Beyond Design: Stackup Planning, Part 3
Following on from the first Stackup Planning columns, this month’s Part 3 will look at higher layer-count stackups. The four- and six-layer configurations are not the best choice for high-speed design. In particular, each signal layer should be adjacent to, and closely coupled to, an uninterrupted reference plane, which creates a clear return path and eliminates broadside crosstalk. As the layer count increases, these rules become easier to implement but decisions regarding return current paths become more challenging.
Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics?
For the past several decades, modern cars have not changed much. They have four wheels, an engine, a radio (possibly even an 8-track) and seatbelts. Over time, however, cars’ electronics parts have evolved faster than any other part of a car with enhancements like power windows, power mirrors, seat heaters and GPS navigation.
Characterization of PCB Material & Manufacturing Technology for High-Frequency
Concepts like Industry 4.0, Internet of things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement—a considerable amount of data and increased data transfer rate. The aim of this paper is to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
Integrating with Gardien Group's Roland Valentini
Gardien Group is one of those companies that are always looking out for their customers. The company is, without a doubt, the last word when it comes to bare board quality assurance, focused on helping customers deliver the most electrically sound boards in the business. Gardien’s technologists are experts at testing and other quality assurance disciplines. For more than 30 years, Gardien has been in the business, originally as the equipment manufacturer Mania.
Improved Design of Dry Film Resist Laminator for Optimal Transfer of Micron-sized Features
Since the inception of dry film lamination, the process of squeezing two hot rolls at their end axis points has caused roll bending. An innovative process has now been developed whereby the film is attached with a process that minimizes this issue and provides optimal, evenly dispersed heat and pressure across the entire surface of the panel. This simple and elegant design will ensure that the integrity of the resulting image will be ideal, as measured by the continuity of the resulting transferred traces and features.
Karel Tavernier: The Gerber Guide
It is possible to fabricate PCBs from the fabrication data sets currently being used—it's being done innumerable times every day. But is it being done in an efficient, reliable, automated and standardized manner? At this moment in time, the honest answer is no, because there is plenty of room for improvement in the way in which PCB fabrication data is currently transferred from design to fabrication.
Plating and Quality are Close Partners
A good plating manager is a seasoned veteran with many years of hands-on experience and probably an engineering degree. Bob Tarzwell sees firsthand how PCB manufacturers, without the proper plating shop set-up operations, knowledge and experience, adapt and accept poor practices as normal while they continue with poor quality processes—even after attempted corrective input from vendors and consultants.
The War on Process Failure
Who out there thought of it as a war? Is it? Well, we think it is—and a never-ending one at that. In fact, we thought it significant enough to devote all three of our August issues to the subject, because no matter how good you are or how great things are running, Murphy’s Law is right there, ready to take you down a peg or two—or worse.
Supply Chain Challenges and Opportunities
Let’s start by defining exactly what a supply chain is. It’s not a nautical term for an anchor chain, or a dynamic part of a chainsaw that never runs out of chain. No, it’s a key term used in the organization of resources which may form a system between entities. Now this sounds a little closer to something that may be utilized in producing an electronic end-item, in our case, a printed circuit board.
Gary Ferrari Shares His Thoughts on PCB Design and More
Recently, I spoke with Gary Ferrari, director of technical support at Firan Technology Group, about numerous topics related to PCB design. Our conversation ranged from CID training to the need for reaching high school students as a way of introducing more young people to career opportunities in our industry. We also covered strategies for helping customers design and build better product, and keeping designers provided with the most critical part of their supply chain—information.
The Drive for Transparent Circuits
DKN Research develops many types of unique electronic circuits. Some products in our portfolio include ultra-thin conductor circuits as small as 0.2 microns, metal-free circuits, and some circuits up to 20 meters long. Our staff fields many inquiries for packaging of new electronic devices. Lately, there is a lot of interest in transparent flexible circuits. The increase in interest is driven by the recent market expansion of display and optical devices.
The Keys to Success for Supply Chain Management
This article describes the key components and issues regarding achieving supply chain management success, offers some suggestions and action items mostly for customers to store in their memory banks. It also explains key partner relationships and how they must work to gain each other's confidence. When it comes to results, the most important requirement is the product. When a distributor is awarded a tier one product from a tier one supplier, 50% of the goal has been accomplished.
Supply Chain in the 21st Century
The shift away from vertical integration has pushed the topic of supply chain management to the forefront of strategic planning for many manufacturers. This wide-ranging article talks about supply chain management, a brief history of supply chain innovation, managing supply chain risk, as well as presents the "7 Rights" of supply chain management.
Design and Manufacture of High-Voltage Electronics
This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.
Eliminate Connectors with Sculptured Flex
Any time you eliminate a component, hidden costs are eliminated, such as the cost of stocking, tracking and managing the supply chain for that part number. When designing an electronic package, don’t assume that you need a component for every connection point. Sculptured flex will give some options that can make your electronic package, lighter, less costly, more reliable, and take up less space.
A Well-Designed Laminate Supply Chain has to Own It!
Suppliers must use industry knowledge, robust systems, clever software and total visibility to build a supply chain agile enough for any PCB fabricator. Consigned stock, local customization, regional hubs, short manufacturing cycles, controlled processes and highly evolved systems are just a few of the tools needed to develop custom fit solutions that flex and move with the needs of the fabricator and their customers. You can only design the supply chain when you own the supply chain.
An Update on the Rogers Material Supply Line
As part of a recent I-Connect007 supply chain survey, we found that RF laminate material can be very difficult to obtain. Rogers Corporation was named specifically in our survey as one supplier with a limited amount of material available. In fact, their delivery time was reported as being as high as 55 days for some materials at one point. In an industry where quick turnaround time is critical, this is one supply line that killed any hope of being quick.
The Past, Present, and Future of IPC-A-610
To understand the ultimate power of IPC-A-610, you need to first understand what is at the core of this standard. IPC-A-610 is a collection of visual quality acceptability requirements for electronic assemblies. It is utilized as a post-assembly acceptance standard to ensure that electronic assemblies meet acceptance requirements.
“Supply Chain Management”: Overused, Underused or Just Misunderstood?
In a world of buzz words, "supply chain" and "supply chain management" have certainly been right up there in our industry. Everyone sort of knows what the terms mean, or at least what they want them to mean. Everyone has assigned their own level of importance and interest to the idea of supply chain management, so it made perfectly good sense for us to highlight that subject in our July issues.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
TTM: Consult Fabricators Early for PCB Designs
Recently, I attended the Designers Council “Lunch and Learn” at Broadcom’s office in Orange County, California. One of the speakers at this event was Julie Ellis, a field applications engineer with TTM Technologies. She sat down with me to discuss her presentation and some of the ways fabricators can assist PCB designers.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
Kelly Dack Discusses His Recent Move
Dan Beaulieu has known the Prototron staff for years, and worked with them for a number of years as well. So, when he heard that they had hired Kelly Dack, a longtime PCB designer and guest editor for PCBDesign007, Dan wasted no time meeting with Kelly to talk about his new position, the future of PCB design, and the nascent interest millennials are showing in the PCB industry.
Catching Up with Vector Fabrication’s Quang Luong: Here Comes Vietnam!
I have known Quang Luong, the owner of Vector Fabrication, for many years now, and I have always been interested in his business and how it operates, especially since he is the only PCB shop owner I know of who has a company in the U.S. and in Vietnam.
Institute of Circuit Technology 41st Annual Symposium
ICT Technical Director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of Circuit Technology Annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in Dudley, in the West Midlands of England, home of the original Industrial Revolution.
A Review of the Opportunities and Processes for Printed Electronics (Part 1)
As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.
How to Make Mass Lam Outsourcing Successful
For PCB manufacturers in the United States and Europe, finding a suitable mass lam-outsourcing partner can be a challenge. In this interview with Option Technologies, a Ventec International Group company, I-Connect007 Technical Editor Pete Starkey and Option Managing Director Steve Law discuss the ins and outs of this specialist market.
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.
A New Source for Laser Drills
Publisher Barry Matties recently visited the West Coast offices of Nano System Inc. to catch up with Sam Sekine, formerly of Hitachi. Nano System is a new company focused on producing and selling laser drill systems to the PCB industry. In this interview, Mr. Sekine discusses his staff, the company’s technology, and Nano System’s strategy for the future.
A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex
Conventional electroless copper systems often required pretreatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering. To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector of the printed circuit industry.
New Embedded Component Standard Finalized
Solberg Technical Consulting's Vern Solberg talks to I-Connect007 about the recently launched standard, the IPC-7092, which focuses on embedded component technology. According to Solberg, this new standard took the earlier standards involved with passive devices, and combined it with standards on newer technologies using active devices, to help form components that can be manufactured and placed on layers within the PCB.
eSurface Breaking Down Barriers for Murrietta
Murrietta Circuits is the first facility in North America successfully processing PCBs made with the eSurface technology. Andy Murrietta talks with Guest Editor Judy Warner about the key benefits, including greatly improved line geometry, trace tolerance, and peel strength.
Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process
Microfill through-hole fill electrolytic copper is a new process designed to offer outstanding through-hole fill, particularly for substrates intended for use as core layers in build–up applications, producing planar, solid copper plugs in high-volume production plating equipment. This article describes a novel copper through-hole fill electroplating process designed for use with insoluble anodes and direct current (DC) rectification.
Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
ENEPIG: The Plating Process
In this article, George Milad talks about the complexity of the ENEPIG process, how it works, its requirements and the critical parameters that must be maintained in the ENEPIG line. He writes that shops that have good engineering and documentation of the manufacturing process, coupled with a dedicated, experienced ENEPIG operator that is backed by a capable analytical laboratory, run defect-free ENEPIG day in and day out.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.