Show & Tell: IPC APEX EXPO 2018 Opening Keynote Review
The first keynote speech of IPC APEX EXPO 2018 was presented by Jared Cohen, head of Google’s Jigsaw team of engineers, researchers, and geopolitical experts. He explained that Jigsaw builds products not only to tackle global security challenges, but also to support free expression and access to information, especially in repressive societies.
Weiner’s World—March 2018
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
RTW IPC APEX EXPO: Bowman—XRF Equipment, New IPC 4552A Spec, and How They Go to Market
Tom Leone, president, and Zach Dismukes, sales and support engineer from Bowman, discuss their XRF equipment, the new IPC 4552A spec, and how they go to market.
Institute of Circuit Technology Meriden Seminar, 2018
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.
Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
Still Using 1980s Formats for Design Data Handoff?
The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.
The Time is Right in India
In an interview with Akshinthala Vijayendra of IPC India, he discusses India’s infrastructure under the direction of the new prime minister, where India currently stands versus China, and the pros and cons for any speculative companies deciding whether to expand into this country.
New Year, New Equipment—Right?
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.
Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
Who Really Owns the PCB Layout? Part 2
In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.
CFX: Updates and Developments
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.
The Best It’s Ever Been, Every Year: The Goal for IPC, Part 2
In the continuation of this interview, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.
The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1
The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.
A Sneak-Peek at IPC APEX EXPO 2018
IPC President and CEO John Mitchell gave I-Connect007 a sneak-peek at the upcoming IPC APEX EXPO, happening in February in San Diego. Mitchell provides a description of this year’s keynote, as well as a few new additions and areas of emphasis. It looks like it will be another packed house, with plenty to see, do, and learn about.
Thermal Management Update with Doug Brooks
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
Mike Jouppi Discusses his Drive for Better Thermal Data
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.
Weiner’s World—December 2017
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
AGFA: From Film to Inkjet Solder Mask
The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.
Institute of Circuit Technology Harrogate Seminar 2017
A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.
RTW…HKPCA & IPC Show 2017 Highlights With Canice Chung
Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China.
A Conversation with EIPC Executive Director Kirsten Smit-Westenberg
The EIPC booth was a busy place during productronica, with several members and other organizations headquartered there, resulting in a constant stream of people stopping by to visit, get information and study the upcoming conference agendas. Overseeing the big, and even the little things, was Executive Director Kirsten Smit-Westenberg, who made sure important questions got answered, people stayed hydrated, and EIPC’s magnetic pins found homes on shirt collars.
The PCB Norsemen: Industry 4.0, AI and CircuitData
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
IPC Status Update: Training, Standards, and More!
At the recent IPC Fall committee meetings that are co-located with the SMTA International conference and show, IPC’s president and CEO, John Mitchell, sat down for a chat with me for an update on what’s happening at IPC.
Update on IPC’s Validation Services and Hints of What’s to Come
SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.
Patty's Perspective: (Signal) Integrity for All
Our topic this month is signal integrity, certainly a common one in our industry. Signal integrity is achieved by controlling impedance, so my advice is to do that. There, I’m done. Just kidding…of course I’m not done. But if you are in PCB manufacturing and you think this is just a design problem and doesn’t concern you, please think again.
Hamed El-Abd: A New Beginning, Part 1
While in China recently, Barry Matties joined longtime I-Connect007 friend and contributor Hamed El-Abd of WKK to congratulate him on his upcoming retirement. They reflected on his time spent in the industry, specifically in China, how far it’s come, and where it might be headed next.
Stephen V. Chavez Talks Mil/Aero PCB Design
Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.
IMPACT Interview: Anaya Vardya, American Standard Circuits
I-Connect007's Patty Goldman spoke with Anaya Vardya, president and CEO of American Standard Circuits, a few days after the conclusion of IMPACT, especially wanted his views as a first-timer there.
IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations
This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.
The Skills Gap – Meet People Where They Are!
A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
Help Wanted With IMI’s Peter Bigelow
In preparation for this month’s topic, especially what companies in our industry are currently experiencing when it comes to finding and hiring the right people, I sought out Peter Bigelow, president and CEO of circuit board fabricator IMI Inc. We spoke in February at IPC APEX EXPO.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
Innovating in the Technology of Stretchable PCBs
Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.
Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017
Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.