Lost your password?
Not a member?
Resend confirmation instructions
Sort By Category
- New Technology
- Printed Electronics
- New Products
- Test & Inspection
- Fabrication Process
- IPC Standards
- From The Show
- PCB Fabricator
- Market Impact Content
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/20/2022 | Andy Shaughnessy, I-Connect007
Technica Heats Up ROI Discussion
05/17/2022 | I-Connect007 Editorial Team
PCB Technologies’ InPack to Focus on Miniaturization, Packaging
05/16/2022 | Andy Shaughnessy, Design007 Magazine
EIPC Technical Snapshot: Supporting Autonomous Driving
05/12/2022 | Pete Starkey, I-Connect007
FIRST: Endorsed by Teachers and Students Alike
05/11/2022 | Barry Matties, I-Connect007
Gary Ferrari Shares His Thoughts on PCB Design and More
Recently, I spoke with Gary Ferrari, director of technical support at Firan Technology Group, about numerous topics related to PCB design. Our conversation ranged from CID training to the need for reaching high school students as a way of introducing more young people to career opportunities in our industry. We also covered strategies for helping customers design and build better product, and keeping designers provided with the most critical part of their supply chain—information.
The Drive for Transparent Circuits
DKN Research develops many types of unique electronic circuits. Some products in our portfolio include ultra-thin conductor circuits as small as 0.2 microns, metal-free circuits, and some circuits up to 20 meters long. Our staff fields many inquiries for packaging of new electronic devices. Lately, there is a lot of interest in transparent flexible circuits. The increase in interest is driven by the recent market expansion of display and optical devices.
Material Witness: The Use of Fillers in Composites
The use of finely divided ceramic fillers in composites intended for use in printed wiring boards has a long history, but most people still associate the idea with reducing the cost of the product by loading it with an inexpensive inert filler. Nothing could be further from the truth...
The Keys to Success for Supply Chain Management
This article describes the key components and issues regarding achieving supply chain management success, offers some suggestions and action items mostly for customers to store in their memory banks. It also explains key partner relationships and how they must work to gain each other's confidence. When it comes to results, the most important requirement is the product. When a distributor is awarded a tier one product from a tier one supplier, 50% of the goal has been accomplished.
Accomplish Change Together (ACT)
Shifting strategies for selling PCBs and the materials to build them is the impetus for ACT. Insulectro's Ken Parent and Jason Marsh spoke to I-Connect007 Publisher Barry Matties about the ACT approach—and how it is helping their PCB fabricator customers increase sales and OEMs to get better products.
Agricultural Drones and Flexible Circuits
Agricultural drones are expected to have a significant impact on farming over the next few years. In the article mentioned above, the drone’s ease of use and affordability make this a tool that virtually every farmer could employ. One major complementary technology to the drone is the advances in imaging technology and analysis. Specifically, the agricultural drone gives farmers data analysis capability that they have not had before.
Supply Chain in the 21st Century
The shift away from vertical integration has pushed the topic of supply chain management to the forefront of strategic planning for many manufacturers. This wide-ranging article talks about supply chain management, a brief history of supply chain innovation, managing supply chain risk, as well as presents the "7 Rights" of supply chain management.
Design and Manufacture of High-Voltage Electronics
This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.
Eliminate Connectors with Sculptured Flex
Any time you eliminate a component, hidden costs are eliminated, such as the cost of stocking, tracking and managing the supply chain for that part number. When designing an electronic package, don’t assume that you need a component for every connection point. Sculptured flex will give some options that can make your electronic package, lighter, less costly, more reliable, and take up less space.
IPC-A-610: What's New With Rev F?
Why are new revisions created anyway? Can’t IPC just issue updates to the existing revision? Who defines what the changes are going to be and who approves of those changes? Why can’t they make changes for all the new technologies available? And the best question of all: Why does my product have some conditions that are not covered in the documents and specifications? Leo Lambert explains.
A Well-Designed Laminate Supply Chain has to Own It!
Suppliers must use industry knowledge, robust systems, clever software and total visibility to build a supply chain agile enough for any PCB fabricator. Consigned stock, local customization, regional hubs, short manufacturing cycles, controlled processes and highly evolved systems are just a few of the tools needed to develop custom fit solutions that flex and move with the needs of the fabricator and their customers. You can only design the supply chain when you own the supply chain.
Coated Ultra-Thin Copper on Printed Circuit Laminates
Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.
An Update on the Rogers Material Supply Line
As part of a recent I-Connect007 supply chain survey, we found that RF laminate material can be very difficult to obtain. Rogers Corporation was named specifically in our survey as one supplier with a limited amount of material available. In fact, their delivery time was reported as being as high as 55 days for some materials at one point. In an industry where quick turnaround time is critical, this is one supply line that killed any hope of being quick.
Innovative Technologies Drive PCB Industry Growth
PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of RMB 576 billion (USD 93.8 billion).
Rigid-Flex PCB Right the First Time--Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.
The Past, Present, and Future of IPC-A-610
To understand the ultimate power of IPC-A-610, you need to first understand what is at the core of this standard. IPC-A-610 is a collection of visual quality acceptability requirements for electronic assemblies. It is utilized as a post-assembly acceptance standard to ensure that electronic assemblies meet acceptance requirements.
“Supply Chain Management”: Overused, Underused or Just Misunderstood?
In a world of buzz words, "supply chain" and "supply chain management" have certainly been right up there in our industry. Everyone sort of knows what the terms mean, or at least what they want them to mean. Everyone has assigned their own level of importance and interest to the idea of supply chain management, so it made perfectly good sense for us to highlight that subject in our July issues.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
TTM: Consult Fabricators Early for PCB Designs
Recently, I attended the Designers Council “Lunch and Learn” at Broadcom’s office in Orange County, California. One of the speakers at this event was Julie Ellis, a field applications engineer with TTM Technologies. She sat down with me to discuss her presentation and some of the ways fabricators can assist PCB designers.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
Book Review: Brian Tracy’s “Business Strategy”
If you’re serious about your company’s strategic planning, this book is for you. And if you’re not serious, then you won’t be around much longer anyway. Pick up this little volume, the latest from The Brian Tracy Success Library.
Kelly Dack Discusses His Recent Move
Dan Beaulieu has known the Prototron staff for years, and worked with them for a number of years as well. So, when he heard that they had hired Kelly Dack, a longtime PCB designer and guest editor for PCBDesign007, Dan wasted no time meeting with Kelly to talk about his new position, the future of PCB design, and the nascent interest millennials are showing in the PCB industry.
Catching Up with Vector Fabrication’s Quang Luong: Here Comes Vietnam!
I have known Quang Luong, the owner of Vector Fabrication, for many years now, and I have always been interested in his business and how it operates, especially since he is the only PCB shop owner I know of who has a company in the U.S. and in Vietnam.
Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect
In this article, Joan Vrtis highlights the current and forward-looking interconnect technologies enabling the stream of amazing new smart wearable electronic devices connecting the user to their personalized experience.
Institute of Circuit Technology 41st Annual Symposium
ICT Technical Director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of Circuit Technology Annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in Dudley, in the West Midlands of England, home of the original Industrial Revolution.
A Review of the Opportunities and Processes for Printed Electronics (Part 1)
As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.
UK PCB Industry Leader Brian Haken Passes Away
Brian Haken helped steer the UK PCB industry to wider markets, forging close ties with the IPC in the United States and JPCA in Japan.
Flexible and Stretchable Circuit Technologies for Space Applications
This article describes two original technologies developed at imec-CMST--the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI)--and how they could be offering new form factors with increased functional density, as well as improved reliability in harsh environments .
The Composite Properties of Rigid vs. Multilayer PCBs
Most materials systems used in PWBs (aka PCBs) are composites of resins, fabric substrates and metal cladding. Each of these components has its own unique electrical and mechanical properties that contribute to the final characteristics of the finished laminates, prepregs and fabricated multilayer boards (MLBs). In most cases variables such as glass style and resin content have offsetting impacts on physical vs. electrical properties. Chet Guiles explains.
Revolutionizing Equipment Repair & Service
Guest Editor Steve Williams sits down with Randy Cook of CalTeks and Yash Sutariya of Alpha Circuits to talk about servicing equipment, especially foreign equipment not previously available in North America. With quality service now readily available, one can take advantage of considerably less expensive equipment being manufactured in China.
How to Make Mass Lam Outsourcing Successful
For PCB manufacturers in the United States and Europe, finding a suitable mass lam-outsourcing partner can be a challenge. In this interview with Option Technologies, a Ventec International Group company, I-Connect007 Technical Editor Pete Starkey and Option Managing Director Steve Law discuss the ins and outs of this specialist market.
Novel High-Performance Substrate for Stretchable Electronics
A cornerstone feature of any viable stretchable material is its ability to return to zero after stretching. This article talks about a new transparent, high-performance thermal setting stretchable material that could open doors to a range of new and innovative products.
Wearable Technology and Flexible Circuits
Flexible circuits are an ideal fit for wearable technology. Wearable electronics need to be light, dense and bendable. While what is currently considered standard flexible circuit technology is more than adequate for many the wearable products, there are requirements that may be pushing the boundaries a bit.
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.
A New Source for Laser Drills
Publisher Barry Matties recently visited the West Coast offices of Nano System Inc. to catch up with Sam Sekine, formerly of Hitachi. Nano System is a new company focused on producing and selling laser drill systems to the PCB industry. In this interview, Mr. Sekine discusses his staff, the company’s technology, and Nano System’s strategy for the future.
A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex
Conventional electroless copper systems often required pretreatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering. To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector of the printed circuit industry.
Flexible Circuit Materials for High-Temperature Applications
To meet the increasing needs for flexible circuit materials for high-temperature applications, new test methods will need to be developed. These new methods will assign new ratings that are consistent with actual performance.
How to Successfully Purchase PCBs
How do you go about purchasing reliable and durable PCBs at the lowest possible cost? A key success factor is to provide the prospective suppliers with accurate and clear specifications, and to keep a close eye on the quality of the boards once they are in production.
New Embedded Component Standard Finalized
Solberg Technical Consulting's Vern Solberg talks to I-Connect007 about the recently launched standard, the IPC-7092, which focuses on embedded component technology. According to Solberg, this new standard took the earlier standards involved with passive devices, and combined it with standards on newer technologies using active devices, to help form components that can be manufactured and placed on layers within the PCB.
HDPUG Demonstrates Benefits of Cooperative R&D
The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
eSurface Breaking Down Barriers for Murrietta
Murrietta Circuits is the first facility in North America successfully processing PCBs made with the eSurface technology. Andy Murrietta talks with Guest Editor Judy Warner about the key benefits, including greatly improved line geometry, trace tolerance, and peel strength.
HDPUG and High-Frequency Test Methodologies
CEO Brian Butler talks with Guest Editor Bob Neves about the HDP User Group, an industry consortium that is developing test methodologies and programs. Brian decribes three of the current subcommittees: Material Characterization; Back Drill, having to do with defect detection and reliability; and Copper Surface Roughness.
The Flex-to-Fit Approach
The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.
Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process
Microfill through-hole fill electrolytic copper is a new process designed to offer outstanding through-hole fill, particularly for substrates intended for use as core layers in build–up applications, producing planar, solid copper plugs in high-volume production plating equipment. This article describes a novel copper through-hole fill electroplating process designed for use with insoluble anodes and direct current (DC) rectification.
Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating
One of the three most fundamental aspects of printed circuit fabrication is the metallization and electroplating of throughhole vias and blind via interconnections. In this article, Michael Carano writes about the strategies in optimizing acid copper electrodeposition processes for high-throwing power DC plating.
ENEPIG: The Plating Process
In this article, George Milad talks about the complexity of the ENEPIG process, how it works, its requirements and the critical parameters that must be maintained in the ENEPIG line. He writes that shops that have good engineering and documentation of the manufacturing process, coupled with a dedicated, experienced ENEPIG operator that is backed by a capable analytical laboratory, run defect-free ENEPIG day in and day out.
Precision Back-drilling High-Speed PCBs? No Problem!
Grant Christiansen of Schmoll Maschinen discusses the latest developments for high-speed back-drilling, particularly for the North American market. He stresses the importance of both software and machine capability, along with working closely with the customer.
Polar Talks Impedance and Insertion Loss Testing
Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about controlled impedance and insertion loss testing.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
Flexible Circuits and UAV Applications
The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
The Future of Nickel in Nickel/Palladium/Gold Final Finishes
Final finishes can be subdivided into metallic and organic finishes. For the purpose of this article, the focus will be on the metallic finishes using the combinations of nickel (Ni) and/or palladium (Pd) and/or gold (Au). Variations on this theme are used extensively in the electronics market of today. The Ni/Pd/Au mutations are the inevitable result of technical requirement changes coupled with true and perceived acceptance within the industry.
IPC Plating Sub-committee 4-14: Surface Finish Specifications
IPC specifications are reference documents to be called out by designers and OEMs. Designers may take exception with one or more items in the specification to ensure that the product meets the requirements of its intended use. The acronym AAUBUS (as agreed upon between user and supplier) is part of any specification. Specifications are consensus documents. They are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses (CMs) and end-users. The IPC Plating Sub-committee 4-14 is no exception.
The Importance of Harmonized Standards that Benefit All
I-Connect007 Technical Editor Pete Starkey caught up with Amphenol applications engineer Sean Keating at IPC APEX EXPO. Keating explains his company’s commitment to proactive participation in the establishment of standards, his personal experience working on standards committees, and his view on the importance of harmonised global standards.
An Interview with Gardien Group’s Jason Fraser
Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.
Being Flexible in a Rigid World
With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.
IMPACT 2015: An In-Depth Look
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.
Advances in Electronics Assembly Technology - SMART Group Seminar Preview
In a preview webinar to introduce the upcoming SMART Group seminar where the latest advances in assembly technology and reliability will be discussed by industry and subject experts, SMART Group Technical Committee members Charles Cawthorne from MBDA and Ian Fox from Controls and Data Services summarized the papers to be presented.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
The Growing Role of the Added-Value PCB Distributor
Dan Beaulieu talks with Nesh Dholakia, president of Nujay. Value-add is not just for low-technology sourcing, but increasingly for high-technology multilayer as well as difficult-to-source technologies in low-cost areas domestically.
Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures
The HDI and substrate fixture technology is truly an art form. Long gone are the luxuries of just using a plated drill file on an old drill machine and automatically dropping pins. Even the multi-plate fixtures that are used today have no comparison to the critical manufacturing requirements of the HDI and substrate fixtures.
High-Density Interconnects: Enabling the Intelligence of Things
HDI layers and sub-composites with laser-drilled vias combined with stacked, copper-filled vias up to 16 layers have become the state-of-the-art in circuit design for the newest generation of mobile phones, wearable electronics, and IoT modules.
IPC Validation Services 2014
Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.
Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges
This article describes the recent challenges and developments in manufacturing ALV HDI technology to meet the needs for high volume, robust, reliable, and cost competitive solutions for electronic packaging.
A Conversation (and Day) with Joe Fjelstad, Part 5
Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.
Design Considerations: Flexible Circuit vs. Traditional PCB
The tactics for flexible circuit design don’t differ much from that of traditional PCBs. All of the typical specifications still apply and we add a few more things that require special attention. Cover layers require bigger openings than traditional solder mask, trace directions matter in the flex areas and miters should be round instead of angular.
A Conversation (and Day) with Joe Fjelstad Part 4
We continue the conversation as it turns to the more technically focused area of disruptive technology. The method Joe has been demonstrating for years now is one which is poised to offer dramatic increases in electronic reliability while decreasing overall cost through the elimination of solder--a cornerstone concept of what has been coined as Occam technology.
A Conversation (and Day) with Joe Fjelstad Part 3
In Part 3 of this interview series, Fjelstad divulges his interesting entry into the electronics manufacturing industry, including a brief diversion as a restaurateur. In this portion of the interview, the pair was touring the Evergreen Aviation and Space Museum (home of the Spruce Goose) where Fjelstad spoke frankly about his experience in Vietnam and how it has shaped his view about war, which he shares. Finally, the importance of education was discussed, as well as India, and why the rest of the manufacturing world should be paying attention to them.
A Conversation (and Day) with Joe Fjelstad, Part 2
In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.
A Conversation (and Day) with Joe Fjelstad, Part 1
I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.
Insulectro Alliance with Freedom CAD
Ken Parent, Vice President of Sales at Insulectro, recently sat down with I-Connect007 Publisher Barry Matties for a quick chat about the strategic alliance that Insulectro is pursuing with Freedom CAD. Parent explains how this new strategic effort is working, and what it means for customers--and OEMs.
Benefits of Buying Certified Rebuilt Equipment Over New
ETI's Eric Winkler tells Guest Editor Steve Williams about ETI's expansion to four locations worldwide. ETI not only rebuilds PCB equipment but also tests, guarantees, and installs it for their customers, some of whom provide wish lists.
Building a Better Solder Mask & Legend - Layer by Layer
Camtek's VP of Functional Inkjet Technologies Dr. Boaz Nitzan talks with Guest Editor Kelly Dack about inkjet printing solder mask and legend. The technology uses the actual image of the board being processed, which means misregistration is eliminated.
Drill & Routing Process Experts
Ofer Ton, president of FASTechnologies talks with Guest Editor Steve Williams about drill room automation and the associated cost savings and productivity improvements.
Copyright © 2022 I-Connect007. All rights reserved.