Article Highlights
Crowded Congressional Calendar Affects Industry Priorities
07/24/2019 | Chris Mitchell, IPC VP, Global Government Relations
A Conversation with Karen McConnell—An Emerging Engineer Program Mentor
07/22/2019 | Linda Stepanich, IPC
EPA, Industry Come Together in Visit to TTM Facility
07/18/2019 | Kelly Scanlon, director, EHS policy and research
Kelvin Characterization to Accurately Predict Copper Thickness
07/01/2019 | Article by Brandon Sherrieb, Integrated Test Corporation
Emma Hudson: From Tomboy to Tech Lead
06/21/2019 | Gen3

Latest Articles

TTM to Exhibit at SAE WCX 2019

TTM Technologies, Inc. will be exhibiting at the Society of Automotive Engineers World Congress Experience 2019 (SAE WCX), booth 2234.

TTM on Flex and Rigid-flex PCB Challenges

One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.

EIPC Winter Conference, Day 1

EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

RTW IPC APEX EXPO 2019: Arlon Discusses Investments and Important Role of a Niche Supplier

Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.

NCAB Group on Supply Chain Issues

In an interview with I-Connect007, Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics.

Perspectives on Supply Chain Ripples

The ripples start at the very front of the process when the engineering and design team make their first choices about the performance characteristics for their project, then select components to fit their performance windows.

The Smart Factory IQ Test

Let's see how prepared you are to talk about Industry 4.0. The following 12-question test will measure how much you know about smart factory concepts and philosophies. Since the concept of a smart factory is larger than the electronics manufacturing industry and encompasses the entire supply chain, the terms and concepts here are also more global in nature.

RTW IPC APEX EXPO 2019: Ucamco Discusses Latest Evolution of PCB Software

Ucamco Managing Director Karel Tavernier speaks with Dan Feinberg about their aim of automating the CAM process as much as possible. He also discusses the recent evolution of their PCB software.

RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics

Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI

Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.


Flex/MSTC Joint Conference: A Collaborative Week in Monterey

Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.

Accelerating and Disrupting Innovation: The Tesla Story

The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.

Chemical Recycling as Part of a Zero-effluent Strategy

Green manufacturing methodologies for PCBs are becoming a global shift. Green efforts have been underway in the European Union for quite some time. Likewise, in the United States, new PCB manufacturers are building zero-waste, zero-effluent facilities and gaining certification as such.

Institute of Circuit Technology Evening Seminar

The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.

Gene Weiner on the IPC APEX EXPO 2019 Automotive Executive Forum

Dan Feinberg spoke with Gene Weiner, president and CEO of Weiner International Associates, about IPC's history of forums, his thoughts on the Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019, and how the IPC Hall of Famers and the industry can help improve forum success.

RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO

Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.

Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program

At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.

Book Recommendation: GAP Selling

Get ready for the ride of your life because this book will rock your world. It is the best book on selling that I’ve read in 10 years, and I read all of them. This book debunks all of the so-called “axioms” about selling that you have heard throughout your career. The author “Keenan” (don’t ask, I didn’t) handles all of that sticky stuff that slows down—nay, just about kills—your sales effort.

Reflections on Supply Chain Issues

There are parallels in the PCB fabrication industry right now. PCB fabrication is a lot like that VW microbus. Everything is running just fine while the supply is there. However, the materials supply pipeline is becoming increasingly unpredictable.

Trump Administration can Ease EPA Reporting Burden for Electronics Industry

The finish line may be in sight in a decade-long effort to persuade the U.S. Environmental Protection Agency (EPA) to curb unnecessary and duplicative Toxic Substances Control Act (TSCA) reporting requirements that discourage recycling of manufacturing byproducts.


Isola Executive Vice Chairman and Acting CEO Travis Kelly on the Upcoming Year

Isola Executive Vice Chairman and Acting CEO Travis Kelly discusses the recent milestones for the company, including the leadership transition. Travis also outlines his agenda for the upcoming year and gives an update on Isola’s new facility in Chandler, Arizona.

NCAB Group on Supply Chain Issues

Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics. This is part one of a two-part conversation with Antal.

Selective Solder Mask Deposition by Inkjet

At IPC APEX EXPO 2019, Pete Starkey spoke with Joost Valeton, product manager for PiXDRO inkjet printing equipment with Meyer Burger, about their newly configured inkjet printer for PCB applications, and bringing awareness to opportunities using selective solder mask deposition.

RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services

Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.

Thinking and Designing in Three Dimensions

This article aims to encourage interconnect designers who design for flex or rigid-flex circuits to use the modern CAD tools at their disposal for getting flex done right the first time. While modeling PCBs in 3D is not new, and all the major PCB EDA vendors offer some form of 3D modeling and integration, it is still a rare circumstance that flexible circuit designers use 3D CAD modeling.

Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability?

Gold, palladium, silver, and other precious metals (PMs) in manufacturing wastes represent high value, but how PMs are recovered can pose environmental and liability issues. Aerospace and electronics manufacturers and suppliers, in particular, produce volumes of manufacturing wastes that contain varying levels of PMs.

RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG

John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.

Book Recommendation: The Greatest Salesman in the World

If you haven’t read this classic yet, it’s high time that you did; it’s an oldie but a goodie. Obviously, from the title, you can guess that it is a bit dated (please excuse the term “salesman”). Good, I’m glad we got that out of the way.

RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment

Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.

RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market

Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.


Tara Dunn Shares Strategies for Today’s PCB Business

At the recent AltiumLive event, Barry Matties met with PCB sales expert Tara Dunn of Omni PCB to discuss selling strategies for selling PCBs in the North American market. The conversation also covers strategies for staying competitive through a generational shift in the ownership of PCB shops, and the importance of supply chain communication and building relationships.

RTW IPC APEX EXPO 2019: Meyer Burger Highlights Inkjet Solder Mask Printing Equipment

Annegret Lewak, head of sales at Meyer Burger, speaks with Steve Williams about their latest inkjet solder mask printing equipment, which offers advanced accuracy and resolution imaging.

RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

RTW IPC APEX EXPO 2019: The Circle Is Complete

Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.

RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities

Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.

RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager

Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.

FDA Approvals: Clearing the Hurdles

Manufacturers of medical electronics have their work cut out for them. These products have to pass approval by the Food and Drug Administration (FDA) in addition to getting the nod from more typical entities such as Underwriters Laboratories (UL) and Conformité Européenne (CE, also known as European Conformity).

RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables

Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.

RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer

Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.

RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.


CES 2019: More Show Floor Favorites

In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.

RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries

Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.

IPC APEX EXPO 2019: It's a Wrap!

The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.

RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?

On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.

RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask

Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

Laser Focus on Flex and Rigid-flex

ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

Catching Up with Artnet Pro

I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).


ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.

CES Press Day: NVIDIA, Samsung, and Intel

Three major companies—NVIDIA, Samsung, and Intel—had lengthy, interesting presentations on CES press day, and each had with their own agenda.

Agfa on Revolutionary Inkjet Solder Mask Applications

Does inkjet solder mask have the potential for volume production? Mariana Van Dam, global sales manager for PCB imaging solutions, and Dr. Frank Louwet, business unit manager for advanced coatings and chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.

Better to Light a Candle: Chapter One—Prepping the Next Generation

There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

Dan Feinberg: A CES 2019 Preview

Dan Feinberg gets a first look at the new devices and technologies being shown this year at the innovation world's biggest expo. Read on.

MacDermid Enthone Discusses Consolidation Benefits

At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

Robert Art on the Importance of Thermal Management

Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.

Top 10 Most-Viewed FLEX007 Articles in 2018

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.

Institute of Circuit Technology Harrogate Christmas Seminar 2018

The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.


Chris Nuttall Discusses NCAB Group's IPO and Future Plans

Editor Nolan Johnson sat down with Chris Nuttall, COO and VP of technology at NCAB Group, to discuss software tools, predictive reports, and the company's recent IPO.

The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics

The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).

Top 10 Most-Read PCB007 Articles of 2018

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Automation Attracts: The New Guard to PCB Fabrication

It only took a few seconds inside the GreenSource Fabrication plant for the I-Connect007 staff to realize just how different the facility is. The look and feel of the place, however, is just one difference; staffing the facility is unique as well.

Upcoming 2019 Trade Show Season in the USA

A look back at Dan Feinberg's predictions made a year ago, and a preview of what we might see at CES 2019 along with some new projections. CES—the first, largest, and most influential and predictive of global electronics trends of this group of trade shows.

Successful Flex Circuit Design and Processing Guidelines

With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.

Tarja Rapala-Virtanen Discusses Appointment as EIPC Technical Director

Tarja Rapala-Virtanen discusses her role as the newly appointed technical director of EIPC, Michael Weinhold’s retirement and impact on her career, and the draw and success of EIPC conferences.

Schmoll and Burkle: Lasers and Drills for GreenSource

While at GreenSource Fabrication, Burkle Automation Technology’s Dave Howard introduced me to the Schmoll equipment as well as other items that Burkle installed at the facility. One unit of great interest was the Impex inspection machine which can do sophisticated non-destructive cross-sections using a very fine fiber probe.

John Hendricks on 5G Materials

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Technology Ambassador Alun Morgan

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.


Atotech Brings World-Class AHDI to the U.S.

During our walk-through of the GreenSource Fabrication facility with VP Alex Stepinski, he started the conversation on surface preparation and plating by saying, “We have Atotech horizontal production technology in place here. We’ve been running Atotech turnkey solutions for a while.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Meet All Flex’s New President and CEO Matt Keithly

All Flex Flexible Circuits and Heaters recently appointed Matt Keithly as their new president and CEO. In this exclusive interview, Keithly discusses his background, the direction of the company, and topics related to flexible circuits and other areas of All Flex’s business.

Innovative PCB Processes are Lean and Green

Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.

GreenSource: The Future

This issue is a special one. We devote the entire magazine to a detailed look at Green-Source Fabrication (a division of Whelen Engineering) and its brand new, fully automated HDI facility in New Hampshire. GreenSource is arguably the most advanced and automated fabrication facility in North America today.
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