Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
Chemcut: Wet Processing Equipment for the Long Haul
Chemcut CEO and General Manager Rick Lies speaks about the growth he has seen in the marketplace over his 18 years in the industry, and how Chemcut has been able to remain competitive in the PCB and photochemical milling spaces. Jerry Reitz, Chemcut’s HES manager, also addresses the current shift towards zero-discharge facilities.
The Advantages of Non-sludge Acid Copper Products
Mike Wood, technical director with Cerambus Asia Pacific, discusses the acid copper product from Cerambus Technology Inc. that doesn't generate sludge during the plating process and operates at higher production output by using higher current density. He talks about why this is important for the state of the vertical continuous plating (VCP) market in Asia, and the trends he’s seeing in that space.
Meet Mike Hill, I-Connect007 Columnist
Mike Hill has been in the PWB fabrication industry for over 40 years. Throughout his career, he has been a member of IPC and participated in specification writing for both IPC and the military. Within IPC, he has received the President's Award, General Chairmanship, Committee Chairmanship, and many other recognitions. In his columns, Mike will help you better understand the requirements and how-to's for MIL-PRF-31032 certification for PWB fabrication.
Vertical Conductive Structures, Part 3: Design Tool Techniques
New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.
Solder Mask Curing: UV Bump Overview
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.
Meet Chris Mitchell, I-Connect007 Columnist
Chris Mitchell is vice president for global government affairs at IPC—Association Connecting Electronics Industries—where he is responsible for development and implementation of the organization’s global advocacy efforts and public policy agenda with a focus on electronics industry business improvement, environment, health and safety, and defense initiatives.
How to Feed Test Data Back to Engineering for Process Improvement
Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.
Crowded Congressional Calendar Affects Industry Priorities
More than five months remain in 2019, but U.S. congressional leaders are already running out of time as they face a long list of must-pass bills before year’s end. Although some of these bills do not affect the electronics industry, some of them do, and the overall agenda does affect the opportunities and risks we face.
A Conversation with Karen McConnell—An Emerging Engineer Program Mentor
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.
How Changing Cleaning Technologies Affect Reliability
At the recent IPC High-Reliability Forum and Microvia Summit, Andy Shaughnessy spoke with Michael Konrad, founder and president of Aqueous Technologies and a speaker and panelist at the event in Baltimore, Maryland. They discussed Konrad’s presentation and the recent proliferation of cleaning, from solely high-reliability products to Class 1 consumer products.
Microvias: Links of Faith are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.
Reliability... It All Comes Down to the Landing
Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Whether in medical devices, autonomous vehicles, or in IoT, reliability will be crucial to both our success and safety.
Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
Virtual Verification Station From CIMS Enhances AOI Capabilities
At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.
Technically Appropriate Material Choices Are Key to Success
Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. Editor Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.
Emma Hudson: From Tomboy to Tech Lead
In this interview, Emma Hudson, CTO of Gen3, and Gayle Paterson, founder of Female Leaders in Tech, Everywhere (FLITE), discuss careers and the electronics industry.
AWE 2019: Go XR, Be Awesome
Dan Feinberg attended and covered the recent 2019 Augmented World Expo (AWE) and conference in Santa Clara, California. The event featured the latest developments and technologies in augmented (AR), mixed (MR), virtual (VR), and extended virtual reality (many just call it all XR to make it simple). Here's a wrap-up of the event.
Microtek Labs: Providing Trusted Testing in the Chinese Market
On a recent visit to Microtek Laboratories' Changzhou facility, Barry Matties, publisher, and Edy Yu from the I-Connect007 China team spoke with chairman and CTO Bob Neves about the changes he has seen living and doing business in China over the past 15 years, and the increased importance of standards and testing as China moves into manufacturing more high-reliability products.
IPC’s PCB Tech Trends Study Highlights Issues Impacting Fabricators
The 2018 survey results indicated the need for speed and low loss as critical functions of the materials chosen. This is the digital age, and with the Internet of Things, virtual and augmented reality, vehicle-to-vehicle communication, etc., the need for low-loss and ultra-low-loss materials continues to grow as a percentage of circuit boards fabricated.
DuPont on Materials Challenges and New Opportunities
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.
Creating Stability in Materials Chaos
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.
IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal
Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.
FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent
Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.
Growing Opportunities with 3D Printed Electronics
Dr. Kurt Christenson, senior scientist at Optomec, discusses the company’s Aerosol Jet technology, which eliminates the need for wire bonding by printing interconnects on 3D surfaces. Christenson also explores the current state of the technology and highlights the market segments and applications with the most to benefit from being able 3D print electronic components, such as resistors, capacitors, antennas, and transistors.
DuPont on New Beginnings and Empowering the Industry
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.
Making Materials Succeed: Past, Present, and Future Trends
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.
New Technical Director and Upcoming 2019 EIPC Summer Conference
Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.
Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination
Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.
Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas
In an interview with I-Connect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessica Zhang provides an overview of the company and shares new business trends they're seeing, including LEDs, wearable devices, and more.
Alun Morgan on Thermal Management and LEDs in Automotive
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.
Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.
University Students Point to the Future in their Research
Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.
U.S. Tax Law Boosts Growth, But Uncertainties Loom
Monday, April 15 was the deadline for millions of Americans to file their income tax returns, so this is a good time to review the Tax Cuts and Jobs Act of 2017 (TCJA) as well as the current tax policy landscape and how these rules are affecting the electronics industry.
SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent
Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.
RTW IPC APEX EXPO 2019: MivaTek Discusses Flatbed LED Direct Imaging Systems
Brendan F. Hogan, managing director for MivaTek Global, and Chris Hrusovsky, VP of business development, give Pete Starkey their outlook on the market for flatbed LED direct imaging systems, report spectacular sales success, and describe their new introductions for large-format, dual-tray and microelectronics systems.
Ventec Focuses on High-mix Manufacturing
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.