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Real Time with… AltiumLive Europe: If You Don’t Know How It’s Made, How Can You Possibly Design It?

Designers attending the AltiumLive Europe 2020 Virtual Summit had the opportunity to see at first-hand how circuit boards were made to help them make informed design-for-manufacturing decisions. Pete Starkey details how Würth Electronik welcomed AltiumLive to its Niedernhall factory to take a virtual tour.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.

Northrop Grumman: 3D Nanomaterials May Counter Gaps in Additive Supply Chain

The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange. In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.

Real Time with… AltiumLive 2020: Early Communication Key to Success of OSV Project

Rob Cooke, director of engineering at Calumet Electronics, discusses his role in the Open Source Ventilator (OSV) project that yielded ventilator PCBs in record time. He and project partners, Dugan Karnazes of Velocity Research and Chris Denney of Worthington Assembly, recounted this story during a panel at the virtual AltiumLive.

Understanding MIL-PRF-31032, Part 4

Continuing with Part 4 of the discussion on understanding the military PCB performance standard MIL-PRF-31032, Anaya Vardya explains how the next step in the process is to create four new procedures to address the unique requirements of the military.

SMTA Additive TechXchange Keynote: An Outlook on Advanced PCB Fab

Organised as a virtual event by Lenora Clark of ESI Automotive and Tara Dunn of Omni PCB, SMTA’s Additive TechXchange addressed additive technology specifically in the context of the electronics industry. Pete Starkey details the keynote presentation, an outlook on advanced printed circuit board fabrication, from Jeff Doubrava, managing partner at Prismark Partners.

90% Solder Dross Recovery: Eliminate Waste, Save Money

The impact of 90% solder dross recovery can have a substantial impact on reducing waste and increasing cost savings. Nolan Johnson recently spoke with Jay Hardin, MS2® product manager at P. Kay Metal, about the process and benefits of efficient solder dross recovery, as well as product roadmaps, the soldering machine market, and raw materials supply chain for solder alloy manufacturing. As Jay says, “For many companies, the savings are in the thousands or millions” of dollars.

EIPC Technical Snapshot: Automotive Technology

Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

Real Time with… AltiumLive: Eric Bogatin on Unlearning What You’ve Learned

The second day of the virtual AltiumLive 2020 event got off to a great start with a class by Dr. Eric Bogatin. It was officially titled “You Must Unlearn What You’ve Learned,” but it could have just as easily been called “Designing Interconnect That Sucks Less.”

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Trade shows and technical conferences haven’t died; they’ve just moved online. The trade show season continues in virtual full force this week, and event coverage dominates the top five this week. Surprisingly, I don’t see events as this week’s theme. No, this week’s theme is “pundits.” We have Walt Custer’s industry outlook, seven experts on additive electronics, a designers conference keynote, and the IPC’s government relations expert. Don’t get me wrong: These folks are asked to speak to the industry for a good reason. They know their subject matter, and they present it skillfully. This week’s top five picks are worth reading.

This Month in PCB007 Magazine: The Acceleration or Deceleration of Change

Things have changed a lot in the last year, especially in the realm of technology. Just a year ago, 5G networks were on a smooth path to unquestioned rapid growth dominance. Today, while there has been much progress, and while there are some 5G capable devices available, it is far from universal. In some areas, such as near schools and residential areas, people were putting up roadblocks to 5G towers. Overall, there has been much progress, but the pace seems slower than was expected just a year ago. Some limitations are being identified, and there is already talk of 6G becoming available well before the end of the decade.

Just Ask Paul: Automotive and Lead-Free Solders

We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.

Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote

Nolan Johnson details TZero Co-founder Eli Hughes' keynote presentation titled “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” demonstrating how it takes cross-disciplinary thinking to truly innovate.

Real Time with… AltiumLive 2020: Würth Virtual Factory Tour

Since AltiumLive this year is a virtual event, coverage is limited to watching some of the presentations virtually. Dan Feinberg describes how he was pleasantly surprised with the quality and excellence of the Würth virtual factory tour.

An Update on Walt Custer’s EIPC Business Outlook Webinar

“We’re not out of trouble yet, but it’s a whole lot better than a couple of months ago.” Walt Custer’s business outlook update, with emphasis on the European electronics industry, attracted a capacity audience to EIPC’s webinar on October 2. Pete Starkey details how it wasn’t all bad news.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It’s showtime! This past week, we saw quite a bit of news about virtual trade shows. It’s great to see show managers pivot from live, in-person events to virtual shows with only a few months to make it all happen. How would you like to be a show manager today?

Real Time with… SMTAI 2020: Reflections on the Technical Conference

This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.

Combatting Thermal Challenges With TRM Software

Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

Real Time with… SMTAI 2020: Technical Conference Review

SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

My Experience at SMTAI 2020 Virtual

Denny Fritz shares his experience while attending SMTAI, concentrating on the exhibition portion of the virtual show. He also compliments SMTA on organizing and operating the virtual event.

Just Ask John Mitchell: The Exclusive Compilation

We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”

Real Time with… SMTAI 2020: SMTA Announces Members of Distinction Annual Awards

SMTA recognized exceptional individual and corporate members for their immeasurable contributions to the association since 1994. And while the SMTA International Technical Committee announced the best presentation and paper awards from the 2019 conference on March 18, 2020, recipients were also recognized at SMTAI 2020.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks. In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.

Stop Relating Trace Temperature to Current Density

Many design engineers and even many software suppliers make the significant mistake of equating changes in trace or via temperature with current density. This is incorrect at best and dangerous at worst. There is little if any correlation between temperature and current density. Current and trace dimensions (among other things) are the relevant variables, but current density is not. I hope by the end of this article you will see why. Here are four illustrations that will help you understand this.

Real Time with...SMTAI 2020: MacDermid Alpha’s Single-Step Metalization Paper

Nolan Johnson talks with MacDermid Alpha Electronics Solutions about a new process for filling through-holes with copper in a single step. Carmichael Gugliotti, the primary author and an applications specialist, and Richard Bellemare, director of electrolytic metalization, address why this new process matters and what’s in Gugliotti’s technical paper presentation for SMTAI.
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