Article Highlights
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/01/2022 | Andy Shaughnessy, Design007 Magazine
EIPC Summer Conference 2022: Day 2 Review
06/29/2022 | Pete Starkey, I-Connect007
EIPC Summer Conference 2022: Day 1 Review
06/28/2022 | Pete Starkey, I-Connect007
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
06/24/2022 | I-Connect007
Catching up With Author Ed Chambliss: Fixing a ‘Broken’ Business Model
06/22/2022 | Dan Beaulieu, D.B. Management Group
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So Many Types of Test and Product Services, So Little Time

Guest Editor Dick Crowe talks with Rick Meraw, VP of Quality at Gardien Services about their testing services.

3D Printed Electronics: When & How?

Josh Goldberg, marketing specialist with Taiyo America, looks beyond fusion deposition modelling and considers what might be achievable in 3D printed circuit fabrication using UV curable materials and metallic powder laser sintering.

Bob Neves Receives Award, Talks Bergman Tribute

I-Connect007 Publisher Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.

Bob Neves Receives Award, Talks Bergman Tribute

Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman IPC Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.

2015 EIPC Winter Conference, Munich: Day 1 Review

Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.

It's Only Common Sense: Looking Good!

You should be constantly thinking how your company presents itself to the outside world: what it looks like when you walk through it, what it sounds like when customers call in. Does your company appear to be a well-run lucrative company or does it look like a company on its last legs, ready to go out of business?

OSP and Selective Electroless Nickel for Mixed-Metal Finish PWBs and BGA Substrates

The documentation relating to the requirements for alternative surface finishes have been well publicized at many industry forums. Pressure to eliminate lead in electronics assemblies is forcing fabricators and OEMs to reevaluate their surface finish and joint attachment procedures.

A Conversation with Andy Michniewicz

Gul Technologies (Gultech) is not your traditional offshore supplier. It is a true industry leader when it comes to technology. A few months ago, I sat down to talk with Mayne-McKenney’s Andy Michniewicz. His company represents Gultech here in North America and they were just starting a project to expand Gultech’s market reach on this side of the globe. I found that interview interesting enough that I wanted to follow up and see how things were going now that a few months have passed.

Prototron Circuits to Exhibit at SMTA Rocky Mountain Expo

Dave Ryder, President of Prototron Circuits of Redmond Washington and Tucson Arizona announced recently that his company will be exhibiting at this year’s SMTA Rocky Mountain Expo and Technical Conference 2015 to be held on Wednesday, January 28th at the Champions Club &Sports Authority Field at Mile High Stadium in Denver Colorado.
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