, power mirrors, seat heaters and GPS navigation.

Cars, Cars, Cars!

The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.

Characterization of PCB Material & Manufacturing Technology for High-Frequency

Concepts like Industry 4.0, Internet of things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement—a considerable amount of data and increased data transfer rate. The aim of this paper is to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.

Improved Design of Dry Film Resist Laminator for Optimal Transfer of Micron-sized Features

Since the inception of dry film lamination, the process of squeezing two hot rolls at their end axis points has caused roll bending. An innovative process has now been developed whereby the film is attached with a process that minimizes this issue and provides optimal, evenly dispersed heat and pressure across the entire surface of the panel. This simple and elegant design will ensure that the integrity of the resulting image will be ideal, as measured by the continuity of the resulting transferred traces and features.

Plating and Quality are Close Partners

A good plating manager is a seasoned veteran with many years of hands-on experience and probably an engineering degree. Bob Tarzwell sees firsthand how PCB manufacturers, without the proper plating shop set-up operations, knowledge and experience, adapt and accept poor practices as normal while they continue with poor quality processes—even after attempted corrective input from vendors and consultants.

Dry Film Photoresist Thickness Selection Criteria

Dry film photoresist suppliers typically indicate for which process a certain resist type is suitable; however the fabricator still has to select the resist thickness that matches his needs best. The most important thickness selection criteria that come to mind are price, resolution, and yield. This article talks about the advantages and disadvantages of choosing films that are too thin for the application.

Material Witness: The Use of Fillers in Composites

The use of finely divided ceramic fillers in composites intended for use in printed wiring boards has a long history, but most people still associate the idea with reducing the cost of the product by loading it with an inexpensive inert filler. Nothing could be further from the truth...

Design and Manufacture of High-Voltage Electronics

This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.

A Well-Designed Laminate Supply Chain has to Own It!

Suppliers must use industry knowledge, robust systems, clever software and total visibility to build a supply chain agile enough for any PCB fabricator. Consigned stock, local customization, regional hubs, short manufacturing cycles, controlled processes and highly evolved systems are just a few of the tools needed to develop custom fit solutions that flex and move with the needs of the fabricator and their customers. You can only design the supply chain when you own the supply chain.


Coated Ultra-Thin Copper on Printed Circuit Laminates

Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.

An Update on the Rogers Material Supply Line

As part of a recent I-Connect007 supply chain survey, we found that RF laminate material can be very difficult to obtain. Rogers Corporation was named specifically in our survey as one supplier with a limited amount of material available. In fact, their delivery time was reported as being as high as 55 days for some materials at one point. In an industry where quick turnaround time is critical, this is one supply line that killed any hope of being quick.

Innovative Technologies Drive PCB Industry Growth

PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of RMB 576 billion (USD 93.8 billion).

Rigid-Flex PCB Right the First Time--Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

Institute of Circuit Technology 41st Annual Symposium

ICT Technical Director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of Circuit Technology Annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in Dudley, in the West Midlands of England, home of the original Industrial Revolution.

How to Make Mass Lam Outsourcing Successful

For PCB manufacturers in the United States and Europe, finding a suitable mass lam-outsourcing partner can be a challenge. In this interview with Option Technologies, a Ventec International Group company, I-Connect007 Technical Editor Pete Starkey and Option Managing Director Steve Law discuss the ins and outs of this specialist market.

A New Source for Laser Drills

Publisher Barry Matties recently visited the West Coast offices of Nano System Inc. to catch up with Sam Sekine, formerly of Hitachi. Nano System is a new company focused on producing and selling laser drill systems to the PCB industry. In this interview, Mr. Sekine discusses his staff, the company’s technology, and Nano System’s strategy for the future.

A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex

Conventional electroless copper systems often required pretreatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering. To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector of the printed circuit industry.


HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process

Microfill through-hole fill electrolytic copper is a new process designed to offer outstanding through-hole fill, particularly for substrates intended for use as core layers in build–up applications, producing planar, solid copper plugs in high-volume production plating equipment. This article describes a novel copper through-hole fill electroplating process designed for use with insoluble anodes and direct current (DC) rectification.

Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!

We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.

Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating

One of the three most fundamental aspects of printed circuit fabrication is the metallization and electroplating of throughhole vias and blind via interconnections. In this article, Michael Carano writes about the strategies in optimizing acid copper electrodeposition processes for high-throwing power DC plating.

ENEPIG: The Plating Process

In this article, George Milad talks about the complexity of the ENEPIG process, how it works, its requirements and the critical parameters that must be maintained in the ENEPIG line. He writes that shops that have good engineering and documentation of the manufacturing process, coupled with a dedicated, experienced ENEPIG operator that is backed by a capable analytical laboratory, run defect-free ENEPIG day in and day out.

Precision Back-drilling High-Speed PCBs? No Problem!

Grant Christiansen of Schmoll Maschinen discusses the latest developments for high-speed back-drilling, particularly for the North American market. He stresses the importance of both software and machine capability, along with working closely with the customer.

The Future of Nickel in Nickel/Palladium/Gold Final Finishes

Final finishes can be subdivided into metallic and organic finishes. For the purpose of this article, the focus will be on the metallic finishes using the combinations of nickel (Ni) and/or palladium (Pd) and/or gold (Au). Variations on this theme are used extensively in the electronics market of today. The Ni/Pd/Au mutations are the inevitable result of technical requirement changes coupled with true and perceived acceptance within the industry.

An Interview with Gardien Group’s Jason Fraser

Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.

Being Flexible in a Rigid World

With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.

Material Witness: How About that Technical Roadmap!

You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.


Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges

This article describes the recent challenges and developments in manufacturing ALV HDI technology to meet the needs for high volume, robust, reliable, and cost competitive solutions for electronic packaging.

A Conversation (and Day) with Joe Fjelstad, Part 5

Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.

Design Considerations: Flexible Circuit vs. Traditional PCB

The tactics for flexible circuit design don’t differ much from that of traditional PCBs. All of the typical specifications still apply and we add a few more things that require special attention. Cover layers require bigger openings than traditional solder mask, trace directions matter in the flex areas and miters should be round instead of angular.

A Conversation (and Day) with Joe Fjelstad Part 4

We continue the conversation as it turns to the more technically focused area of disruptive technology. The method Joe has been demonstrating for years now is one which is poised to offer dramatic increases in electronic reliability while decreasing overall cost through the elimination of solder--a cornerstone concept of what has been coined as Occam technology.

A Conversation (and Day) with Joe Fjelstad Part 3

In Part 3 of this interview series, Fjelstad divulges his interesting entry into the electronics manufacturing industry, including a brief diversion as a restaurateur. In this portion of the interview, the pair was touring the Evergreen Aviation and Space Museum (home of the Spruce Goose) where Fjelstad spoke frankly about his experience in Vietnam and how it has shaped his view about war, which he shares. Finally, the importance of education was discussed, as well as India, and why the rest of the manufacturing world should be paying attention to them.
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