Article Highlights
Michael Carano: A Focus on Process Control, Part 2
09/28/2022 | I-Connect007 Editorial Team
The New World Order of JIC
09/27/2022 | Dan Beaulieu, D.B. Management Group
A Focus on Process Control, Part 1
09/27/2022 | I-Connect007 Editorial Team
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/23/2022 | Andy Shaughnessy, Design007 Magazine
IPC: Companies Are Intentional About Tracking Environmental and Social Risks
09/22/2022 | Suhani Chitalia and Kelly Scanlon, IPC
PCB :: Fabrication Process

Latest Articles

A Conversation (and Day) with Joe Fjelstad, Part 2

In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.

A Conversation (and Day) with Joe Fjelstad, Part 1

I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.

Building a Better Solder Mask & Legend - Layer by Layer

Camtek's VP of Functional Inkjet Technologies Dr. Boaz Nitzan talks with Guest Editor Kelly Dack about inkjet printing solder mask and legend. The technology uses the actual image of the board being processed, which means misregistration is eliminated.

Drill & Routing Process Experts

Ofer Ton, president of FASTechnologies talks with Guest Editor Steve Williams about drill room automation and the associated cost savings and productivity improvements.

Thermal Management for LED Lighting Applications

PCB substrates designed for thermal management have been around for a number of years, traditionally servicing power-related applications; however, there are now many more suppliers and substrates emerging to meet the growing demand from LED lighting products.

Growing Their Portfolio: Camtek’s One-Stop-Shop in Functional Inkjet Technology

I-Connect007 Publisher Barry Matties caught up with Dr. Boaz Nitzan, VP of Functional Inkjet Technologies at Camtek recently, and the two discussed the company’s expanding portfolio into inkjet printing system for PCB solder mask & legend. The new system is designed to replace conventional coating, drying, exposure and development processes currently used in PCB manufacturing.

Material Witness: Low-Flow Prepregs – Taming the Process

In this installment of Material Witness, Chet Guiles continues his discussion around Low-Flow Prepregs giving good advice about how to actually use these materials.

Inkjet Solder Mask Becomes a Practical Reality

Inkjet solder mask has for many years been a distant, near-impossible, goal for the PCB industry. Hopes have been raised on several occasions, only to fade when the ink either won’t jet or won’t pass end-user qualification. It is now evident that Taiyo’s many years of development in cooperation with equipment manufacturers have resulted in a successful formulation.

21 Years of Growth: A-Gas Electronic Materials Has 2020 Vision

Technical Editor Pete Starkey recently sat down for an interview with Jonathan Sellars, managing director of A-Gas Electronic Materials, at the company’s new facility in Rugby, UK. The company is a distributor of specialist chemicals and processes for semiconductor, PCB, electronic and industrial metal finishing, photovoltaic and advanced packaging technology industries. Sellars outlined the history of the company, its business philosophy and its future plans.

Rex Rozario: Investing in Graphic PLC Through Technology and Capacity

I-Connect007 Tech Editor Pete Starkey and Graphic PLC Group Chairman Rex Rozario caught up at IPC APEX EXPO 2015. Among other items, the two discussed Graphic’s current expansion in size and equipment, as well as what Starkey describes as the company’s history of making good decisions.


Reliability Testing and Statistics

Current industry views on reliability consist of customer requirements and results based on a variety of reliability testing procedures. However, there is still no consensus within the industry as to what each of the reliability test protocols prove and when each test protocol has to be used.

ESI’s New Gemstone Changing the Rules for Laser

I-Connect007 Publisher Barry Matties sat down at CPCA 2015 with ESI’s Mike Jennings, who explained the company’s newest addition: Gemstone, an ESI-designed and manufactured laser system, with 10,000 guaranteed hours, which is poised to change the rules in flex and other printed circuit processing. Jennings also discusses ESI’s new relationship with WKK, and an increased presence in China.

Global Machine and Management and First EIE Strike Important Relationship

I-Connect007 Publisher Barry Matties sat down with Carl Spitko, senior technical advisor at Global Machine and Maintenance, and Jean Paul Birraux, marketing and sales manager at First EIE, for a frank discussion about the working relationship the two companies have forged, the value it brings to their global customers, and what challenges North American fabricators are faced with.

Matrix Product Lines: Laminates and Drills

Fred reviews the Panasonic line of laminates, including high speed and flex materials. Hans discusses Jinzhou's new drill design for high aspect ratio drilling, as well as the opening of several high-tech re-pointing centers in North America.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. After this point, only remedial actions are possible if components are found to run too hot. John Parry discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

Manz: A Total Process Solution

At the recent CPCA Show in China, I-Connect007 Publisher Barry Matties had a chance to speak with Alex Liu, the deputy general manager of the PCB business unit for Manz. Manz has focused on creating a process from direct imaging to wet processing. With more entrants into the direct imaging arena, Liu feels that this approach gives Manz and their customers an advantage.

HASLEN: A New High-Reliability Surface Finish for PCBs

The new surface finish HASLEN is a process that combines electroless nickel coating of PCBs with hot air solder levelling, very common processes used by most PCB manufacturers in the world. Solder levelling of electroless nickel is very difficult as very few solder fluxes are capable of removing the oxide layer from electroless nickel. This has been enabled by solder fluxes based on the novel liquids’ deep eutectic solvents.

Upping the U.S. Service Level of Chinese Manufacturing

Eddie Tang of Glory Faith and Yash Sutariya, president of Alpha Circuit discuss the unique business relationship between their companies. Alpha provides consulting and technical service in North America for GF, including rework and emergency manufacturing capability in its North American plants.

Catching Up with Standard Printed Circuits’ Bob Bormann

Standard Printed Circuits is located in the tiny town of Sherburne in Upstate New York which is equidistant from the cities of Syracuse, Utica and Binghamton where they do a lot of business.

Are There Advantages to Changing Your Registration System?

I-Connect007 Publisher Barry Matties recently had a conversation with DIS's Tony Faraci at IPC APEX EXPO 2015, to learn more about their pinless registration system. What was most interesting to Barry are the potential advantages a pinless system offers and if so, why the process has not been widely adopted.


Panasonic Meeting Market Needs with Higher-Performance Megtron 7

I-Connect Technical Editor Pete Starkey sat down with Panasonic’s Tony Senese and Tomoyuki Abe at IPC APEX EXPO 2015 in San Diego--and high-speed digital materials, particularly those with very low-loss characteristics, was the focus of their discussion. Also noted were the positive responses from chemical process suppliers, and the realistic length of a product development cycle.

Schmoll Keeping an Eye on the Future--and on LDI

In this interview, Thomas Kunz, who has been at the helm of Schmoll Maschinen as president since 1993, discusses the company’s lengthy history in mechanical engineering (more than 70 years!), current global scope, and what he sees as a steady progression in directions that make the most sense to customers, which includes laser direct imaging.​

Cadence’s Brad Griffin Digs Deep Into DDR

During DesignCon 2015, our roving reporter, Kelly Dack, stopped by to visit with Brad Griffen in the Cadence booth. What follows is their very interesting conversation that revolves around the evolution of DDR.

2015 EIPC Winter Conference, Munich: Day 1 Review

Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.

OSP and Selective Electroless Nickel for Mixed-Metal Finish PWBs and BGA Substrates

The documentation relating to the requirements for alternative surface finishes have been well publicized at many industry forums. Pressure to eliminate lead in electronics assemblies is forcing fabricators and OEMs to reevaluate their surface finish and joint attachment procedures.

A Conversation with Andy Michniewicz

Gul Technologies (Gultech) is not your traditional offshore supplier. It is a true industry leader when it comes to technology. A few months ago, I sat down to talk with Mayne-McKenney’s Andy Michniewicz. His company represents Gultech here in North America and they were just starting a project to expand Gultech’s market reach on this side of the globe. I found that interview interesting enough that I wanted to follow up and see how things were going now that a few months have passed.

DSG Invests in the Future

Mauro Dallora, COO of Dongguan Somacis Graphic PCB Co. Ltd (DSG) shares how they have increased revenue and share their plans to double it.

Polar Takes on China's Test Equipment Counterfeiters

Recently, while in China, Barry Matties spoke with Jonson Jiang, country manager of Polar Instruments. They discussed the company's latest impedance test equipment offerings and the challenges Polar faces in China, including companies that create counterfeits of their testing equipment. Can legitimate companies rely on China's government to fight counterfeiting?

Three Industry Giants From WKK Gather Around for Discussion

During the recent HKPCA show we sat down with Hamed El-Abd, Lionel Fullwood, and Gene Weiner. Our discussion covered an array of topics, from politics to new PCB factories and what it takes to stay competitive in today's market.

A Conversation with Gaby Waisman, Orbotech, Ltd.

During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.


A Conversation with Canice Chung, TTM Technologies

We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Aluminum Base Circuit Technology: Structures and Manufacturing Methods

Aluminum is an attractive material for use in the manufacturing of electronic assemblies due to its low cost, good thermal properties, and stability. But due to its innate thermal spreading ability, it's not easily used when solder is required to make interconnections to components. This article describes ways to manufacture electronic assemblies using aluminum as a base and eschewing the use of solder.

Disrupting PCB Imaging with Inkjet Technology: Challenges & Opportunities Explained

Why are 95% of the circuit boards driving digital devices still imaged with film, the same way they have been for the past 50 years? This paper from Henk-Jan Zwiers of Mutracx will address this question by exploring the challenges of digital PCB imaging and the emergence of inkjet imaging, a technology that has the potential to revolutionise the industry.

Electrical Testing of Passive Components

This paper, from a group of authors from Gardien Services, discusses the new processes required by electrical test centers and labs and how the ET arena has adapted to provide accurate testing of buried resistors and accommodate the buried capacitive cores to not receive false errors from the grid testers and flying probes.

Graphite-based Direct Metallization for Fabrication of Complex Interconnect Designs

According to author Michael Carano, colloidal graphite direct metallization processes have proven their usefulness as a replacement for electroless copper. Continuous improvements in the stability of the graphite dispersion has made the process an enabler for flex and HDI interconnect designs.

Viking Moves On

Technical Editor Pete Starkey says the warmth of the welcome at Viking more than compensated for a three-hour trek through the traffic and southern England's miserable weather: "There was a buzz of excitement about the place and the development workshop was a hive of activity, with a crowd gathered around the CircaPrint digital ink-jet printer, the print-head scanning smoothly in a glow of purple light."

New Developments in ENIG and ENEPIG

Surface finish is about connectivity. It is the surface which forms the connection between the board and a device. Today, there is an impressive lineup of surface finish products. Among those finishes are ENIG and ENEPIG. George Milad and Don Walsh explain the newest technology developments.

New Compact PCB Plotter Available

LPKF Laser & Electronics' ProtoMat S62 circuit board plotter delivers advanced PCB prototyping capabilities with reduced board production time and increased overall accuracy. Combining a maximum milling speed of 150 mm/sec, a system resolution of 0.25 µm and a 62,000-rpm spindle motor, the plotter produces fine traces for all types of PCBs, including RF and microwave boards.
PREVIOUSNEXT
Copyright © 2022 I-Connect007. All rights reserved.