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Just Ask John Mitchell: Emerging Engineers and Managers
09/22/2020 | I-Connect007 Editorial Team
Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?
09/21/2020 | I-Connect007 Editorial Team
I-Connect007 Editor's Choice: Five Must-Reads for the Week
09/18/2020 | Nolan Johnson, I-Connect007
This Month in PCB007 Magazine: The Pillar Roadmap
09/16/2020 | Nolan Johnson, PCB007
Introducing SMTA’s 2020 Additive Electronics TechXchange, Part 2
09/14/2020 | Nolan Johnson, I-Connect007
PCB :: Materials
Understanding Your Customers
Understanding your customers may seem like a no-brainer, but conversations with company leaders across various industries the past five years have demonstrated to me just how difficult this can be in practice.
Jan Pedersen: CircuitData Enhances Current Data Formats
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
The Vast Offerings in Laminate Technologies from TUC
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
A Discussion About Everything Under the Sun
From flex circuits to HDI, Industry 4.0, leading market drivers, and materials—this wide-ranging discussion with Sunshine Global Circuits CTO David Aldape highlights the latest and future developments, challenges, and opportunities in the PCB manufacturing industry.
Julie Ellis: TTM’s Interface Between Designer and Fabricator
As a field application engineer for TTM, Julie Ellis sees the problems that can occur between circuit board designers and manufacturers. Barry Matties spoke with Julie at the AltiumLive event in Munich about the age-old problem of throwing designs “over the wall,” the trend towards HDI, and what advice she would give new designers.
South African Electronics Industry Going Strong
EDA Technologies is a South African company that offers PCB design engineering services, mainly for the domestic electronics market, which makes up a surprising 12.5% of South Africa’s GDP. Barry Matties recently spoke to founder Nechan Naicker about the benefits of outsourcing to South Africa, the market segments they service there, and any advice he had to offer from his 20+ years in the industry.
Weiner’s World—March 2018
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates
Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
Catching up with ACT-USA President Jack Gemmell
ACT-USA is one of the best value-added PCB distributors in the country today. Focused on providing their North American customers with boards as well as heavy copper boards they have steadily broadened their vendor base since their inception in 1994.
Institute of Circuit Technology Meriden Seminar, 2018
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.
Bridging Knowledge and Understanding of Thermal Management Materials
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
A Plug-in that Connects CAD Software to 3D Printer
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.
Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.
EIPC’s Winter Conference in Lyon, France: Day 2 Review
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!
Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!
Who Really Owns the PCB Layout? Part 2
In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.
Aismalibar on Laminates, Following the Market, and More
At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.
Rogers Continues Expansion into High-Speed Digital Materials
Mahyar Vahabzadeh discusses a paper presented by his colleague Dr. Allen Horn at DesignCon. He also explains some of the different characteristics Rogers has discovered as they move from RF into high-speed digital materials.
Solder Limits: Updates for the Age of Surface Mount
Solder limits are one of the fundamental parameters used when evaluating the PCB, solder resists, and metal-clad base materials for safety under the UL Recognition programme.
Staying Ahead of Market Trends Through Education
ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.
Riding the Tsunami of Success in Asia
Since Phil Carmichael has overseen IPC Asia, the program and its membership have grown substantially, and with good reason. Phil met with Barry Matties at HKPCA to discuss how IPC offerings such as the QML program and helping suppliers become CSR compliant has allowed IPC to become a vital resource for suppliers in Asia.
Cicor’s Approach to Miniaturization: Cost of Function, and More
Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.
In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
The Benefits of Coming Together to Form a Global Reach
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.
Weiner’s World—December 2017
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
Isola: Evolving with the Market
In this interview from productronica 2017, Isola’s Karl Stollenwerk discusses the decline of the laminate market in Europe over the past 17 years, current demands on raw materials, and Isola’s new strategy to remain competitive.
Consulting in the Electronics Industry: Meet Francesca Stern
One of the best things about productronica was meeting people who I have corresponded with and those whose articles or presentations I have read or seen but have never actually had a chance to chat with. Francesca Stern is one such person, and it was a true pleasure to sit down and chat with her in the EIPC booth.
AGFA: From Film to Inkjet Solder Mask
The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.
Institute of Circuit Technology Harrogate Seminar 2017
A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.
Full-Service Plating at Hofstetter
While strolling the aisles at productronica, I happened upon the booth of Hofstetter Plating. I was not familiar with this PCB company so I stopped to chat. It turns out they aren’t exactly a PCB fabricator, but provide a comprehensive plating service in Europe and occasionally beyond that, offering several exotic and unique plating processes.
Pluritec Wants to Remove Human Factor from Solder Mask
Solder mask remains a relatively hands-on task, which can result in human error. But equipment manufacturer Pluritec wants to change that. At PCB West, I spoke with Pluritec Vice President of Sales Lino Sousa about the company’s new spray technology that can turn solder mask application into what is essentially a push-button operation.
HDI: Today, Tomorrow and the Future
For the November issue of The PCB Magazine, our editorial team interviewed some of the top HDI experts in the PCB supply chain. Joining us on the conference call were Steve Bird, PCB/flex technology manager at Finisar, and Tony Torres of APCT.
Cannonballs, eBooks, and Signal Integrity
I-Connect007 editors Andy Shaughnessy and Pete Starkey recently met with Polar Instruments Managing Director Martyn Gaudion at productronica. They discussed the success of "The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs," the ongoing challenge of facilitating communication between designers and fabricators, and the influence of chemical bond-enhancement processes on insertion loss.
Zuken Teams With Nano Dimension for 3D Printing Design Flow
At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.
Walt Custer’s Annual Update from productronica 2017
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.
Video from productronica 2017: Electra Polymers Updates on the Latest Developments in DI Soldermask
From the show floor at productronica 2017, Electra Polymers' sales manager Ashley Steers discusses the state of the art in soldermask for direct imaging. Sales and marketing director Shaun Tibbals comments on developments in ink-jet soldermask, and opportunities in wafer-level packaging.
Video from productronica 2017: Rogers Discusses Trends Driving Growth
Dirk Lefelon, European sales manager for Rogers Corporation, discusses his group’s final 2017 results. He also explains what the new year will bring, including increased investment in capacity for the European market, especially for the automotive segment.
AltiumLive Summit—Munich, Germany, Part 2
Pete Starkey continues with his review of the AltiumLive PCB Design Summit held recently in Munich, Germany. The second day commenced with a new product launch. “Working together is hard” it read on the screen. Statistics indicated that 33% of new products were late getting to market, of which 28% were late due to insufficient collaboration, and up to 50% of potential revenue could be lost through being late to market. Then the screen read “NEXUS makes it easy!”
Groundbreaking Developments at liloTree
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.
AltiumLive Summit—Munich, Germany, Part 1
Altium held a very successful AltiumLive PCB Design Summit in San Diego, California at the beginning of October for the benefit of their North American design community, and followed it three weeks later with a counterpart European event in Munich. And what an eye-opener it proved to be—literally hundreds of delegates, a superbly organised and managed programme, billed as a completely immersive two-day interactive design experience on a theme of learning, connecting and getting inspired.
Catching up with…Brigitflex
Today, Brigitflex is building unique custom-made boards for companies all over the world, from large defense and aerospace companies to small incubator companies inventing new products. They have become well-known as the shop to go to when nobody else can solve your problems.
Final Finishes: Taking Gold Thickness into Account
Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.
Polar Instruments’ Martyn Gaudion Discusses Tools and Books
Polar Instruments has pretty been busy lately. In the last year, Managing Director Martyn Gaudion has written two books for I-Connect007, and the company has been working to upgrade its tools, especially library functionality. I met with Martyn at PCB West. We discussed Polar’s newest tool updates, Martyn’s new side job as an author of technical books, and the continuing growth of the EDA segment, including among young people.
Strategies for Developing Copper Plating Systems
I-Connect007's Patty Goldman met with Dr. Albert Angstenberger, global technology manager for metallization with MacDermid Enthone Electronics Solutions, while at SMTA International. He presented a most interesting paper on copper pillar plating systems that we hope to publish in The PCB Magazine sometime in the future.
Update on IPC’s Validation Services and Hints of What’s to Come
SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.
Institute of Circuit Technology Hayling Island Seminar 2017
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.
Ventec Shares Their Insights on the Laminate Market, Part II
The discussion on laminates and markets with Ventec’s Mark Goodwin continues as he talks about the importance of service, where Ventec is headed, and offers some advice on partnering with your supplier.
Ventec Shares Their Insights on the Laminate Market, Part I
I-Connect007’s Barry Matties sat down with the COO of Ventec USA/Europe, Mark Goodwin, to discuss the laminate market as a whole, the market segments behind that growth, and how Ventec has positioned itself in the thermal management space.
'Can Do' in CAM Outsourcing: CAM Engineering—Fast Turn-Around
Time-to-market has been the mantra for every successful technology company. The best among them have strong and integrated supply chains that march to the drum of the OEMs and EMS providers that bring that technology to market. A big part of that success, especially in North America and Europe, is the ability for PCB manufacturers to turn around complex PCBs very quickly. The hallmark of PCB production in these higher-tech, higher-cost regions is flexibility and responsiveness.
Whose Fault is That Bad Board?
Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”
High-Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors.
Weiner’s World—August 2017
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
Laser Patterning & Metallization to Reduce Process Steps for PCB Manufacturing
This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.
IMPACT Interview: Joe O’Neil, OAA Ventures
At the recent IMPACT Washington D.C. 2017, I-Connect007 Managing Editor Patty Goldman caught up with Joe O’Neil of OAA Ventures to talk about the event. As a veteran of many IMPACT meetings, his was a good perspective of the event.
Victory Giant Technology: The Qualified Forerunner of PCB Smart Factories
The topic of the July issue of PCB007’s China Online Magazine is “Automatic PCB Factories,” focusing on the pressures of cost, delivery time and process, and the irreversible trend toward automated PCB factories. Centering on this theme, we interviewed Andy Zhou, COO of Victory Giant Technology (HuiZhou) Co. Ltd., the first domestic PCB manufacturer who carries out large-scale implementation of intellectualization throughout the factory.
The Speed of Nouya: Interview with Bao Xinyang of Shanghai Nanya
The theme of the June issue of PCB007 China Magazine is "High-Speed Materials." As is becoming more widely understood, domestic material supply is the only way for China’s high-frequency, high-speed circuit board industry to grow.
A Conversation with New Isola Chief Revenue Officer Michael White
In a recent conference call with Isola’s new Chief Revenue Officer Michael White, I-Connect007 Publisher Barry Matties, and Managing Editor Patty Goldman gained a deeper understanding of the internal reorganization happening right now with Isola and Mike’s plans for Isola’s marketing team.
Review of the 2017 IPC Reliability Forum
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
A Deep Look Into Embedded Technology
In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.
Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.
Weiner’s World – June 2017
On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.
Embedding Components, Part 1
The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure.
The Significance of the PCB in the Value Chain of the European EMS Industry
At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.
A Brief Tutorial on Embedded Capacitors
Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable.
A Twist on Printed Electronics: Printing on 3D Shapes
Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
14th Electronic Circuits World Convention
The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Walt Custer’s Market Report
At the recent EIPC Conference, Walt Custer delivered his annual report detailing the trends he’s been seeing in the electronics industry for 2016 and into the first quarter of 2017. Barry Matties sat down with Walt to discuss his findings, including his forecast for the upcoming year. Also discussed are Walt’s prognosis for the market segments with the most promise and those that cause him concern.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
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