Ventec Keeps 'Shaking Things Up' with tec-speed 20.0
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
Reliability Takes on a New Urgency
Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.
Atotech on Challenges and Opportunities in PCB Manufacturing
Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.
PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Circuit Automation on the Ever-Evolving World of Solder Mask
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.
Solder Mask: You’ve Come a Long Way, Baby!
For the July 2018 issue of PCB007 magazine, I-Connect007's editing team met with Electra Polymers’ Shaun Tibbals and Antony Earl to discuss what’s new with solder mask, including direct imaging and inkjet printing of solder mask, and what PCB manufacturers and OEMs need to know.
Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
Advanced Copper Plating Process for Any Layer Via Fill Applications with Thin Surface Copper
Copper-filled microvias are a key technology in HDI designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard PTHs, copper-filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost.
MacDermid Enthone Talks Wet Processing Trends in 2018
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
EIPC 50th Anniversary Conference: Alun Morgan Announcement
As the 2018 EIPC 50th Anniversary Conference came to a close in Dusseldorf, Germany, Barry Matties met with Chairman Alun Morgan to look back at how far the EIPC has come in the past 50 years and say goodbye to Michael Weinhold, longtime director and industry veteran, who announced his retirement at this year’s event.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.
Michael Weinhold: Time to Say Goodbye
This year’s EIPC summer conference marked the 50th anniversary for the organization, and with it, the retirement of longtime EIPC member and industry leader Michael Weinhold. I spoke with Michael on his 50+ years in the industry, and on behalf of everyone at I-Connect007, we wish Michael a pleasant retirement and the best going forward.
Flex Time: Why is Rigid-Flex So Expensive?
One question that I hear fairly often, particularly after an initial quotation, is “Why is rigid-flex so expensive?” In this article, I’ll share with designers the cost drivers in rigid-flex relative to standard rigid boards and flex circuits with stiffeners. A typical rigid-flex PWB will cost about seven times the cost of the same design on a hard board, and two to three times an equivalent flex circuit with stiffeners.
Book Recommendation: Listen Up or Lose Out
There can never be enough books about the art and virtue of listening. As a sales trainer, I've learned that there is nothing more challenging than teaching people how to be quiet and listen. So, it was with great anticipation that I read this new book by the Boltons. Never has there been a better time to try to teach people, not just salespeople to turn down the devices, focus, and start intentionally listening to one another.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.
Catching up with… Artnet Pro
I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 2
Part 2 of I-Connect007 Technical Editor Pete Starkey's article on the recent EIPC 50th Anniversary Conference in Dusseldorf, Germany, continues with recap of technical presentations by Emma Hudson, Shannon Juan, Alex Ippich, and Russell Morgan. Read on.
5G—Generation after Generation
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
Catching up with Fineline-Global N. American CEO Eran Navick
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.
May the G Force Be With You
We are about to begin the transition from the present cellular standard 4G LTE to the next generation, 5G. As in the past, most people will wonder, “What does 5G mean to me, and what is LTE anyway?” After all, if you can make your connection reliably and you can send and receive data at reasonable speeds, why should you really care?
The Institute of Circuit Technology Annual Symposium 2018
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.
Book Recommendation: Becoming Facebook—The 10 Challenges that Defined the Company That’s Disrupting the World
Besides being an excellent history book into one of the most fascinating companies in the world, it is also a great business book. Full disclosure, I wanted to read this book because I wanted to know the Facebook story. I did not expect any of the lessons in this book to apply to me and my own small business or the small businesses that I work with, but I was wrong. The book is filled with valuable lessons that can be applied to any company, no matter the size.
Day-to-Day: ZTE and the Potential Impending Trade War Saga
Nanya Technology, Taiwan's biggest DRAM chipmaker, will apply for a permit to provide chips to ZTE. The company said it has been notified about restrictions on shipments to ZTE, and that the ban would have limited effect on its operation. The company said on May 9 that it is preparing to apply for a permit to continue shipping chips to ZTE Corp. as export restrictions took a new turn due to a US-China trade spat.
‘Can Do’ in CAM Outsourcing: CAM Engineering—Reducing Costs
While having on-demand capacity, improved automation, and fast turn-around are critical to any front-end engineering operation, achieving those goals with a cost-effective solution is imperative. Electronics are constantly under cost-reduction pressures. Functionality, capability, and complexity increase while costs decrease.
Golden Anniversary for EIPC at the 2018 Summer Conference
June marks the start of summer, and with that, the EIPC’s annual summer conference. Highlighted by its thought-provoking presentations, social outings and factory tours, the conference continues to be valuable and productive for attendees. This year should prove no different, with EIPC set to celebrate its 50th anniversary. I spoke with EIPC Executive Director Kirsten Smit-Westenberg about what can be expected from the upcoming conference in Düsseldorf, Germany.
AWE: Introducing the Augmented World Expo
The largest and most diverse event regarding the depth and breadth of technological progress and advancement is CES, which lets us get updates and allows us to focus on anything from drones to 3D additive PCB fabrication, from autonomous transportation and the degree of electronics in the newer and upcoming vehicles to the quantum computers and AI of the near future, from the forecasts found in science fiction of the ‘60s and ‘70s to the reality of 21st century technology.
RTW CPCA Show: AWP Discusses Whelen Engineering Project Success
At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.
Experts Discussion with John Talbot, Tramonto Circuits
For this first issue of Flex007 Magazine, we interviewed John Talbot, president and owner of Tramonto Circuits. Headquartered in metro Minneapolis, Minnesota, Tramonto manufactures flexible and rigid PCBs for a variety of industry segments. Editors Andy Shaughnessy, Patty Goldman and Stephen Las Marias asked John to discuss the challenges and opportunities in the world of flexible circuits, and some of the trends he’s seeing in this market.
Experts Discussion: The Flex Technologists Speak
For our first issue of the Flex007 Magazine, we invited a group of flexible circuit experts to discuss their work in this rapidly growing segment. Participants included Jonathan Weldon of DuPont, Mark Finstad of Flexible Circuit Technologies, and Scott McCurdy and Scott Miller of Freedom CAD. In a free-wheeling discussion with Andy Shaughnessy and Barry Matties, these technologists share their thoughts on the challenges and opportunities in flexible circuits, as well as what constitutes the cutting edge of flex right now.
Process Control for HDI Fabrication
A subject that gets very little discussion but is essential to the HDI process is automation. That is, the control of chemical concentrations in our many PCB processes and, especially, those that have been mechanized and can change very rapidly. HDI is one of those series of processes where control is the key to high yields.
ACE’s AccuWrap Simplifies Multiple Sequential Laminations with Blind Vias
At DesignCon 2018, I spoke with James Hofer, general manager for Accurate Circuit Engineering, a quick-turn fabricator based in Santa Ana, California. James gave me a preview of AccuWrap, a new type of processing technology that lets designers reduce the amount of copper during sequential laminations while still meeting IPC specs, which should be of great interest to RF designers.
Drilling and Routing Machines: Taking Control
Once driven by hardware, the controller industry for PCB drilling is now one being driven primarily by software, so says Holger Dornau, of SIEB & MEYER. Barry Matties sat down with Holger at the CPCA show in Shanghai to discuss CNC drilling and routing machine controllers and why It's becoming more and more important for fabricators to consider.
Automotive, the Electronics Industry’s New Driver
The automobile industry is becoming a combination of most of the traditional electronics segments: It’s a consumer product with a computer, communications center, and a few medical monitoring-type tendencies (measuring your alertness, heart rate, etc.), all rolled (no pun intended) into one incredible machine that is influencing our industry as none other.
Autonomous Transportation: Using Disruptive Technologies to Create Social Disruption and Change
Those of us who have been driving for the last 50−60+ years have seen great change. At first, it was slow; we went from manual shift to automatic shift transmissions, then we started adding simple things such as FM radio (yes, that was a premium add-on in the early ‘60s), then air conditioning and power windows, fuel injection, cruise control, airbags, and in the last decade everything from GPS to LED lighting to automatic speed and distance control, back-up and surrounding cameras and so much more.
Unimicron Germany Rises from the Ashes with New Smart Factory
This is a review of the grand opening of Unimicron’s new smart factory in Geldern, Germany. A fire in a PCB shop is an experience we all dread, but still it happens, and the consequences can be devastating. In the early hours of December 28, 2016, the innerlayer production plant at RUWEL International in Geldern, Germany, caught fire and the whole factory and its contents were destroyed.
Schmid Looks to the Future for Industry 4.0 and More
I met with Rüdiger Lange, CSO at Schmid Group, in their spacious, comfortable booth at productronica. We discussed the current capital equipment market and Schmid’s business direction for the future while watching some of their new technology in action.
SHOW & TELL: Bringing STEM Students to IPC APEX EXPO for a View of the Industry
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
Setting the Record Straight: CEO Asher Levy on the Future of Orbotech
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.