Latest Articles

Happy’s DIY Solution to Chemical Control

I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.

Understanding MIL-PRF-31032, Part 6

Concluding this six-part discussion on understanding the military printed circuit board performance standard MIL-PRF-31032, Anaya Vardya the remaining procedure required to address the unique requirements of the military.

Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

Heat cannot be efficiently exchanged with stagnant air surrounding a hot device; however, it can be transferred away from the electronic component to the PCB using thermal vias. A thermal via is a good conductor of heat that runs between the top layer and bottom layer of the PCB, dissipating heat through simple conduction. In simple terms, thermal vias are plated holes located under, or electrically connected to, a surface-mounted heat source on a PCB that allows heat transfer through the hole.

Pacothane on the Future of Laminate Technologies

Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.

ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges

The second day of the Electronic Circuits World Convention began with a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Technical Editor Pete Starkey has more.

Lorain County Community College’s Successful MEMS Program

The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Around the holidays, we often see a slowdown in PCB design and manufacturing news. But this holiday season, there’s been no rest for the newsmakers in our industry! In the last week, our daily and weekly newsletters have been chock-full of breaking news and up-to-the-minute technical information that readers like you rely upon every day.

Just Ask Tara Dunn: The Exclusive Compilation

We asked for you to send in your questions for Averatek’s Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. And if you’d like to hear more from Tara, be sure to view her Flex007 column series “Flex Talk.”

GreenSource Fabrication Creates Plating Flexibility

The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.

Stephen Chavez and Happy Holden on Designing Reliable Vias

Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

Just Ask Tara Dunn: Will IC Substrates Be Produced in Volume in the U.S.?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Well, it’s the last Friday in November. On any normal year in the U.S., this would be “Black Friday” because, for many retailers, the kickoff to the holiday season’s shopping spree is the source for most of the operating income for the year. While it remains to be seen how exactly how much traditional in-store and online retailing will rake in, with the varied pandemic lockdowns, it’s clear that readers wanted to get the latest electronics industry sales numbers!

Lee Ritchey Discusses His ‘Homemade’ NASA Board

In this audio interview, Lee Ritchey shares a story about his favorite PCB design—a board that he built on his kitchen table early in his career for a radio used on the Apollo 11 spacecraft. Lee explains how he ended up working on this design as a young engineer, as well as the excitement that he felt watching Apollo 11 land on the moon while carrying his PCB. He also jokes about why his wife was less than pleased with his handiwork when he drilled holes in the board on the kitchen table.

Our Thanksgiving Wish

As we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.

Catching up With QCMS General Manager Rick McAnally

Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.

Institute of Circuit Technology Technical Webinar

With its regular program of physical seminars and symposia on hold, the Institute of Circuit Technology went virtual and presented a webinar of three technical papers, organized by Technical Director Bill Wilkie and introduced by IPC Chair Emma Hudson. Pete Starkey brings you all the details.

IPS Expanding to Accommodate Growing Market

I recently had the opportunity to visit IPS in their Cedar City, Utah, facility, where Mike Brask, founder and president of IPS, shared his business strategy and gave me a tour of the expanding manufacturing facility. IPS produces a wide range of PCB manufacturing equipment, including plating, DES, VCM, VRPs, ventilation, and spare parts for older equipment.

PC Technological Advances in 2020

With CES quickly approaching, which is perhaps the largest technology event globally that is also going virtual this year, key component and sub-assembly companies are not waiting to announce their next generation of components. Dan Feinberg details new components and performance advances, as well as why you should consider building your own PC.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.

Just Ask Joe Fjelstad: The Exclusive Compilation

We asked for you to send in your questions for Joe Fjelstad, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from Joe, view his column series “Flexible Thinking.”

Tara Dunn Transitions to New Role at Averatek

I-Connect007 columnist Tara Dunn shares the exciting news about the transition from her role as president of Omni PCB to vice president of marketing and development at Averatek, where she will be working primarily with OEMs to break down the advantages of additive manufacturing.

HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention

Nolan Johnson speaks with Audrey Sim, executive director and vice president of operations for the Hong Kong Printed Circuit Association, about the upcoming Electronic Circuits World Convention, to be held November 30 through December 2, 2020. Ms. Sim gives Nolan an overview of the conference’s history, its scope as a printed circuit industry conference, and its shift to a hybrid virtual/physical format for 2020.

This Month in PCB007 Magazine: The Copper Foil Market Is Anything But Flat

Nolan Johnson interviewed Mike Coll, COO of Denkai America, about the copper foil and substrate market, the recent acquisition of the company by Nippon, and what they’re doing to respond to very small feature sizes.
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