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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/22/2021 | Nolan Johnson, I-Connect007
Your Greatest Competition is Yourself
01/20/2021 | Barry Matties, I-Connect007
What’s Driving Price Increases for CCL and Prepreg?
01/20/2021 | Mark Goodwin, Ventec International Group
MivaTek’s New Technology and Market Drivers
01/19/2021 | Nolan Johnson, PCB007 Magazine
Bruce Mahler Discusses Ohmega Technologies' Acquisition by Arcline Investment Management
01/13/2021 | Nolan Johnson, I-Connect007
Book Review: Shawn Murphy’s ‘The Optimistic Workplace’
Happy workers are great workers. Workers with a purpose, a true reason for being at work and finding importance in that work, are all part of a successful workplace in a successful company.
The Sum of All Parts: Total Concept—Growing for the Future
Last month, we discussed the importance of the PCB industry’s need to focus on a “made in USA” philosophy. This month, we will go over how to methodically do this amid different company cultures and different logistical challenges.
A Conversation with Joe O’Neil, the New Chairman of the IPC Board of Directors
Joe O’Neil, formerly of Hunter Technology, recently stepped into the position of chairman of the IPC Board of Directors. I met with Joe at IPC APEX EXPO 2016 to discuss his new position, the industry, and the arc of his 20-year involvement with IPC.
IPC APEX EXPO: IPC Government Relations—Your Advocate in Washington
IPC's VP of Government Relations, John Hasselman, explains IPC's "meet the policy makers" initiative (site visits by congressmen) to help build and broaden relationships with these decision makers.
Martin Cotton Explains Ventec’s Plan for Growth
I always enjoy talking to Martin Cotton, global director of OEM technology and marketing for Ventec and a longtime PCB designer. I ran into Martin at DesignCon and asked him to discuss Ventec’s plans for the future and how he figured into the equation.
Book Review: Mark Goulston’s “Talking to Crazy”
We call know crazy. We all know people who are somewhat irrational or even completely bonkers! But we don’t know how to deal with them, right? Well, put that in the past tense. We did not know how to deal with them until this new book came along.
IPC President John Mitchell on the Past, Present, and Future, Pt. 2
In Part 2 of our on-the-show-floor interview with John Mitchell, conducted at IPC APEX EXPO 2016, John continues describing IPC’s key measures, and then invites industry folks who are reading this to participate in a unique challenge—some might say experiment. The question is, will there be any takers?
The Importance of Choosing Equipment Suppliers Carefully and Investing in the Future
Burkle Process Technologies, a long-time PCB equipment supplier to high-end manufacturers in the world, is seeing their business continuing to grow despite the perceived slowdown in the industry in China. They ensure this by working closely with customers, making premium products to understand future technology needs, and offering the highest quality in laminating machines and technical support.
IPC APEX EXPO: EPTAC Updates on Soldering Committee Developments
Leo Lambert, vice president and technical director at EPTAC Corp., provides I-Connect007 guest editor Joe Fjelstad an update on some of the standard developments at IPC's soldering and assembly committee.
IPC President John Mitchell on the Past, Present, and Future, Part 1
We conducted this interview with IPC President John Mitchell on the show floor at IPC APEX EXPO to discuss the event, the changes on the IPC board, and the key metrics that IPC uses to measure their own performance and effectiveness. John also invites the industry to a unique challenge.
PCB Shops in Brazil: Are you Kidding Me?
Let´s face facts: Who would ever think of listening to an opinion about the PCB industry coming from someone in Brazil?
Happy’s Essential Skills: Failure Modes and Effects Analysis (FMEA)
Failure modes and effects analysis (FMEA) is a systematic process to evaluate failure modes and causes associated with the design and manufacturing processes of a new product. It is somewhat similar to the potential problem analysis (PPA) phase of the Kepner-Tregoe program.
Catching up with…PNC: Open House Planned for May
I’m a great believer in open houses. Any time customers and vendors get together to learn and talk about what they can do for each other it’s a good thing. That’s why, when I heard that PNC, in Nutley, New Jersey, planned to hold an open house on May 20, I wanted to learn more about it. So I called my friend Sam Sangani, the company’s owner, to learn more about it.
Karl's Tech Talk: Green Legislation and the Impact on Electronic Materials and Processes
In general, “green” and “environmentally friendly” refer to manufacturing that involves the replacement of toxic substances with less toxic materials, the elimination of materials or processing steps, less consumption of chemicals (i.e., more efficient or higher yield processing), reduction of water use, reduction of energy use, less space requirement (i.e., smaller equipment footprint), recycling, and on-site recovery of materials.
Williams and Beaulieu: Board Shops and CMs Must Communicate Better
Two well-known consultants in the PCB industry, Dan Beaulieu and Steve Williams, have joined forces to try to help close the divide between CMs and board shops. I recently sat down with them at IPC APEX EXPO 2016 to better learn about their strategy for bringing the two sides together.
ESI: Drawing on a Deep History to Create a Vision for the Future
I had an opportunity to sit down for a chat with ESI’s Vice President and General Manager Michael Darwin at the recent HKPCA show. Darwin shared some of the challenges that come with managing the culture of a 70-year-old company, and a little about where they plan to focus their efforts going forward.
IPC APEX EXPO: New Arlon Materials Address Design and Fab Challenges
Brad Foster, VP and general manager of Arlon, discusses some new laminates and pre-pregs that help designers and fabricators address a variety of challenges. He explains how Arlon works with customers to help them with stack-ups and other issues.
Weiner’s World: March 2016
Sellers of equipment at the Shanghai CPCA event complained of continued poor business. This was especially evident amongst those selling to firms building boards for phones and other portables devices as indicated below. However, not all reports were bad. Major fabricators such as Wu's in China, not dependent upon HDI or flexible products, stated that they were "satisfied" with their current business levels.
IPC APEX EXPO: Discussing the MacDermid-Enthone-OMG Integration
Guest Editor Dick Crowe talks with Strategic Account Manager Tom Bell about their newly formed company, MacDermid Enthone Electronic Solutions and what customers can expect to see, including a larger team in the field for service.
Catching up with…Fastrak Manufacturing’s Phil Guzman
Fastrak Manufacturing is one of those companies that focus on solving problems, tough problems, problems that other companies cannot solve. Technically a contract manufacturer, Fastrak is much more than that, working with companies who have an engineering/manufacturing problem to solve, or with inventors trying to get a new product developed, manufactured and out to the market in a limited amount of time.
Francis Tsoi on the Future: What's in Store for Technology, Automation in China's PCB Industry?
I caught up with Francis Tsoi, CEO of World Wide Group whilst at CPCA in Shanghai recently, where we enjoyed a lively discussion on a number of critical topics surrounding China’s PCB industry: namely, what is on the horizon with regard to technology and automation?
Walt Custer Elaborates on his Annual IPC APEX EXPO Forecast Presentation
IPC APEX EXPO 2016 has come and gone, and this year, Walt Custer’s annual presentation forecasting the upcoming year for the industry was much anticipated, as always. I met up with Walt at the show to learn about his presentation and dig deeper into his findings.
IPC APEX EXPO: Electrolube to Educate PCB Designers on Coatings
Phil Kinner, technical director of coatings for Electrolube, discusses a paper on condensation testing that he presented at IPC APEX EXPO, and his plans to educate PCB designers about conformal coatings to help them avoid problems during manufacturing.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4
All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).
Cost Saving Tips for PCB Fabrication
Money is the most common problem in any type of business, and many American companies are looking for ways to cut costs, but still make sure they turn a profit. They also want to ensure the quality of what they produce remains the same, or exceeds present quality, and in the electronics sector this is essential for staying in business.
IPC APEX EXPO: Insulectro's Newest Hire Discusses his Plans for Chemistry Group
Chris Hrusovsky joined Insulectro two days before this interview, but many technologists know him from his 30 years in the PCB industry. Hrusovsky discusses his career and the issues he plans to tackle as the new VP of sales for chemistry at Insulectro.
The Supplier View: An Interview with Hamed El Abd
I sat down with WKK’s Hamed el Abd at CPCA, where we discussed the show, the growing trend toward automation, as well as a few other topics, namely world politics and economics and how they relate to the PCB industry.
Dan Beaulieu's 'It’s Only Common Sense' Celebrates 500th Column
“We’d like to congratulate Dan on his 500th column,” said Publisher Barry Matties. “Dan is a strong advocate for smart business. We thank Dan and look forward to 500 more columns, and you can be sure that Dan will keep stirring the pot.”
Gene Weiner: Congrats to Dan Beaulieu on Column 500
Congratulations on achieving this milestone, Dan. Column 500 contains enough fodder for many months of discussion, investigation and recommendations.
PhiChem Open House a Success!
Delighted to be invited to an exclusive preview of the new PhiChem global headquarters and R&D centre in Shanghai’s Baoshan suburb, I joined the VIP group assembled at the PhiChem booth at the CPCA show, made welcome by PhiChem President Dr. Jin Zhang.
IPC APEX EXPO: How Entelechy Is Changing the Industry
Mehul Dave, CEO of Entelechy Global Inc., talks about the need for speed in front-end engineering as PCB fabricators are overwhelmed with overload from supporting the high-mix, low volume and QTA markets.
Lean Manufacturing and NPIP for Flexible Circuits
Many companies are familiar with lean manufacturing concepts and have successfully used these techniques to improve manufacturing processes. Lean techniques, while most often used in printed circuit fabrication and assembly operations, can also be applied to nonmanufacturing processes. One such process is new part number introduction (NPIP).
IPC APEX EXPO: Gardien Discusses Providing Test Solutions with an Integrated Partnership
Gardien's VP of Quality, Todd Kolmodin, tells Guest Editor Dan Beaulieu about their customer partnership program, helping to provide solutions to their customers' test and quality issues.
IPC APEX EXPO: Rethink Robotics Provides a Glimpse into the Future of Electronics Assembly Industry
Carl Palme, applications product manager at Rethink Robotics, discusses with I-Connect007's Stephen Las Marias the impact of robotics, and its future, in the electronics assembly industry.
IPC APEX EXPO: Design Through Box-Build Strategy Works for PNC Inc.
Guest Editor Dan Beaulieu talks with PNC's production manager, Bhavesh Sangani, about PNC's "design through box-build" strategy along with their significant capital equipment purchases over the past few years for both PCB fabrication and assembly.
IPC APEX EXPO: IPC's Fern Abrams Provides Updates on RoHS, REACH Directives
Fern Abrams, director of regulatory affairs and government relations at IPC, discusses with I-Connect007's Stephen Las Marias the latest updates on the changes happening in the RoHS and REACH directives this year, as well as IPC's new initiatives and advocacies.
IPC APEX EXPO: Innovation in Surface Finishes from Uyemura
Uyemura Senior Strategic Account Manager John Meyers describes the company's innovation in surface finishes, particularly its ENEPIG chemistry. John also briefly discusses their new electroless copper process.
Punching Out! Putting Together the Deal Team
When preparing to sell, remember the old saying, “He who represents himself has a fool for a client.” While many owners might be tempted to go it alone, in my experience it pays to have a deal team to help prepare a company (and the owner) for a sale.
On Site at the CPCA Show 2016 International PCB Technology and Information Spring Forum
The first session of the CPCA Spring Forum 2016 was dedicated to UL Consumer Technology who took the opportunity to inform the audience around their exciting new services.
Patricia (Patty) Goldman Inducted into IPC Hall of Fame
We at I-Connect007 are thrilled that our own Patty Goldman has been awarded the highest level of volunteer recognition that IPC can give to an individual, the Raymond E. Pritchard Hall of Fame Award. The award is given in recognition of superior achievement, extraordinary contributions and distinguished service to IPC and the advancement of the electronics industry.
Happy’s Essential Skills: Design of Experiments
Design of experiments (DOE) is one of the most powerful and influential engineering tools for product yield improvements, new products or processes development, or for problem solving. As mentioned in my last column, process problems led me to a career in printed circuits, and quickly solving those problems led me to a bonus stock award and a great life. Even though I knew nothing about printed circuit manufacturing processes, I was able to quickly find the root causes of all the problems and fix them. My secret? Total quality control (TQC), statistics, and DOE.
Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life
In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.
IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials
Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks. The paper looks at high-frequency offerings from a variety of materials providers.
Rex Rozario, Part 3: The Future Beckons
In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?
Rex Rozario, Part 2: The Beat Goes on: New Developments at Exeter, the Music Scene, and China
In Part 2 of I-Connect007’s multi-part interview with PCB industry icon Rex Rozario, we continue to discover more about what has made Graphic PLC the company it is today. Rex explains the work they’re doing with Exeter University, Graphic’s success in China, and his own personal experience in the UK music scene.
Rex Rozario: The PCB Industry’s True Renaissance Man
In this exclusive multi-part interview that was conducted recently, I-Connect007's Barry Matties will introduce you to all of the people that Rex Rozario is, and where he, his team, and Graphic PLC are headed to next.
World Wide PCB on the “Purification” of the China Market, Industry Changes and More
Francis Tsoi of World Wide PCB Equipment tells Barry Matties that although growth in the China PCB market may be slowing, the government has used this time to transition the industry towards automation, better environmental regulations and the ability to make high-end PCBs in large volumes.
All About Flex: Three Emerging Trends That You Can Bet On
Flexible circuits are light weight, require minimal space, can be bent into “origami” shapes for adoption to a wide range of applications. These utilitarian features give electronic designers endless options for the new and exciting products that will soon become part of our everyday life.
Manufacturing Institutes Can Boost the Nation
In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years.
Beyond Design: Faster than a Speeding Bullet
In optical communications, electrons don’t carry the signal—photons do. And we all know that photons travel at the speed of light. So surely, optical fibers must transmit information much faster than copper wires or traces on a multilayer PCB? Actually, photons and electrons transmit data at the same speed. The limiting factor is the relative permittivity (dielectric constant) of the medium in which the signal propagates.
The Sum of All Parts: The Cost of Quality
Throughout the decades, irrespective of industry or sector, markets have thrived on competition. They have, however, also relied upon some semblance of unity within their respective competitors. Industries rely upon their individual member companies’ ability to work together for the greater good.
The Institute of Circuit Technology Tewkesbury Seminar, 1st March 2016
The Annual General Meeting of the Institute of Circuit Technology (ICT) was held at Puckrup Hall, near Tewkesbury in Gloucestershire, England, on 1st March 2016, and was followed by a well-attended evening seminar with presentations on a novel laser-induced deposition process, an analysis of the market for PCBs, and a review of three development projects in which the Institute had participated. The programme was introduced and moderated by ICT Technical Director Bill Wilkie.
It’s Only Common Sense: Your Ads Need a Call to Action!
Do you advertise? Do you spend your hard-earned dollars trying to get your name out there, only to feel that you are just throwing your money down a rabbit hole? I bet your ads don’t promote anything that will get your customers to take action. Your ads should include a call to action.
Solder Mask for LED Applications: Formulation 101
In 2007, the United States passed legislation to phase out the manufacture and trade of incandescent light bulbs, the EU following passed similar legislation in 2009. The rest of the world has been following suit creating a huge opening in the lighting market for a technology to fill the gap.
Printing PCBs…In Your Office!
The days of producing a PCB prototype with a 3D printer may not be as distant as you think. I spoke with Simon Fried of Nano Dimension about how 3D printing is becoming a reality, and how this disruptive technology will change the way designers produce rapid prototypes.
Camtek Takes Inkjet Technology into the Future
I recently spoke with Amir Tzhori, vice president of the PCB (AOI) division of Camtek in China, about the current and future status of their solder mask and legend inkjet technology, Gryphon. Also, with automation so instrumental, we discussed a new automated robotic arm that can be attached to their AOI systems.
Gene Weiner discusses PhiChem's upcoming open house event at its global HQ and R&D center in Shanghai during SEMICON China 2016, CPCA 2016 and productronica China 2016. He also focuses on the IPC Ambassador Council's plans to produce an executive forum in conjunction with IPC APEX EXPO 2017, IPC's association with NextFlex, SEMI's launch of the ESiPAT SIG, and much more.
DuPont, Taconic and PFC Team Up For High-Speed Flex
At DesignCon, I sat down with three flex circuit specialists: Glenn Oliver of DuPont, Tom McCarthy of Taconic, and Steve Kelly of PFC Flexible Circuits. Our discussion covered a lot of territory, most notably the findings they described in the paper they were about to present later that day at DesignCon, and the future of flex, as they see it.
Copper Via-Fill Technology in Development
The use of via-in-pad technology is increasing rapidly in today’s PCB designs. The need for miniaturization, combined with the rapidly decreasing pitch of component footprints, drives printed circuit board designers here. Via-in-pad requires the vias to be filled, planarized and then over-plated with copper.
It's Only Common Sense: Make a Cool Million
It's Only Common Sense: Make a Cool Million What if your new boss offered you $1 million if you could triple your sales in 12 months? That’s right. What if your boss told you that on top of your normal salary and commissions, you could earn a cool million dollars to increase your sales three-fold? What would you do that you're not doing now?
New Material and Process Solutions for the Electronic Interconnection Industry
The manufacture of electronics has, for the last several decades, followed a production script that has changed little over time. The vast majority of printed circuits are still being manufactured and assembled using materials and processes that the pioneers of the early printed circuit industry would easily recognize.
The Quiet Mainstreaming of HDI Manufacturing
Advances in technology continue to push the envelope of what’s possible. And nowhere has the impact of those advances been felt more profoundly than in the evolution of the current class of mobile devices. Although design engineers have driven this evolution, primarily through addressing market demand for new form factor innovation, the push to meet the associated manufacturing challenges has been responsible for a revolution in PCB manufacturing.
Enhancing Thermal Performance of CSP Integrated Circuits
In order to meet size and weight requirements, constraints of portable electronic designs often force PCB designers to reduce the size of components and PCB real estate area. To meet these demands, the use of CSP packages to shrink the PCB area needed is a common change in designs. As a result of the reduction of total PCB area, the available options to move heat and route high-power PCB traces is also reduced. Furthermore, the thermal performance cannot be matched when a QFN is compared to an equivalent CSP package.
Book Review: Meetings That Get Results
In this short but amazing book, Brian Tracy covers all types of meetings, from the large training sessions to the one-on-ones. He even describes how you should be sitting when having a one-on-one meeting (each of you at a corner of the table), how to get your point across, and how to listen.
Happy’s Essential Skills: Problem Solving
Related to TQC and a very important role of an engineer is solving problems. Using a problem solving methodology is a job that all engineers will use sooner or later, but if you are in product or process engineering in manufacturing, it will be sooner! This was the situation that introduced me to printed circuit manufacturing.
Punching Out: How to Sell Your PCB/Assembly Shop
You are thinking of selling your PCB or assembly shop. Perhaps you are contemplating retirement, you have no successors, and the thought of going to the office on Monday is driving you crazy. This column is designed to help your planning efforts. Future columns will go deeper into each subject.
Flex: Just What the Doctor Ordered for Medical Devices
Medical devices represent one of the fastest growing electronic markets in the United States. The drive for reduced space and weight, added functionality, and reduced cost has driven the adoption of a wide array of custom flexible circuits. The design freedom offered by this three-dimensional interconnect supports the packaging design requirements for a myriad of diverse applications within the medical electronic market.
Japan’s MicroCraft on the Japanese Market, Technology, and More
Soichiro Fujita of MicroCraft sat for an interview recently, in which we discussed what the current PCB market looks like in Japan, from a Japanese supplier’s perspective. Fujita also shared the company’s strategies for combating copycat machines, and even copies of the copycats, which includes a healthy dose of acceptance. He also shared what technology trends he sees moving forward.
25 Essential Skills for Engineers
The 25 engineering skills are just my opinion; they are what I have observed to be the essential tools that engineers, including myself, needed to complete a project, develop a product, meet a schedule, or solve a problem. These were the important skills that got me the promotion, or the opportunity for a challenging job.
Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2
In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.
Striving for One-Stop Solutions, Manz Eyes U.S. Market
I recently spoke with Frank Baron of Manz AG about their transition from Asia into the European and North America marketplace, and how their recent acquisition of KLEO Halbleitertechnik and their LDI technology has helped turn Manz into a real one-stop solution.
The Pinless Registration System, Explained by DIS’ Bernd Gennat
I sat down at productronica recently with Bernd Gennat, VP sales Asia and Europe for Duetto Integrated Systems (DIS Inc), for an overview of the industry, including his company’s technology. Our discussion touched on trends in multilayer registration, market requirements in Europe compared with those in China, and the benefits of pinless over hard-tooled registration systems for current and future rigid, flex and flex-rigid constructions.
High-performance laminates are characterized as base materials that in one or more aspects exceed the performance of FR-4, CEM, or paper/phenolic laminates. In this article, Karl Dietz talks about the different types of laminates, their dielectric requirements, and how they are being manufactured.
Justifying the Need to Outsource Design Work
Mehul Dave and H.D. Shreenivasa of Entelechy Global discuss the many benefits of outsourcing and why it should not be thought of as a four-letter word. They also talk about the huge gap between design and manufacturing, and how their company can help customers address that issue.
What a Difference a Year Makes: Voxel8 and the 3D Printing Pioneering Spirit
At CES in Las Vegas in January, Dan Feinberg and I met with Michael Bell, co-founder of 3D printing company Voxel8, to get an update on their developments of the past year, where he sees the company going in the future and whether rapid prototyping might be a valid application for their machines.
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