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Atotech Brings World-Class AHDI to the U.S.
12/06/2018 | I-Connect007 Editorial Team
Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador
12/05/2018 | Pete Starkey, I-Connect007
Meet All Flex’s New President and CEO Matt Keithly
12/04/2018 | I-Connect007 Editorial Team
Innovative PCB Processes are Lean and Green
11/29/2018 | Happy Holden, I-Connect007
GreenSource: The Future
11/26/2018 | Nolan Johnson, I-Connect007
Simplifying Thermal Management
Yash Sutariya, Vice President of Corporate Strategy with Saturn Electronics Corporation, sits down with Guest Editor Kelly Dack to highlight his company's new online thermal resistance calculator that cools the complexity of dealing with complex physics.
Camtek: Developments in Inkjet Solder Mask
Camtek exhibited the company's digital inkjet printer for solder mask at APEX and General Manager Jason Rollo details to Editor Pete Starkey the characteristics of the system and its benefits to the quick-turn PCB fabricator.
IPC Flex Committee Update With Co-Chair Nick Koop
Joe Fjelstad interviews Nick Koop of Minco about the IPC flex committee's activities. His committee is working on updates for the HDI specifications for flex. Lots of challenges lay ahead for the flex industry as it moves to finer lines and spaces.
The Future of Digital Imaging
Frank Medina, CEO of Technica USA, and Noriaki Tomioka, Director and Senior Vice President of Hakuto Co., discuss the transition to digital imaging in both the North American and Asian markets. This transition is made easier due to new technologies such as the new Maskless Lithography units.
TTM to Acquire Remaining Stake in Aspocomp
PCB maker TTM has entered into a letter of intent to acquire the remaining 20% interest in Meadville Aspocomp Holdings Ltd. from Finland-based Aspocomp Group Plc for EUR 14.5 million.
The Year of Design
Vicka White, principal engineer at Honeywell Aerospace, interviews Paul Reid, program coordinator of PWB Inc., about what's new in reliability testing and why he believes this is the "Year of Design." He discusses how RoHS requirements have furthered the development of more robust materials and interconnections, and how the effects of design are starting to be a major influence on reliability.
Visper Bridges the Gap in Bare Board Inspection
C.A. Picard's Gary Weidner explains to Editor Pete Starkey how an intelligent final inspection machine with Gerber reference can pick up bare board faults commonly overlooked by human inspectors in this interview from the APEX show floor.
Ventec International: The Importance of Being Different
Technical Editor Pete Starkey sat down at CPCA 2011 with Mark Goodwin, Jack Pattie and Thomas Michels of Ventec International Group and invited them to explain how Ventec differentiates themselves from other Asian laminate manufacturers in overseas markets.
MicronSi Enters LED Market
Gordon Quinn, President of MicronSi, sits down with Editor Pete Starkey and details his company's entry into the LED market with their new imaging systems. So far, the company has seen remarkable results in just a short time.
Ventec Expands to Europe
Guest Editor Michael Weinhold, Technical Director of the EIPC, talks with Chris Lung, President of Ventec Electronics, about his company's recent venture into the European market. Lung says Ventec will target the high-performance, quick-turn, fast delivery service market in Europe.
Cicor's PCB Sales Up 23% in 2010
In 2010, the PCB Division created new key account management jobs and expanded its regional distribution network in N.A. Challenging qualification phases with new customers in various client segments were taken on to generate sales. The innovation that facilitates the use of PCB connections in three dimensions was also prioritized during the year under review.
IPC Symposium: Roadmap to Regulatory Compliance
Keeping on top of ever-changing environmental regulations around the world and providing a roadmap to compliance, the IPC It's Not Easy Being Green Symposium, May 11–12, 2011, in Boston, will give companies up-to-date information on the laws and regulations that affect every link of the electronics manufacturing supply chain, from Europe and Asia to South America and the U.S.
IPC Winter Webinar Tackles Industry Challenges
Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high-voltage PCB design, PoP assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the Webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
MFLEX Reports Strong Fiscal 1Q11 Results
The company expects to report net sales in the first quarter of approximately $241 million, the highest quarterly amount in the company's history and an increase of approximately 5% from net sales of $229.5 million in the same quarter last year.
It's Only Common Sense: New Year's Resolutions
I have a confession to make. I've found lately that I am not answering my e-mails as promptly as I used to. In fact, in some cases, I am not answering them at all.
It's Only Common Sense: How Things Have Changed
Something is missing, something very important that has been eliminated and that something is human contact; the plain old face-to-face method of doing business.
Park Promotes Mastrogiacomo to SVP Strategic Marketing
Park Electrochemical Corporation has promoted Christopher T. Mastrogiacomo to Senior Vice President of Strategic Marketing. He will be responsible for the company's global OEM marketing efforts, as well as marketing and sales efforts in the Asia-Pacific region and Europe.
PCB Industry Computing on a Cloud?
Consona is an ERP company with a long history in the PCB business with their Cimnet product. In this interview from the HKPCA & IPC Show, Mehul Dave discusses his company's efforts to capitalize on the move to Cloud computing by providing their customers alternatives to the traditional Client/Server systems currently in use.
HKPCA & IPC 2010: Smiles All Around
The HKPCA & IPC Show 2010 is over, but the memories of the successful south China show can be found in this animated slide show.
Has Chinese Manufacturing Quality Improved?
WKK's President, Hamed El-Abd, sat down with Guest Editor Bob Neves at last week's HKPCA & IPC Show to talk about recent changes that have propelled his company into the manufacturing arena in China.
It's Only Common Sense: What's the Big Secret?
What's the big secret? Is it that you don't want anyone to know about your business? Is it that you feel that you already have all the bookings you need? Just what is the problem with getting your name out there in front of your customers?
Soligie Sold on Printed Electronics
Many PCB companies are moving into printed electronic circuits, but Soligie came at PEC from the other side--printing. Alex Zeitler talks with Editor Andy Shaughnessy about the benefits of PEC and why it will likely replace some traditional PCB technology.
The Real "Total Cost of Ownership" of Your Test Equipment
This paper introduces a TCO model for electronic test and measurement equipment and shows how operating costs can be critical drivers in reducing TCO beyond simply lowering acquisition (capital) costs. The TCO concept will help equipment owners make informed decisions on the purchase decision.
Business Forecast: Partly Murky?
The economy continues to struggle, but some electronics companies are doing quite well. What gives? Bare Board Group President Greg Papandrew talks with Editor Ray Rasmussen about the current state of the PCB markets and the visibility going forward, which can best be described as "murky."
Laser Processing of Materials: A New Strategy Toward Materials Design and Fabrication for Electronic Packaging
Increasing the unit volume complexity and density of next-generation packaging products is key. Laser processing is finding an increasing number of applications in the fabrication of these devices. This paper focuses on the application of laser processing to two specific material areas--thin films and nanocomposite films.
Potential Low-Cost Palladium-Alternatives for Activating Electroless Copper Deposition
In this paper, electrochemical measurements were carried out to obtain information about the catalytic activity of copper, silver, nickel and palladium in the oxidation reaction of formaldehyde, as well as glyoxylic acid. Metals with high catalytic activity for each reductant oxidation can be determined by using cyclic voltammetry. These metals are suitable for an improved activation process in electroless copper deposition.
Thermal Management Conference Tackles FR-4 Alternatives
Removing heat has become a major issue as more highly-integrated devices are jammed into less space. At the same time, high-power devices, such as LEDs, are becoming increasingly common, forcing designers and manufacturers to figure out how to keep their products cool.
Taiyo Gains Market Share in Europe: Campisi Interview
Steve Campisi, Taiyo's technical sales expert, having just returned from an extended, but successful, sales trip to Europe, sat down with Dan Beaulieu last week to discuss what it's like for an American-based, Japanese-owned company to do business in Europe.
IPC Opens India Office, Training Facility
Extending its training and knowledge-based resources and services to Indian electronics manufacturing facilities on a local level, IPC has opened its first office in India. Located in South Bangalore, close to the well-known Electronics City, IPC India, a wholly-owned subsidiary of IPC, will be under the leadership of Managing Director, Akshinthala Vijayendra.
Tyco to Sell Mechatronics Business, Affirms Q4 Guidance
The closing of the transaction is expected to occur within 30 days and, in connection with the sale, the company will record a non-cash pre-tax loss of approximately $45 million. Tyco continues to expect adjusted EPS from continuing operations of $0.68 to $0.72 and revenues of $3.05 to $3.15 billion for the fiscal quarter ending September 24, 2010.
Through-Hole PCB Plating With Ultrasonically-Dispersed Copper Nanoparticles
This paper demonstrates the "proof of concept" that copper nanoparticles can be utilized to catalyse the electroless copper process and their potential to replace costly palladium-based activators. The potential for copper nanoparticles to be used as a "direct plate process" is also addressed.
Cicor's PCB Segment Posts 27% Revenue Growth in 1H
Compared to the previous year, the PCB Division increased its net proceeds during the period by 27.3% to CHF 17.8 million (first half of 2009: CHF 14.0 million); During the period, the ES Division achieved net proceeds of CHF 44.8 million (first half of 2009: CHF 41.5 million).
Organic Optical Waveguide Fabrication in a Manufacturing Environment
In this paper, authors from Endicott Interconnect show various organic optical waveguide samples using various fabrication methods. A detailed discussion of all the processes, materials and equipment sets that are employed in the fabrication of the organic optical waveguides are presented.
Guidelines Set on Conflict Minerals Regulation
A new bill, the Financial Reform Bill (HR 4173), has been recently signed, wherein Sec. 1502 states that manufacturers are required to report annually to the SEC if their products contain "conflict minerals" from the Democratic Republic of Congo.
It's Only Common Sense: Let's Start Really Selling
Today's sales people need to be hunters. Listen to this week's new column from Dan Beaulieu, the first in a new series on hard-core selling the "new" way.
BBG's Papandrew Talks PCB Market at Home and Abroad
Bare Board Group's Greg Papandrew sits down with Editor Ray Rasmussen to discuss the PCB market here in the U.S., Taiwan and China, as material shortages push out lead-times and drive up prices.
Meet Our Columnists and Advisors
With the marriage of I-Connect007 and SMT Magazine, the group of industry experts on hand to guide our readers through news, events, controversies, solutions and more--in every aspect of the electronics industry--has grown to an impressive list.
IPC PCQR2 Database Revises Test Panel
Revisions contain a new coupon strip consisting of a Conductive Anodic Filament coupon (through vias only) with four incremental edge-of via spacings; modified via reliability coupons with two different grid spacings in each via net; along with via and conductor cross-section coupons.
Dow Americas is Ready for the Upturn
Company General Manager for the Americas, Hal Thrasher, discusses the integration of Rohm & Haas, the new business structure and the very comprehensive R&D a company like Dow brings to the PCB industry.
Uyemura on the Market and ENEPIG
Don Walsh, Uyemura USA Director of Operations, and George Milad, National Accounts Manager, discuss the market, their business and the progress of the ENEPIG surface finish. Milad heads up the specifications effort, which will soon help bring this finish to the mainstream market.
IPC-7093: BTC Standard Nears Completion
Chipmakers like BTC because it's inexpensive, while electronic engineers like this package style because the distances signals have to travel are short and there's usually a good thermal connection because the parts touch the board.
The Plan for Success--It's No Secret!
Saturn Electronics bounced back from a significant sales hit, having been immersed primarily in the automotive market. The company is a successful board fabricator and is positioned for strong growth with innovative technology and a commitment to investment, according to Yash Sutariya, Vice President.
IPC: Rigid PCB Book-to-Bill Rose in April
Rigid PCB shipments were up 35.7% while bookings increased 40.6% in April 2010 from April 2009. The book-to-bill ratio for the North American rigid PCB industry in April 2010 continued its climb to 1.11.
Rogers Tackles Top Trends with High-Freq Laminate
John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth.
It's Only Common Sense: Steal This Idea
Are we even interested enough to steal ideas from the "other guys?" Check out this week's all new column and find out.
It's Only Common Sense: The Future is Now
The future is now! Life as we know it is about to change for the PCB industry, starting right now. This week, Dan Beaulieu looks into his crystal ball and gives us a glimpse of this new future.
Walt Custer's Global Market Outlook
With the recession of 2009 behind us, market guru Walt Custer offers his insight as to where we are today and takes a look into the future of our industry. Of course, a few concerns are still evident, but things are looking up.
It's Only Common Sense: Cheaters Cheating
If you think everyone in this industry is playing by the rules, think again. This week, Dan Beaulieu gives you the real scoop on cheaters.
Will Internet Clouds Become Like Electricity?
Consona's Mehul Dave delivered an interesting paper at a recent CPCA Show Forum. He discusses the content of the that paper and elaborates on one of the key points: Internet "clouds" are a technology that our industry--and all businesses--must soon reckon with.
UL and CQC Authorized Testing
Microtek Chairman Bob Neves sits down with Editor Steve Gold during the recent CPCA Show to discuss his company's new worldwide "Preferred Partner" agreement with Underwriters Laboratory (UL), as well as the increase in regulations and litigation in China.
Bogatin Gives "First-Timer" Review of CPCA Show
The "Signal Integrity Evangelist" Eric Bogatin hosted his new, high-speed design workshop during CPCA 2010. He sat down with Editor Steve Gold to discuss the technology he reviewed at his first CPCA event and explains why members of Congress should be attending as well.
It's Only Common Sense: Do You Know What You Don't Know?
We're on the topic of pricing once again! Do you know what you don't know? Check out this week's new column--Dan Beaulieu discusses the all-important issue of pricing.
An Inside Look at ICT's First 2010 Darlington Seminar
ICT welcomed delegates last week to the UK's Devonport Hotel for the first Darlington Seminar of 2010, which included presentations from Lamar Group, Park Electrochemical, Electronics Yorkshire and IeMRC. I-Connect007's European Editor Pete Starkey was there and gives a full report.
It's Only Common Sense: Why Forecasting?
Why forecasting? This week, Dan Beaulieu discusses a few of the hidden benefits of the process.
A View of the European Industry: A Distributor's Perspective
PCB007 European Editor Stuart Hayton has a conversation with Andre Bogedom, Managing Director at Adeon, one of Europe's leading PCB supply distributors. Find out the state of Europe's PCB manufacturing sector from an insider who has his finger on the pulse of the industry.
It's Only Common Sense: Snap Out of It!
It's time to snap out of it! The economy is coming back...are you ready?
Converting Flex from HASL to RoHS-Compliant Finishes
Although the transition from HASL to RoHS might sound easy, it isn't. Listen to Al Wasserzug as he explains a few things to consider as you make the move to a RoHS-compliant surface finish.
MacDermid Plans For the Future
MacDermid's Ian Stewart discusses how his company has expanded in the China market. He explains how MacDermid plans to take advantage of a recent change in the China market--from low-tech to more high-tech products.
A New Brand and Different Direction
Maria Gonzalez of Gardien Independent Testing outlines the company's strategy for equipment sales and outsourcing services in the post-Mania era.
BBG Introduces Greg Meindl, Midwest Sales
BBG has been making steady progress through the downturn and recently added long-time PCB pro, Greg Meindl, to manage sales in Illinois, Indiana and Wisconsin.
Orbotech Strengthens LDI Offering
Orbotech President Yoav Harel believes his company has found a robust solder mask solution with its latest addition to the Paragon LDI family. Find out why in this exclusive productronica 2009 interview.
Marshall Matters: A Place at the Table
There is strength in numbers and increased industry representation will result in mutual benefit to the IPC and its members. Growing membership, and pooling resources to achieve targeted solutions, creates synergy that individual action cannot match.
Bridging the Gap Between Printed Electronics and Printed Circuits
PCB007 Columnist Bob Tarzwell speaks with Stan Farnsworth, VP of Marketing, Novacentrix, at this month's Printed Electronics USA and examines a piece of equipment that could help printed circuit fabricators step into building printed electronics.
HKPCA Mirrors Upswing in China
Anthony Hilvers, Vice President of Marketing Programs for IPC, gives a post-show wrap-up. Hilvers believes this year's successful HKPCA show is a reflection of the overall recovery in China.
Getting the UL Seal of Approval in China
With reliability being such a critical concern in electronics manufacture, it's no surprise that UL has seen an increased demand for test services. Global Business Development Manager, Truda K. Chow, talks about what her company is doing in China and how it's handling a growing customer base.
UK Embarks on Research Initiative
Professor Martin Goosey, a veteran PCB technologist, discusses a unique, government-funded research program that unites the needs of industry with the resources of academia. Will this model prove worthwhile for other PCB-producing nations that have unmet R&D needs?
Understanding Europe's Bare PCB Technical Needs
EIPC Technical Director, Michael Weinhold, covers the latest European legislative happenings, including the push toward halogen-free PCBs. Weinhold also addresses other technical concerns, along with the evolving relationship between European PCB makers and low-cost Asian fabricators.
Printed Electronics Circuits: Get on the Bandwagon
Will there be a need for the PCB quickturn and prototype fab shop in a few years if a reliable printed electronic circuit can be built in nothing more than a small corner of a plant with a screen printer, exposure, developer, oven and a drill/router? By Mike DuBois.
Touchless Transport System Offers Plating Process Innovation
After first discussing the PCB market outlook, Atotech Global Sales and Marketing Manager, Dimitry Kostouros, reveals details about his company's new Touchless Transport System (TTS)--a system that holds great promise for HDI manufacture.
Coretec Posts 20% On-Year Sales Drop in 3Q
Sales in the 2009 third quarter were $16.3 million, a decrease of $1.6 million sequentially or 9.4% as compared to sales of $ 17.9 million in Q209, and down $4.0 million or 19.9% from sales of $20.3 million in the same period of the prior year.
Weave and CAF: An Eye-Opening Discussion
Dielectric Solutions' Vice President, Technology, John Kuhn, sits down with Editor Ray Rasmussen to discuss a new glass system that promises to eliminate many of the headaches associated with traditional glass structures for laminates.
D-15 Flex Test Methods Group Update
Duane Mahnke, of DB Mahnke Consulting, heads the D-15 Flex Test Methods committee and provides updates on the group's efforts. One project under development is a thermal index test to let flex fabricators know how long flex materials will survive under elevated conditions.
PCQR2 Subcommittee Update
Designed as a benchmarking tool, the PCQR2 allows board fabricators to assess their capabilities using a common set of tests and tools. David Wolf, Vice President of Technical Marketing at Conductor Analysis Technologies, gives an overview of the committee, its mission and its goals.
The Gold Record: Crosstalk is Back!
This week's edition of The Gold Record is actually a new Crosstalk with Dan Beaulieu and new guest, Bob Tarzwell. They discuss whether or not the upturn in global economic indicators is truly having an impact on our industry. Is there really going to be a "pent-up demand" effect in electronics?
IPC Announces Environmental Compliance Conferences
The IPC (Association Interconnecting Electronics Industries) will be holding two conferences regarding compliance with the current environmental laws November 10-11, 2009, at the Marriott Hotel in Irvine, California.
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